Abstract: An improved integrated circuit device includes a lead frame having a pad and having a plurality of lead members extending away from a location adjacent to the pad. The lead frame is blanked from a metal laminate which is formed by pressure bonding a layer of copper to each of two opposite sides of a layer of high chromium-low nickel stainless steel and which is annealed and then provided with a selected degree of work-hardening prior to blanking. The blanked lead frame surfaces are plated with an inner nickel plating and with an outer silverplating. An integrated circuit unit is mounted on the lead frame pad and terminals of the unit are connected to selected lead members. The pad, unit and portions of the lead members are encapsulated in a non-conductive organic material to permit ends of the lead members to extend from the encapsulation. The device displays an improved combination of technical properties in a low cost structure.