Abstract: An grounding construction of a multilayer printed circuit board includes a metal plate connected to a chassis and provided with at least one upright tab, and two sheets of printed circuit boards for sandwiching the metal plate therebetween. One of the printed circuit boards is formed therein a through hole for passing the upright tab therethrough so as to protrude it from the outer surface thereof. The upright tab is fixedly connected by a solder to a conduction pattern formed around the through hole on the outer surface of the one of the printed circuit boards.