Patents Examined by Binh-An Nguyen
  • Patent number: 6070317
    Abstract: A quiet transformer includes a laminated core having each laminate formed as a flat layer from highly grain oriented silicon steel which is fabricated by laser cutting techniques with each layer including five segments in intimate contact with each other via mitered butt lap joints having increased length and asymmetrical angles at opposite ends for reducing the reluctance of the gaps between adjacent lamination segments. The center segment has V joints of different angles on opposite ends. Clamping holes formed in the element of said lamination having the largest cross section at the location in the segment away from said gaps to prevent magnetic flux crowding and increased local flux density. Indexing pins on opposite faces of the segments close and lock in the gaps of the core with each layer being 100% interleaved for producing low joint reluctance and to minimize magnetostrictive forces. The core is pressurized by clamping brackets and bolts connected to opposite ends of the core.
    Type: Grant
    Filed: September 24, 1997
    Date of Patent: June 6, 2000
    Assignee: Espey Mfg. & Electronics Corp.
    Inventors: George M. Allen, Harold R. O'Connor, Seymour Saslow
  • Patent number: 6065204
    Abstract: A system and a method for forming, storing and loading slot cell insulators into slots in a stator core of a dynamoelectric machine. The system includes a forming assembly for forming slot cell insulators and a loading assembly for storing the insulators and loading the insulators into the stator core. The system also includes a transfer mechanism for moving the insulators from the forming assembly into the loading assembly. In the process, these elements cooperate to align end portions of the insulators before they are inserted into the stator core, thereby improving the efficiency of the loading procedure. When the stator core is ready to receive the insulators, the loading assembly simultaneously loads all of the insulators into the stator core.
    Type: Grant
    Filed: June 25, 1998
    Date of Patent: May 23, 2000
    Assignee: Reliance Electric Industrial Company
    Inventor: Hobart DeHart
  • Patent number: 6065207
    Abstract: A composite insulator includes an insulating rod, end fittings crimped to opposite end portions of said insulating rod, and an elastic insulating material molded around the outer periphery of the insulating rod, wherein each of the end fittings has a flange around the outer periphery of an end fitting body on an axially external side thereof, and the elastic insulating material is molded around the outer periphery of the insulating rod and those of the end fitting bodies such that the elastic material extends up to and between the flanges. A process for the production of such a composite insulator is also disclosed.
    Type: Grant
    Filed: December 2, 1997
    Date of Patent: May 23, 2000
    Assignee: NGK Insulators, Ltd.
    Inventors: Shuji Fujii, So Kawamura
  • Patent number: 6062985
    Abstract: A golf play pacing device that is contained in the flag stick itself. The device includes an orientation sensing switch in the flag stick that is activated when the stick moves through an arc of approximately 45.degree., and reactivated when the stick is returned to perpendicular. The orientation switch controls circuitry that measures the time expired since the last reset of the device, and activates an alarm mechanism when that time is expired. The alarm mechanism includes visual alarms for the golfers and alarm capability for third parties. A sequence to monitor the putting time of players on the green can also be activated.
    Type: Grant
    Filed: May 6, 1998
    Date of Patent: May 16, 2000
    Inventor: Kathleen Rege
  • Patent number: 6058603
    Abstract: This invention relates to non-metallic, corrosion-resistant strength systems for underwater power and communications systems and methods for terminating such cables. The strength system comprises two non-metallic strength members; each strength member is comprised of at least one glass strand, and each strand is comprised of a plurality of glass filaments that are bound together with a polymeric material. The first strength member is applied in a helical lay over transmission media which forms the core of the cable, and the second strength member is applied over the lay of the first strength member in a helical lay having a circular direction opposite to the lay of the first strength member. The invention further embraces a method of terminating such cables involving the use of an inner termination cone, an adhesive used to secure the strength members onto the inner termination cone, and an outer termination cone which is secured over the inner termination cone and adjoining strength members.
    Type: Grant
    Filed: October 14, 1998
    Date of Patent: May 9, 2000
    Assignee: Lucent Technologies Inc.
    Inventor: William C. Reed
  • Patent number: 6058604
    Abstract: A cable constructed with insulation displacement connectors produces cables which connect data storage devices to a host system. The cable allows automatic address selection of data storage devices depending on the presence or absence of a CSEL terminal pin on a corresponding connector and the location of a data storage device along the cable. Address selection by connector configuration simplifies cable construction. The end connector of an ATA cable is configured to identify an attached data storage device as the first device (drive 0), while an intermediate connector is configured to identify an attached data storage device as the second drive (drive 1), thus making installation more intuitive.
    Type: Grant
    Filed: November 15, 1997
    Date of Patent: May 9, 2000
    Inventor: Tony Goodfellow
  • Patent number: 6055719
    Abstract: The present invention relates to a charged particle beam exposure apparatus, deflecting a charged particle beam formed into a predetermined shape by being passed through a predetermined transmission mask, and irradiating a predetermined location on the surface of a sample with the charged particle beam. The apparatus comprises: a mirror barrel through which the charged particle beam is passed; and an electrostatic deflector, provided in the mirror barrel, for deflecting the charged particle beam. The electrostatic deflector has a plurality of pairs of electrodes, which are made of a conductive material having carbon as a primary element and are embedded in an internal face of an insulating cylinder. The present invention also relates to a method for forming the electrostatic deflector.
    Type: Grant
    Filed: March 5, 1998
    Date of Patent: May 2, 2000
    Assignee: Fujitsu Limited
    Inventors: Yoshihisa Ooaeh, Tomohiko Abe, Hiroshi Yasuda
  • Patent number: 6055723
    Abstract: The invention relates to a method for producing an electrical connection to a high temperature superconductor (HTS) circuit, where a polymer material is applied to the HTS surface covering the circuit contact disposed on one surface of the HTS circuit, a via is created in the polymer material exposing the circuit contact, a diffusion barrier is applied into the via covering the circuit contact; and, a solder bump is applied to the diffusion barrier.
    Type: Grant
    Filed: June 1, 1998
    Date of Patent: May 2, 2000
    Assignee: TRW Inc.
    Inventors: Gershon Akerling, James M. Murduck
  • Patent number: 6053814
    Abstract: The present invention automatically adjusts the sensitivity of a game controller to a player's input. A n-dimensional speed vector having components that are indicative of the speed of an object in an n-dimensional game environment is read from the output of the game controller. Those speed vector components with small dynamics (e.g., small speeds) relative to the other speed vector components are suppressed, thereby producing a filtered speed vector. The components of the filtered speed vector are then tested for oscillations. Oscillations in the components of the filtered speed vector are indicative of small displacements made by the player while focusing on a game task requiring additional controller precision (e.g., focusing on a target). When such oscillations are detected, the ratio of the speed of the object, over the displacement of the game controller (e.g., deflection) is adjusted to some predetermined value.
    Type: Grant
    Filed: December 4, 1997
    Date of Patent: April 25, 2000
    Assignee: Logitech, Inc.
    Inventors: Andrei E. Pchenitchnikov, Geurt B. de Raad
  • Patent number: 6049968
    Abstract: A floating type of magnetic head having a high mechanical strength and a superior productivity and a method for producing the same are provided. A slider is composed of a first slider body and a second slider body. A main cut groove and a second sub-cut grooves are formed on a bonded surface side of the first slider body so that a first pillar portion and a second pillar portion around which lead lines are to be wound together with a first core body and a second core body a magnetic head core are left. Since the first and second pillar portions are bonded to the second slider body and during the assembling and machining operations, the first and second pillar portions receive a force that is applied to the slider or the magnetic head core to be effective for the reinforcement of the mechanical strength, the slider or the magnetic head may hardly be damaged or broken down.
    Type: Grant
    Filed: January 30, 1998
    Date of Patent: April 18, 2000
    Assignee: Minebea Co., Ltd.
    Inventors: Kazuyuki Kurita, Shigeyuki Adachi
  • Patent number: 6049958
    Abstract: An ultrasound transducer assembly of the present invention includes a flexible circuit to which an ultrasound transducer array and integrated circuitry are attached during fabrication of the ultrasound transducer assembly. Integrated circuitry and transducer elements are attached to the flexible circuit while the flexible circuit is in a substantially flat shape. The contacts of the transducer elements are positioned on substantially the same plane such that electrical contact with signal and ground lines on the flexible circuit is established without the need for conductive bridges to physically remote electrodes. In an embodiment of the invention wherein the transducer elements are arranged in a cylindrical array, gaps are entirely filled with backing material having a relatively low acoustic impedance. Structure integrity is enhanced and a path to ground facilitated by electrically conductive disks attached to the ends of the transducer assembly.
    Type: Grant
    Filed: November 19, 1997
    Date of Patent: April 18, 2000
    Assignee: EndoSonics Corporation
    Inventors: Michael J. Eberle, P. Michael Finsterwald
  • Patent number: 6049972
    Abstract: A method of making a microelectronic assembly includes providing a flexible tape having first and second surfaces with a plurality of connection components in a central region of the flexible tape, providing a carrier frame having top and bottom surfaces and a slot extending therebetween and placing the flexible tape in contact with the top surface of the carrier frame. Next a resilient element is provided on each connection component and the flexible tape is passed through the slot so that the flexible tape disengages from the top surface of the carrier frame, passes through the slot and engages the bottom surface of the carrier frame. The carrier frame includes one or more interior edges defining the slot and a cut-out region contiguous with one end of the slot.
    Type: Grant
    Filed: January 23, 1998
    Date of Patent: April 18, 2000
    Assignee: Tessera, Inc.
    Inventors: Joseph Link, Kurt Raab
  • Patent number: 6047464
    Abstract: A removal tool is operable for separating components of an assembled electrical connector used for connecting electrical conductors together. The electrical connector includes a tapered connector sleeve having a general "C" cross section with a slot defining a stop ledge and a wedge having a latching ledge which engages the stop ledge when inserted into the slot preventing removal of the wedge. The removal tool with a first block member includes outwardly projecting ears for selective insertion into the slot for engagement with the stop ledge. A second block member includes outwardly projecting slide pins. The first block member is slidably received on the slide pins for movement toward and away from the second block member, a removal blade on the second block member having a tapered nose member projecting toward the first block member and an integral shoulder on the second block member facing the first block member and spaced from the removal blade in a direction away from the first block member.
    Type: Grant
    Filed: June 18, 1998
    Date of Patent: April 11, 2000
    Assignee: Framatome Connectors USA, Inc.
    Inventors: Richard Chadbourne, Raymond G. Lavoie
  • Patent number: 6047468
    Abstract: An apparatus for stabilizing a semiconductor die and lead fingers of a lead frame during the process of wire bonding comprising a rigid clamp having at least one bond site window extending therethrough and at least one resilient secondary clamp which extends from an edge of the bond site window to a position over and in contact with lead fingers extending over the semiconductor die. The arrangement of the secondary clamp is such that the contact force with the semiconductor die is sufficient to minimize, dampen, or prevent movement of the semiconductor die and/or lead finger bounce during the wire bonding process. Methods of clamping are also disclosed.
    Type: Grant
    Filed: January 29, 1998
    Date of Patent: April 11, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Rich Fogal, Michael B. Ball
  • Patent number: 6047467
    Abstract: A method for minimizing signal delays caused by mismatch in length of the inner leads of a package lead frame. This is accomplished by the provision of a unique conductive trace pattern formed preferably on the top surface or else on a lower surface of an electrically-insulated, heat-conducting printed circuit board. The conductive trace pattern includes a plurality of U-shaped metallized traces. Each of the plurality of U-shaped traces have a varying length so that certain ones adjacent the inner leads at the center of the package lead frame are longer than certain ones adjacent the inner leads at the corners of the package lead frame. The conductive trace pattern and the outer leads of the package lead frame also serve to transfer heat away from a molded-plastic body encapsulating an integrated-circuit die and the package lead frame and distribute the same on the printed circuit board.
    Type: Grant
    Filed: December 22, 1997
    Date of Patent: April 11, 2000
    Assignee: VLSI Technology, Inc.
    Inventors: Ahmad B. Hamzehdoost, Chin-Ching Huang
  • Patent number: 6041495
    Abstract: A first method of manufacturing a printed circuit board includes steps of (a) preparing a board which has a chip mounting area and circuit patterns on an upper surface and metal pads to be electrically connected to the circuit patterns on a lower surface, (b) attaching a metal plate to the lower surface of the board, (c) forming metal patterns on the metal pads by etching the metal plate, and (d) forming metal bumps by plating the metal patterns.
    Type: Grant
    Filed: June 1, 1998
    Date of Patent: March 28, 2000
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jin Hyun Yoon, Gi Bum Park, In Pyo Hong, Yong Kim, Myung Kee Chung
  • Patent number: 6026564
    Abstract: A process of making a multilayer printed wiring board assembly.
    Type: Grant
    Filed: April 10, 1998
    Date of Patent: February 22, 2000
    Assignee: ANG Technologies Inc.
    Inventors: Peter Wang, Yu-Wen Huang
  • Patent number: 6021565
    Abstract: A wire connecting structure for connecting covered wires to terminals is provided. The wire connecting structure includes a connector housing body having grooves and a cover body having projections for engagement with the grooves. In arrangement, the terminals are accommodated in the grooves and the covered wires are disposed on the terminals, respectively. The connector housing body has engagement projections formed on opposing sidewalls, while the cover body has engagement holes formed on opposing sidewalls, for engagement with the engagement projections. Owing to the provision of the engagement projections and holes, the connector housing body is detachably united with the cover body on condition that the wires are electrically connected with the terminals. Therefore, it is possible for an operator to dissolve the structure and watch the inside even after the connecting structure is completed.
    Type: Grant
    Filed: January 6, 1998
    Date of Patent: February 8, 2000
    Assignee: Yazaki Corporation
    Inventor: Akira Shinchi