Patents Examined by Belur V Keshhavan
  • Multilayered copper structure for improving adhesion property
    Patent number: 6777331
    Abstract: A multilayered copper structure has been provided for improving the adhesion of copper to a diffusion barrier material, such as TiN, in an integrated circuit substrate. The multilayered copper structure comprises a thin high-resistive copper layer to provide improved adhesion to the underlying diffusion barrier layer, and a low-resistive copper layer to carry the electrical current with minimum electrical resistance. The invention also provides a method to form the multilayered copper structure.
    Type: Grant
    Filed: August 23, 2002
    Date of Patent: August 17, 2004
    Assignee: Simplus Systems Corporation
    Inventor: Tue Nguyen