Patents Examined by Azm A Parvez
  • Patent number: 10854354
    Abstract: A method and method of using a cable that includes a cable core. The cable core has an inner armor wire layer disposed thereabout. The inner armor wire layer has an outer armor wire layer disposed thereabout. The inner armor wire layer and outer armor wire layer have torque removed therefrom during manufacturing.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: December 1, 2020
    Inventors: Joseph Varkey, Sheng Chang, Burcu Unal Altintas, Qingdi Huang, Jeffrey Joseph Kamps, Paul Wanjau
  • Patent number: 10850345
    Abstract: Provided is a shaping device for a roller electrode for seam welding that prepares shapes for a first roller electrode and a second roller electrode attached to an arm of a robot. This shaping device is provided independently from the robot and disposed within rotational range of the arm, and is provided with a first roller and a second roller that are disposed on a line orthogonal to a line joining the rotational centers of the first and second roller electrodes and are in contact with the outer circumferences of the first and second roller electrodes.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: December 1, 2020
    Assignee: Honda Motor Co., Ltd.
    Inventors: Kazuhiko Yamaashi, Tetsuya Kodama, Noriaki Shigematsu, Hitoshi Yoshimichi
  • Patent number: 10847490
    Abstract: An apparatus includes an alignment module configured to align a first wafer and a second wafer based on alignment markers on the first wafer and corresponding alignment markers on the second wafer. The apparatus further includes a flag placement module configured to insert a plurality of flags between the first wafer and the second wafer, a flag-out mechanism configured to simultaneously move the plurality of flags to a flag-out position, and a controller configured to determine whether the wafers remain aligned within an alignment tolerance based on an amount of time for each flag of the plurality of flags to reach the flag-out position.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: November 24, 2020
    Inventors: Yun-Tai Shih, Kuan-Ming Pan, Jeng-Hao Lin, I-Shi Wang, Jui-Mu Cho, Ching-Hou Su, Chyi-Tsong Ni, Wun-Kai Tsai
  • Patent number: 10849258
    Abstract: Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: November 24, 2020
    Assignee: NTRIUM INC.
    Inventors: Se Young Jeong, Ki Su Joo, Ju Young Lee, Jeong Woo Hwang, Jin Ho Yoon
  • Patent number: 10834859
    Abstract: Provided is a component mounting device including: an XY robot, a Z-axis slider attached to an X-axis slider of the XY robot so as to be movable in the Z-axis direction, a head loaded on the Z-axis slider, and a nozzle attached to head 30 so as to be movable in the Z-axis direction. With the component mounting device, a component supplied from a component supply unit is picked up by the nozzle, transported to a specified position on a board, and mounted. A flexible section with an external appearance with a U shape that is expandable and contractible in the X-axis direction and the Z-axis direction is arranged to the rear of a Y-axis slider. A portion of an X-axis wiring tube and a portion of a Z-axis wiring tube are bundled together in the flexible section.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: November 10, 2020
    Inventors: Hidetoshi Ito, Mizuho Yamamoto
  • Patent number: 10830966
    Abstract: An optical connector manufacturing method includes inserting a protrusion of a fixing jig into a positioning hole in an end face of a cladding of an optical fiber and restraining rotation of the optical fiber, the positioning hole extending in an optical axis direction, the optical fiber being inserted in a through hole in a connector ferrule and protruding from an end face of the connector ferrule; and securing the optical fiber to the connector ferrule, with the protrusion of the fixing jig inserted in the positioning hole.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: November 10, 2020
    Inventors: Naoki Matsushita, Takuji Nagashima, Tetsu Morishima
  • Patent number: 10827661
    Abstract: The present invention relates to an inspection apparatus and method, and a system and a method for mounting components including the same. In the system for mounting components according to the present invention, solder paste inspection equipment receives mounting tolerance information from component mounting equipment, generates warp information of a flexible array board by measuring the flexible array board, generates mount-impossible information on a region where mounting of components is impossible by comparing the mounting tolerance information and the warp information, and transmits the mount-impossible information to the component mounting equipment. The component mounting equipment mounts components on remaining regions except for the region where mounting of components is impossible based on the mount-impossible information.
    Type: Grant
    Filed: August 10, 2015
    Date of Patent: November 3, 2020
    Inventor: Woo Young Lim
  • Patent number: 10804776
    Abstract: An injection molding device includes: a lower die that supports a rotor core; an intermediate die including a magnetizing mechanism; and an upper die including an injection die having a gate formed therein through which a molten bonded-magnet material supplied from a supply source is injected into a magnet insertion hole in the rotor core. The injection die has a cylindrical protruding portion at an end surface of which the gate is open. In the protruding portion, a magnetic-flux applying member containing ferromagnetic material is embedded with its side surface exposed at an outer peripheral surface of the protruding portion. The magnetizing mechanism is formed in an annular shape that can accommodate, inside its inner periphery, the rotor core and a distal end portion of the protruding portion by disposing yokes and permanent magnets alternately in the circumferential direction. Magnetic-path surfaces of the yokes radially face the side surface.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: October 13, 2020
    Inventors: Koji Tachi, Hiroshi Yoshikawa, Naotake Kanda, Taiki Takeuchi, Shohei Ogi
  • Patent number: 10797571
    Abstract: A coil manufacturing device for manufacturing a coil by rotating a winding core and winding a wire around the rotating winding core, the coil manufacturing device includes a recess formed in the winding core, the recess being configured to suspend the wire wound around the winding core in the recess; and a wire bundling device configured to bundle the wire suspended in the recess.
    Type: Grant
    Filed: August 5, 2015
    Date of Patent: October 6, 2020
    Assignee: NITTOKU CO., LTD.
    Inventors: Takayuki Sato, Takayuki Kurosawa
  • Patent number: 10784129
    Abstract: A mounting device in which a loading distance separating adjacent characteristic components are lined up side by side is shorter than separation distance between suction nozzle and mark camera, processing to image characteristic component by mark camera and recognize the position of characteristic component is performed consecutively or in one batch. With the mounting device, because mounting head is moved a loading distance that is shorter than the separation distance between suction nozzle and mark camera and image processing is performed consecutively or in one batch, the movement distance of mounting head is shorter.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: September 22, 2020
    Inventors: Kohei Sugihara, Hidenori Goto
  • Patent number: 10775855
    Abstract: A circuit card assembly release tool is disclosed. The tool includes a body and two flanges extending outward from the body at an end of the body. The tool is structured and arranged such that the two flanges are adapted to simultaneously apply a force to two ejectors that are pivotally connected to a seated circuit card assembly when the tool is urged in a direction relative to the seated circuit card assembly.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: September 15, 2020
    Assignee: Lockheed Martin Corporation
    Inventor: Steve J. V. Pacquing
  • Patent number: 10776553
    Abstract: The subject technology provides a method and apparatus for performing dual track routing. A pair of signal traces is routed in between two rows of contacts and at least one of the signal traces is modified to satisfy a routing restriction. The modification of the signal trace includes three trace segments that deviate the signal trace away from the source of the routing restriction.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: September 15, 2020
    Inventors: Lin Shen, Yongming Xiong, Shahbaz Mahmood, Maurilio De Nicolo
  • Patent number: 10779413
    Abstract: A method for embedding a component in a printed circuit board or a printed circuit board intermediate product, wherein the printed circuit board or the printed circuit board intermediate product comprises at least one insulating layer made of a prepreg material, and the component is fixed by the resin of the prepreg material, is characterized by the following steps: providing a combination of the layers of the printed circuit board, or of the printed circuit board intermediate product, wherein this combination includes at least one curable prepreg material; creating a clearance in the combination for accommodating the component to be embedded; covering at least the region of the clearance with a first temporary carrier layer on a first side of the combination; positioning the component to be embedded in the clearance by way of the first temporary carrier layer; covering at least the region of the clearance on the second side of the combination with a second temporary carrier layer; compressing the combinatio
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: September 15, 2020
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Timo Schwarz, Andreas Zluc, Gregor Langer, Johannes Stahr
  • Patent number: 10764992
    Abstract: A circuit board with anti-EMI proofing for each component on the board includes a first outer wiring layer, electronic components mounted on the first outer wiring layer, and at least one electromagnetic shielding unit. Each electromagnetic shielding unit has a shielding layer and conductive posts formed on the shielding layer, the shielding layer and conductive posts defining a receiving space to house and shield one electronic component. An adhesive layer formed on the first outer wiring layer bonds each electromagnetic shielding unit to the first outer wiring layer.
    Type: Grant
    Filed: July 26, 2019
    Date of Patent: September 1, 2020
    Assignees: Avary Holding (Shenzhen) Co., Limited, QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
    Inventors: Yong-Chao Wei, Lin-Jie Gao, Han-Pei Huang
  • Patent number: 10756410
    Abstract: A filter is provided and includes potting material formed into a body defining a through-hole. The body includes first and second opposing faces and a sidewall extending between the first and second opposing faces. The sidewall is formed to define first and second openings at opposite ends of the through-hole, first angles at an interface between the sidewall and the first face and second angles, which complement the first angles, at an interface between the sidewall and the second face.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: August 25, 2020
    Inventors: David W. Abraham, Antonio D. Corcoles Gonzalez, James R. Rozen
  • Patent number: 10757816
    Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: August 25, 2020
    Assignee: VLT, Inc.
    Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
  • Patent number: 10750643
    Abstract: A method of manufacturing a chassis that cools thermal energy generating components of an information handling system (IHS) includes: forming an enclosure with a chassis that has a base wall for provisioning a thermal energy generating component; forming one or more stiffeners each having one or more air channels formed transversely through for directing air proximate to the base wall; attaching the one or more stiffeners laterally across the base wall; and attaching a planar member that is horizontally on top of the one or more stiffeners for engaging one or more forward compute components on top of the planar member that substantially block air flow above the planar member to the thermal energy generating component. The one or more air channels eliminate thermal shadowing caused by thermal energy generating components provisioned in a rear area of the chassis.
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: August 18, 2020
    Assignee: Dell Products, L.P.
    Inventors: Haesung Kwon, Austin Michael Shelnutt, Walter Carver
  • Patent number: 10743422
    Abstract: A method of embedding a component in a component carrier, wherein the method comprises providing a cured core with a recess on an electrically conductive foil, and mounting the component in the recess on the foil.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: August 11, 2020
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Armin Wiedenhofer
  • Patent number: 10723112
    Abstract: The present invention discloses a method for transferring a thin film from a first substrate to a second substrate comprising the steps of: providing a transfer structure and a thin film provided on a surface of a first substrate, the transfer structure comprising a support layer and a film contact layer, wherein the transfer structure contacts the thin film; removing the first substrate to obtain the transfer structure with the thin film in contact with the film contact layer; contacting the transfer structure obtained with a surface of a second substrate; and removing the film contact layer, thereby transferring the thin film onto the surface of the second substrate.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: July 28, 2020
    Assignee: National University of Singapore
    Inventors: Lay-Lay Chua, Peter Ho, Rui-Qi Png, Fong Yu Kam, Jie Song, Loke-Yuen Wong, Jing-Mei Zhuo, Kian Ping Loh, Geok Kieng Lim
  • Patent number: 10729012
    Abstract: Methods, systems, and devices for buried lines and related fabrication techniques are described. An electronic device (e.g., an integrated circuit) may include multiple buried lines at multiple layers of a stack. For example, a first layer of the stack may include multiple buried lines formed based on a pattern of vias formed at an upper layer of the stack. The pattern of vias may be formed in a wide variety of spatial configurations, and may allow for conductive material to be deposited at a buried target layer. In some cases, buried lines may be formed at multiple layers of the stack concurrently.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: July 28, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Hernan A. Castro, Stephen W. Russell, Stephen H. Tang