Abstract: Plasticizer migration-resistant, UV-curable hotmelt adhesive for graphics films and labels made of plasticized PVC Described here is a UV-curable hotmelt adhesive largely resistant to plasticizer migration and comprising a UV-crosslinkable poly(meth)acrylate formed from methyl acrylate, C4-18 alkyl (meth)acrylate, monomer with acid groups, copolymerized photoinitiator and optionally further monomers. The hotmelt adhesive further comprises an aliphatic polyester polymer. The use of the hotmelt adhesive on graphics films and self-adhesive labels made of plasticized PVC is also described.

Abstract: A removeable band for confining a stack of cutlery pieces. The band can include a body having a first surface and a second surface that oppose one another, the body being an elongated strip of fiber-based material. A coating can be disposed on at least a portion of the first surface of the body, and an adhesive section can be disposed on at least a portion of the coating. The adhesive section can be configured to adhere to the second surface of the body when a first end and a second end of the body at least partially overlap to form a continuous band.

Abstract: The present invention provides an adhesive resin composition that has excellent adhesiveness and durability, a method for bonding adherends, and an adhesive resin film. More specifically, the present invention relates to an adhesive resin composition containing more than 50 parts by mass and 99.5 parts by mass or less in a solid content of an acid-modified polyolefin resin having a melting point of 50 to 100° C., 0.

Abstract: Pressure-sensitive adhesive compositions and articles that include a layer of the pressure-sensitive adhesive compositions are provided. The pressure-sensitive adhesive compositions are particularly well suited for use with substrates that have been considered to have difficult to bond to surfaces such as those routinely encountered in the automotive industry. For example, the pressure-sensitive adhesive can be adhered to clear coat compositions, painted surfaces, and various polymeric materials having low energy surfaces (e.g., surfaces having a surface energy no greater than 35 dynes per centimeter).

Abstract: The invention relates to an adhesive tape, comprising at least one layer of a first, heat-curable adhesive material and, on one of the surfaces of the heat-curable adhesive material layer, a layer of a second, pressure-sensitive adhesive material, characterized in that the second, pressure-sensitive adhesive material is based on one or more unvulcanized rubbers having a saturated carbon chain of the polymethylene type.

Abstract: Polymer composite photonic crystal materials are disclosed as coatings and topcoats which have high reflection (>30%) in a specific range of the electromagnetic spectrum, such as ultraviolet (<400 nm), visible (Vis, 400 nm-700 nm), or near-infrared radiation range (NIR, 700-2000 nm), and relatively low reflection (<20% reflection) in a second, different range of the electromagnetic spectrum. Surprisingly, it was found that through a formulation and additives approach, the optical properties of polymer composite photonic crystal films can be selectively modified from a variety of different coating methods, including spray deposition.

Abstract: A temporary protective film comprising a support film and an adhesive layer provided on one surface or both surfaces of the support film is disclosed. The coefficient of linear expansion at 30° C. to 200° C. of the temporary protective film may be greater than or equal to 16 ppm/° C. and less than or equal to 20 ppm/° C. in at least one in-plane direction of the temporary protective film.

Abstract: A hot-melt adhesive resin film includes a first adhesive layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second adhesive layer, which are laminated in this order, in which the first adhesive layer and the second adhesive layer include an acid-modified polyolefin resin.

Abstract: A semiconductor-processing tape, for use in dividing an adhesive layer along semiconductor chips by expansion, having a base material film, a removable adhesive layer, and an adhesive layer, in this order, wherein the base material film has the stress values in MD and TD at the time of 5%-elongation of 5 MPa or, more, the tensile strength values in MD and TD at the time of 5%-elongation of 10 to 30 N/25 mm, and the thickness of from 70 to 150 ?m, and wherein the adhesive layer has a thickness of 40 ?m or more and the storage elastic modulus at 25° C. of 2000 MPa or less.

Abstract: There is provided an optical laminate with pressure-sensitive adhesive layers on both surfaces, which is suppressed damage from occurring to a low-refractive index layer in vacuum lamination while maintaining excellent characteristics of the low-refractive index layer. An optical laminate with pressure-sensitive adhesive layers on both surfaces according to an embodiment of the present invention comprises: a substrate; a low-retractive index layer formed on the substrate; a first pressure-sensitive adhesive layer arranged so as to be adjacent to the low-refractive index layer; and a second pressure-sensitive adhesive layer serving as one outermost layer. The low-refractive index layer has a porosity of 50% or more, the first pressure-sensitive adhesive layer has a storage modulus of elasticity of from 1.3×105 (Pa) to 1.0×107 (Pa), and the second pressure-sensitive adhesive layer has a storage modulus of elasticity of 1.0×105 (Pa) or less.

Abstract: A double-sided optically clear adhesive is provided. The double-sided optically clear adhesive includes a first adhesive layer and a second adhesive layer. The first adhesive layer includes a first resin and a first thermal-crosslinking agent. The first resin includes a hydroxyl group. The first thermal-crosslinking agent includes a first group. The second adhesive layer includes a second resin and a second thermal-crosslinking agent. The second resin includes a hydroxyl group. The second thermal-crosslinking agent includes a second group. The ratio of the equivalent number of the first group of the first thermal-crosslinking agent to the equivalent number of the hydroxyl group of the first resin is represented by r1. The ratio of the equivalent number of the second group of the second thermal-crosslinking agent to the equivalent number of the hydroxyl group of the second resin is represented by r2, wherein r1<r2?0.8 and r2?r1?0.025.

Abstract: The present invention relates to a hot-melt adhesive resin film having an excellent adhesive force and durability to various adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first surface layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second surface layer, which are laminated in this order, in which the first intermediate layer and the second intermediate layer include a resin which is obtained by modifying a copolymer of propylene and 1-butene with maleic acid, and a production method thereof.

Abstract: The present invention relates to an adhesive composition and a protective film including an adhesive layer formed by using the same, wherein the adhesive composition includes an acrylic copolymer formed by polymerizing a monomer mixture, the monomer mixture including a monomer represented by [Formula 1], a (meth)acrylic monomer including a carboxy group, a (meth)acrylic monomer including a cross-linkable functional group, and an alkyl(meth)acrylate-based monomer, wherein the acrylic copolymer has a polymerization conversion rate of 99 wt % or higher.

Abstract: A pressure sensitive label and method for preparing same, the pressure sensitive label comprising: (a) a support portion, said support portion including at least a carrier layer; and (b) a transfer portion over said support portion for transfer of the transfer portion from the support portion to an article upon application of pressure to the transfer portion while the transfer portion is in contact with the article, said transfer portion including at least a patterned adhesive layer in confronting relationship with a surface of the carrier layer, wherein the patterned adhesive layer confronts less than substantially the entire surface of the carrier layer.

Abstract: The invention relates to a reinforcement member comprising a heatcurable structural adhesive on a carrier member, wherein the carrier member comprises a fiber-reinforced polyester material. The invention further relates to a method to produce such a reinforcement member and its use.

Abstract: An adhesive composition, an adhesive film comprising the same, a backplate film comprising the adhesive film, and a plastic organic light emitting display comprising the adhesive film are provided. The adhesive composition includes a (meth)acrylate-based resin, and a polymer having a melting temperature (Tm) of 35° C. or higher, wherein the polymer is a copolymer of a monofunctional polysiloxane and two or more types of monomers.

Abstract: A composite dry adhesive includes (a) an adhesive layer comprising a shape memory polymer and (b) a resistive heating layer comprising a shape memory polymer composite on the adhesive layer. The shape memory polymer composite includes conductive particles dispersed in a shape memory polymer matrix, where the conductive particles have a concentration sufficient to form a conductive path through the resistive heating layer.

Abstract: According to an embodiment of the present disclosure, a method of labeling a plurality of products includes coating a pressure sensitive adhesive to a roll of face stock, the roll of face stock configured to be converted to a plurality of individual labels aligned in a single lane; singulating an individual label from the roll of face stock; and applying the individual label to a product of the plurality of products, wherein the coating, singulating and applying are conducted sequentially in a single continuous operation with a single continuous web of material.

Abstract: Adhesive damping systems are described. A damping system for reducing the effects on a substrate caused by a disruption in the substrate environment includes an adhesive having a plurality of three-dimensional particles dispersed therein. The particles are configured to provide a controlled response to an applied force field. The system further includes a sensor which measures an amplitude and frequency spectrum of the disruption. In a use configuration, the sensor determines the amplitude and frequency spectrum of the disruption received by the substrate; and the applied force field is dependent on the amplitude and frequency spectrum of the disruption.

Abstract: A mask-integrated surface protective tape, containing: a substrate film; a temporary-adhesive layer provided on the substrate film; and a mask material layer provided on the temporary-adhesive layer; wherein the mask material layer and the temporary-adhesive layer each contain a (meth)acrylic copolymer; and wherein the mask-integrated surface protective tape is used for a method of producing a semiconductor chip utilizing a plasma-dicing.