Abstract: An electrical bus bar assembly includes an elongate flexible electrical conductor formed of a strip of electrically conductive material having a generally rectangular cross section and a width to thickness ratio of at least 20:1 and a dielectric material covering a central portion of the electrical conductor such that the electrical conductor has exposed distal portions at each end of the assembly. Further, a method for forming such as assembly includes the steps of forming a flexible strip from an electrically conductive sheet such that the strip has a generally rectangular cross section with a width to thickness ratio of at least 20:1 and covering a central portion of the strip with a dielectric material and leaving distal portions at each end exposed.

Abstract: A storage device of the present invention is provided to store flexible circuit packages, each of the flexible circuit packages includes an electronic component and two circuit portions warped at both sides of the electronic component, respectively. The storage device includes a first carrier and a second carrier. The first carrier includes first accommodation elements provided for placement of the flexible circuit packages, and the second carrier includes a first press portion and a second press portion. As the second carrier is placed on the first carrier, the first and second press portions are provided to press the two circuit portions warped upwardly toward the second carrier so as to reduce the warpage of the two circuit portions.

Abstract: To provide a mounting structure in which a connection unit is protected and a non-flexible region is small, the mounting structure includes a flexible wiring board, a non-flexible component, and a connection unit provided in a region smaller than a bottom face of the non-flexible component and connecting the flexible wiring board and the non-flexible component. The mounting structure includes a protection resin sealing the connection unit in such a way that the flexible wiring board and the non-flexible component are separable. The protection resin covers only a region where the connection unit is provided. To a face of the flexible wiring board, being on an opposite side to the connection unit, a reinforcing material is added. The reinforcing material covers a region where the connection unit is provided and being narrower than the bottom face of the non-flexible component.

Abstract: To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.

Abstract: The present disclosure provides an electromagnetic shielding film, a flexible circuit board and a display device. The electromagnetic shielding film includes a central portion and an edge portion. The central portion has a plurality of surrounding side edges; and the edge portion is provided on at least one side edge of the central portion, and includes a plurality of protruding units protruding away from the central portion. The plurality of protruding units are arranged in an extending direction of the side edge where the edge portion is located. The electromagnetic shielding film is used to attach on a flexible circuit board body, the central portion is located on a non-bending area, and the edge portion is located on a bending area, so that the flexible circuit board is formed.

Abstract: An antenna system that includes a plurality of chips and a beam forming phased array. The beam forming phased array includes a plurality of radiating waveguide antenna cells. Each radiating waveguide antenna cell includes a plurality of pins that are connected to ground. A body of each radiating waveguide antenna cell corresponds to the ground. The plurality of chips are electrically connected with the plurality of pins and the ground of each of the plurality of radiating waveguide antenna cells to control beamforming through a second end of the plurality of radiating waveguide antenna cells.

Abstract: A flexible circuit board includes a plurality of first wires that have a first connection area and a first insulating layer that covers the first wires such that the first connection area is exposed. A printed circuit board includes a plurality of second wires that have a second connection area, a second insulating layer that covers the second wires such that the second connection area is exposed, and a plurality of island conductors adjacent to the second wires across a gap. The second connection area is covered with an anisotropic conductive layer. Each of the second wires in the second connection area at least partially faces a corresponding one of the wires in the first connection area across the anisotropic conductive layer. The plurality of island conductors include an island conductor that is in contact with the anisotropic conductive layer and partially exposed from the anisotropic conductive layer.

Abstract: A flexible printed circuit and a display device are provided. The flexible printed circuit includes: a plurality of sub-circuit boards arranged in a stack, wherein the plurality of sub-circuit boards include at least a first sub-circuit board and a second sub-circuit board; and a pressure sensor arranged on the first sub-circuit board, wherein the first sub-circuit board includes: a substrate film; a conductive film arranged on a side of the substrate film away from the second sub-circuit board; an adhesive layer arranged on a side of the conductive film away from the substrate film; a cover layer arranged on a side of the adhesive layer away from the substrate film; and an electromagnetic shielding layer arranged on a side of the cover layer away from the substrate film, wherein at least a part of the conductive film is formed as an electrode of the pressure sensor.

Abstract: A solid-state drive (SSD) includes a first rigid printed circuit board comprising a surface that defines a first plane. A second rigid printed circuit board of the SSD comprises a surface that defines a second plane that is substantially parallel to the first plane. A flexible interconnect couples the first rigid printed circuit board and the second rigid printed circuit board. The flexible interconnect partially encloses a volume. A capacitor is disposed within the volume.

Abstract: A display panel having a bonding region for bonding a flexible printed circuit in a peripheral region is provided. The display panel includes a plurality of first signal lines on a base substrate; and a plurality of bonding pins on the base substrate and in the bonding region. The plurality of bonding pins include a plurality of first bonding pins respectively electrically connected to the plurality of first signal lines. The display panel further includes a plurality of connecting portions respectively connecting the plurality of first signal lines portions to the plurality of first bonding pin portions. A respective one of the plurality of first bonding pin portions and a respective one of the plurality of connecting portions are substantially parallel to each other, and are arranged at a substantially same inclined angle with respect to a respective one of the plurality of first signal line portions.

Abstract: A flexible printed circuit board and a display device including the same are provided. An embodiment of a display device includes a display panel; a first circuit board attached to a first side of the display panel in a first direction; and a second circuit board attached to a second side of the first circuit board in the first direction, wherein the first circuit board includes a first bump area overlapping the display panel and a second bump area overlapping the second circuit board, the first bump area includes a plurality of first divided board portions arranged along a second direction crossing the first direction, and the first divided board portions of the plurality of first divided board portions partially overlap each other.

Abstract: An active cable avoiding influence of RX power consumption, comprising: the host connection end, the device connection end and the data wire and the auxiliary wire located between them. The auxiliary wire consists of the main power wire and the auxiliary power wire, wherein, the main power wire is used for current transmission between the VBUS of the host and the device; the auxiliary wire, one end of it is located at the host connection end and connected with the main power wire, and another end at the device connection end and is used for supply power to the active component at the device connection end. The active cable disconnects an active module of the device connection end from the VBUS and also arranges the power module between the active component and the auxiliary wire.

Abstract: An apparatus and method for shielding for surface-mount LTCC components and filters to increase the signal isolation from input signal port to output signal port, and to increase isolation from other electrical signals external to the component or filter. Some embodiments include an interposer two-sided and plated through printed circuit board to provide a constant impedance transition from a surface-mount device input and output ports to corresponding input and output connection points of a circuit on a printed circuit board onto which the device is mounted, including a ground plane transition.

Abstract: An electronic device capable of suppressing a temperature rise of a heat generating component and reducing the size of the heat generating component. The electronic device comprising a first substrate on which a first electronic component that generates heat during operation and a first connector are mounted, a second substrate on which a second electronic component that generates heat during operation and a second connector are mounted, and a cable having one end connected to the first connector and the other end connected to the second connector. In the electronic device, the second substrate has a hole defining the second substrate into a first region and a second region, and the cable is inserted through the hole, and on the second substrate, the second connector is mounted in the first region, and the second electronic component is mounted in the second region.

Abstract: A wiring board on which electronic components are mountable includes a stretchable portion having stretchability and having a first surface and a second surface opposite to the first surface, and an interconnection wire electrically connected to the electronic components mounted on the wiring board. The stretchable portion includes first regions lined up in each of a first direction and a second direction, a second region including first portions and second portions, and a third region surrounded by the second region. The first regions overlap the electronic components. The first portion extends from one of two first regions neighboring each other in the first direction to the other thereof. The second portion extends from one of two first regions neighboring each other in the second direction to the other thereof. The second region has a lower modulus of elasticity than the first region. The interconnection wire overlaps the second region.

Abstract: A bushing for a metal clad medium voltage switchgear includes a hollow body. The body is made of polyamide. A first end of the body connects to a compartment of the medium voltage switchgear. A second end of the body connects to a T-off and pin. A body portion extends from the first end of the body to the second end of the body. The body portion is circular shaped about an axis extending from the first end of the body to the second end of the body.

Abstract: An antenna system that includes a plurality of chips and a beam forming phased array. The beam forming phased array includes a plurality of radiating waveguide antenna cells. Each radiating waveguide antenna cell includes a plurality of pins that are connected to ground. A body of each radiating waveguide antenna cell corresponds to the ground. The plurality of chips are electrically connected with the plurality of pins and the ground of each of the plurality of radiating waveguide antenna cells to control beamforming through a second end of the plurality of radiating waveguide antenna cells.

Abstract: An antenna system includes a first substrate, a plurality of chips, a system board having an upper and lower surface, and a beam forming phased array that includes a plurality of radiating waveguide antenna cells for millimeter wave communication. Each radiating waveguide antenna cell includes a plurality of pins where a first pin is connected with a body of a corresponding radiating waveguide antenna cell and the body corresponds to ground for the pins. A first end of the radiating waveguide antenna cells is mounted on the first substrate, where the upper surface of the system board comprises a plurality of electrically conductive connection points to connect the first end of the plurality of radiating waveguide antenna cells to the ground.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and an internal electrode, an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer. The conductive resin layer includes a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin. The metal having the lower melting point than the conductive metal is tin (Sn). The conductive metal of the conductive resin layer includes at least one of copper (Cu), nickel (Ni), silver (Ag), and silver-palladium (Ag—Pd).

Abstract: A display device is provided, which includes a display panel including a first surface and a second surface of the display panel disposed opposite to each other; a backlight module including a first surface and a second surface of the backlight module disposed opposite to each other, wherein the first surface of the backlight module is attached to the second surface of the display panel; a circuit board including an end attached to the first surface of the display panel and another end bent to the second surface of the backlight module; and an adhesive layer including a first surface and a second surface disposed opposite to each other, wherein the first surface of the adhesive layer is bonded to a side of the backlight module close to the circuit board, and the second surface of the adhesive layer is bonded to the circuit board.