Patents Examined by Benny Lee
  • Patent number: 10186741
    Abstract: A radio-frequency (RF) component includes a first portion of a waveguide configured to transmit an electro-magnetic (EM) wave. The RF component includes a waveguide coupling configured to receive the EM wave from the first portion of the waveguide and transmit the EM wave to an external RF component. The waveguide coupling includes a waveguide plate having a second portion of the first waveguide formed therein; a waveguide spacer having a third portion of the first waveguide formed therein; and a conductive spring circumferentially disposed around the first waveguide in between the waveguide plate and the waveguide spacer.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: January 22, 2019
    Assignee: ZTE CORPORATION
    Inventors: Edwin Nealis, Ying Shen, Zhiping Feng
  • Patent number: 10187032
    Abstract: Systems and methods for adjusting impedances or power or a combination thereof across multiple plasma processing stations are described. One of the systems includes a first radio frequency (RF) generator that generates a first RF signal having a first frequency, a second RF generator that generates a second RF signal having a second frequency, and a first matching network coupled to the first RF generator to receive the first RF signal. The first impedance matching network outputs a first modified RF signal upon receiving the first RF signal. The system further includes a second matching network coupled to the second RF generator to receive the second RF signal. The second matching network outputs a second modified RF signal upon receiving the second RF signal. The system further includes a combiner and distributor coupled to an output of the first matching network and an output of the second matching network.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: January 22, 2019
    Assignee: Lam Research Corporation
    Inventors: Sunil Kapoor, George Thomas, Yaswanth Rangineni, Edward Augustyniak
  • Patent number: 10181628
    Abstract: Embodiments herein describe a high-speed communication channel in a PCB that includes a dielectric waveguide sandwiched between two ground layers. The dielectric waveguide includes a core and a cladding where the material of the core has a higher dielectric constant than the material of the cladding. Thus, electromagnetic signals propagating in the core are internally reflected at the interface between the core and cladding such that the electromagnetic signals are primary contained in the core.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: January 15, 2019
    Assignee: International Business Machines Corporation
    Inventors: Daniel M. Dreps, Jose A. Hejase, Joshua C. Myers, Junyan Tang
  • Patent number: 10177430
    Abstract: An apparatus and a method for electromagnetic signal transition, comprising the steps of receiving an electromagnetic signal having a first physical characteristic arranged to be compatible for the electromagnetic signal to be transmitted on a transmission structure, and transmitting the electromagnetic signal to a substrate integrated waveguide, wherein during the transmission of the electromagnetic signal to the substrate integrated waveguide, the first physical characteristic is converted to a second physical characteristic arranged to be compatible for the electromagnetic signal to be transmitted on the substrate integrated waveguide.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: January 8, 2019
    Assignee: CITY UNIVERSITY OF HONG KONG
    Inventors: Quan Xue, Peng Wu
  • Patent number: 10172231
    Abstract: Systems, methods, and apparatus for reducing crossover coupling of two or more RF signals are described. In one case, a crossover structure is described where RF signals are routed through coplanar waveguides having a specific characteristic impedance and crossing at a central point of the crossover structure by way of a bridge. A ground shield having a geometry adapted to reduce the crossover coupling while minimally affecting capacitive coupling between the RF signals and the ground shield is introduced in-between a region comprising the central point. Further described is a multi-port rotary RF switch fitted with the crossover structure which allows substantially balanced electrical performance across all the operational states of the rotary RF switch at RF signal frequencies up to 40 GHz and beyond.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: January 1, 2019
    Assignee: pSemi Corporation
    Inventors: Gregory Louis Horvath, Peter Bacon
  • Patent number: 10160645
    Abstract: Microwave AC conductivity may be improved or tuned in a material, for example, a dielectric or semiconductor material, by manipulating domain wall morphology in the material. Domain walls may be created, erased or reconfigured to control the AC conductivity, for example, for crafting circuit elements. The density and placement of domain walls may increase or decrease the AC conductivity and may control AC conduction pathways through the material. An electric potential applied to the material's surface may create a desired pattern of domain walls to meet desired AC conductivity criteria. Incline angle of the domain walls may be modified relative to a crystallographic axis of the material to temporarily or permanently modify or gate AC conductivity of the material. For example, the AC conductivity of the material may be gated by domain wall incline angle to increase, decrease or throttle current flowing through the material for an electronic circuit element.
    Type: Grant
    Filed: October 4, 2016
    Date of Patent: December 25, 2018
    Assignees: UT-BATTELLE, LLC, UNIVERSITY OF TENNESSEE RESEARCH FOUNDATION
    Inventors: Petro Maksymovych, Alexander Tselev, Sergei V. Kalinin
  • Patent number: 10164312
    Abstract: A wiring board includes: a first substrate that includes signal wiring; a second substrate that includes a conductor with an area larger than an area of the signal wiring, and projection formed on a face of the conductor and constituted of an insulator with a pattern corresponding to a pattern of the signal wiring, the second substrate being arranged so that the face of the conductor on which the projection is formed faces the signal wiring; and an intermediate layer that is arranged between the signal wiring and the conductor and includes a fibrous member.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: December 25, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Tetsuro Yamada, Akiko Matsui, Mitsuhiko Sugane, Takahide Mukoyama, Yoshiyuki Hiroshima, Kohei Choraku
  • Patent number: 10164307
    Abstract: According to one embodiment, a waveguide bend includes a metal block. The metal block includes a first waveguide, a second waveguide and a third waveguide. The first waveguide, the second waveguide and the third waveguide are integrally formed. The second waveguide includes a bend at which a propagation direction of a radio wave is changed. An opening size of the second waveguide is smaller than an opening size of the first waveguide. The third waveguide is provided between the first waveguide and the second waveguide. An opening size of the third waveguide is smaller than the opening size of the first waveguide and is larger than the opening size of the second waveguide.
    Type: Grant
    Filed: July 19, 2016
    Date of Patent: December 25, 2018
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Koichiro Gomi, Tooru Kijima
  • Patent number: 10164611
    Abstract: A wireless sensor includes a radio frequency (RF) receiving circuit including a plurality of components, where impedances of the plurality of components establish a resonant frequency of the RF receiving circuit. The wireless sensor further includes a sensing element that when exposed to an environmental condition, affects the resonant frequency of the RF receiving circuit. The wireless sensor further includes a processing module that is operable to determine a first value for an adjustable element of a plurality of elements for a known environmental condition based on the resonant frequency and the carrier frequency, determine a second value for the adjustable element for an unknown environmental condition based on the resonant frequency and the carrier frequency, and determine a difference between the first and second values that corresponds to a change between the known environmental condition and the unknown environmental condition.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: December 25, 2018
    Assignee: RFMicron, Inc.
    Inventor: Shahriar Rokhsaz
  • Patent number: 10164598
    Abstract: A power filter arrangement includes a toroidal package having a toroid and a resistive element. The resistive element is disposed about an outer circumference of the toroid and is joined to the toroid. The resistive element is wound about the toroid. The resistive element is provided with a first resistive pattern having an even number of total turns.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: December 25, 2018
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Huazhen Chai, Eric A. Carter, John Huss
  • Patent number: 10158159
    Abstract: To provide a transmission-line conversion structure for a millimeter-wave band capable of being easily manufactured with a small size without easily causing non-uniformity in characteristics in a wide band. A transmission-line conversion structure for a millimeter-wave band that connects a microstrip line (10), which includes a main conductor (12) formed on one surface of a dielectric substrate (11) and a ground conductor (13) formed on the other surface thereof, with a waveguide (20) has a waveguide structure in which a transmission line (31) having a predetermined length is formed so as to be surrounded by metal walls (32). The transmission line is filled with a dielectric material having a relative permittivity of greater than 1. The transmission-line conversion structure allows electronic waves of a millimeter-wave band in a longitudinal direction of the main conductor.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: December 18, 2018
    Assignee: ANRITSU CORPORATION
    Inventor: Takashi Kawamura
  • Patent number: 10158344
    Abstract: A single-chip tunable bandpass filter is provided having a bandpass filter circuit with all tuning components for the bandpass filter circuit formed on the single-chip to provide a programmed center frequency for the tunable bandpass filter. The bandpass filter circuit may include, but is not limited to, a plurality of serially coupled singe stage biquad filter circuits coupled to an input formed on the single-chip and configured to provide a bandpass filtered output signal to an output formed on the single-chip. The bandpass filtered output may be provided by an output buffer formed on the single-chip. The single-chip includes at least one tuning input to receive data for tuning stored in a data register formed on the single-chip. The data register provides control bits to the tuning components that include a programmable resistor responsive to the control bits to vary the programmable resistor to adjust programmed center frequency.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: December 18, 2018
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Emilio A. Sovero, Jongchan Kang, Mohiuddin Ahmed, James Chingwei Li, Cynthia D. Baringer, Yen-Cheng Kuan, Timothy J. Talty
  • Patent number: 10158156
    Abstract: A microwave transmission line having a coplanar waveguide and a pair of conductive members, each one of the pair of conductive members having a proximal end disposed on a portion of a corresponding one of a pair of ground plane conductors of the coplanar waveguide and a distal end disposed over, and vertically spaced from, a region between a center conductor of the coplanar waveguide and a corresponding one of the pair of ground plane conductors of the coplanar waveguide. The distal ends are laterally separated from each other by a region disposed over the center conductor.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: December 18, 2018
    Assignee: Raytheon Company
    Inventors: Christopher M. Laighton, Edward A. Watters, Keith R. Kessler
  • Patent number: 10158153
    Abstract: Systems and methods are provided for creating higher order microwave bandstop filters with total through-line length of significantly less than one-quarter wavelength at the filter center frequency. The mixed electric and magnetic field coupling bandstop filter topologies provided by embodiments of the present disclosure can be used to reduce the size, weight, and throughline insertion loss of microwave bandstop filters. In an embodiment, if the relative field strengths are intelligently designed for each coupling structure, effective phase offsets can be produced between resonators along the through line. These phase offsets can be used to absorb some or all of the length of the ?/4 inverters between resonators.
    Type: Grant
    Filed: January 1, 2018
    Date of Patent: December 18, 2018
    Assignee: The United States of America, as represented by the Secretary of the Navy
    Inventors: Andrew C. Guyette, Eric J. Naglich
  • Patent number: 10153746
    Abstract: A wiring board with a filter circuit includes an insulating base, a conductor pattern, and a filter circuit. The conductor pattern is provided on the insulating base and defines the filter circuit. The insulating base includes an intermediate member, and first through third end members connected to the intermediate member. A first external connection terminal is provided on the first end member, and is disposed on a first end of the conductor pattern in the signal transmission direction. A second external connection terminal is provided on the second end member, and is disposed on a second end of the conductor pattern in the signal transmission direction. A first ground connection terminal that grounds the filter circuit is provided on the intermediate member. A second ground connection terminal that grounds the filter circuit is provided on the third end member.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: December 11, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takahiro Baba
  • Patent number: 10147992
    Abstract: A via-less crossover for use in broadband microwave/mm-wave circuitry, including: a dielectric substrate; a top layer disposed on one side of the substrate and including a microstrip line with an input and an output, two tapered sections placed around the microstrip line along a co-planar waveguide (CPW) central line, one microstrip portion having an input and which connects to one top layer, rectangular stub disposed adjacent to one of the tapered sections, and another microstrip portion having an output and which connects to another top layer, rectangular stub disposed adjacent to the other of the tapered sections; and a ground layer disposed on an opposite side of the substrate and including a bottom layer CPW central line situated in a central cutout and which connects between a bottom layer, rectangular stub on one side and a bottom layer, rectangular stub on the other side situated in ground cutouts, respectively.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: December 4, 2018
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Kongpop U-Yen, Edward J. Wollack, Marc Castro
  • Patent number: 10141698
    Abstract: A circuit board for a high speed communication jack including a rigid circuit board in the housing having a substrate, a plurality of vias extending through the substrate with each via being configured to accommodate a pin on the housing, a plurality of traces on a middle layer in the substrate, with each trace extending from a corresponding one of the plurality of vias, a first shielding layer on a first side of the middle layer in the substrate, a second shielding layer on a second side of the middle layer in the substrate, and a third shielding layer adjacent to the second shielding layer.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: November 27, 2018
    Assignee: Sentinel Connector Systems, Inc.
    Inventor: Brett D. Robinson
  • Patent number: 10141911
    Abstract: A high-frequency module includes a plurality of filters, a switch that commonly connects a plurality of paths, and a low noise amplifier that amplifies a high-frequency signal input from the plurality of filters with the switch interposed therebetween, wherein paths in which first and second filters are respectively provided among the plurality of paths connect the respective filters and the switch without connecting impedance elements, and each of the first and second filters has an output impedance located in a matching region between a NF matching impedance at which an NF of the low noise amplifier is minimum and a gain matching impedance at which a gain of the low noise amplifier is maximum in its respective pass band thereof on a Smith chart.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: November 27, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Hideki Muto
  • Patent number: 10141623
    Abstract: Embodiments herein describe a high-speed communication channel in a PCB that includes a dielectric waveguide coupled at respective ends to coaxial vias. The dielectric waveguide includes a core and a cladding where the material of the core has a higher dielectric constant than the material of the cladding. Thus, electromagnetic signals propagating in the core are internally reflected at the interface between the core and cladding such that the electromagnetic signals are primary contained in the core. The coaxial vias include a center conductor and an outer conductor (or shield) which extend through one or more layers of the PCB. One of the coaxial vias radiates electromagnetic signals into the dielectric waveguide at a first end of the core while the other coaxial via receives the radiated signals at a second end of the core.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: November 27, 2018
    Assignee: International Business Machines Corporation
    Inventors: Samuel R. Connor, Jose A. Hejase, Joseph Kuczynski, Joshua C. Myers, Junyan Tang
  • Patent number: 10135416
    Abstract: A composite electronic component includes a composite body in which a common mode filter and a multilayer ceramic capacitor array are coupled to each other, the common mode filter including a first body having a common mode choke coil, and the multilayer ceramic capacitor array including a second body in which a plurality of dielectric layers are stacked.
    Type: Grant
    Filed: October 13, 2015
    Date of Patent: November 20, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Sik Chong, Jae Young Park, Jong Young Kim, Woo Jin Choi