Abstract: The present disclosure is related to a cladding composition. The cladding composition may include cladding powder particles and flux particles. The flux particles may have an average particle size of less than about 40 ?m, and more than about 50% of the flux particles may adhere to the surfaces of the cladding powder particles.

Abstract: A mask is provided. The mask includes a plurality of first rows of openings and a plurality of second rows of openings. Each of the first rows of openings includes a plurality of first openings arranged in a row. The first openings located at different first opening rows are aligned in a column direction. Each of the second opening rows includes a plurality of second openings arranged in a row. The second openings located at different second rows of openings are aligned in the column direction. The first opening rows and the second opening rows are disposed alternately, and any one of the second rows of openings is located between two adjacent first rows of openings. The first openings and the second openings are alternately arranged in the row direction.

Abstract: A method of making a micro-channel structure and applying a curable ink to the micro-channel structure includes providing a substrate and depositing a single layer of a curable polymer on the substrate, the single curable layer having a layer thickness. One or more micro-channels adapted to receive curable ink are embossed into the single curable layer, the micro-channels having a micro-channel thickness that is in a range of two microns to ten microns less than the layer thickness. The single curable layer is cured to form a single cured layer so that deformations of the micro-channels or the surface of the single cured layer are reduced. Curable ink is coated over the surface and micro-channels of the single cured layer. The curable ink is removed from the surface of the single cured layer and the curable ink is cured.

Abstract: A method of preparing a fiber including electro-spinning onto a substrate polymer solutions from a plurality of jets to form a network of filaments, wherein at least one jet sprays onto the substrate a first chemical mixture including a carbon fiber precursor compound, and at least one other jet sprays onto the substrate a second chemical mixture comprising a sacrificial polymer and a precursor compound of a functional material; and processing the filaments on the substrate, thereby forming an arrangement of carbon fibers having the functional material deposited thereon.

Abstract: Provided are a method for preparing a transparent conductive layer and a transparent conductive layer prepared by the method. The method for preparing a transparent conductive layer includes: 1) forming a cellulose derivative film by coating a transparent substrate with a cellulose derivative coating liquid; 2) hydrolyzing the cellulose derivatives by treating the cellulose derivative film using an alkaline agent; 3) forming a metal film by coating the hydrolyzed cellulose derivative film with an organic metal ink and reducing metals on the cellulose derivative; and 4) forming a conductive metal layer by heat-treating the cellulose derivative film with the metal film formed, and a transparent conductive layer prepared by the method. According to the present invention, a process can be simplified, and also a transparent conductive layer having excellent conductivity, transmittance, bending resistance, and low haze can be prepared.

Abstract: The present invention provides a method for coating an aluminum wheel using a coating composition capable of forming a coating film having a superior cosmetic property as well as an anticorrosive property much enough for preventing corrosion even in the use in an area where the coating film is susceptible to salt damage, and an aluminum wheel obtained by the method. A method for coating an aluminum wheel including applying an anticorrosive coating composition onto the aluminum wheel, and thereafter applying a clear coating composition to form a transparent multilayer coating film, wherein the anticorrosive coating composition contains an acrylic resin (1) having a weight average molecular weight of 50,000 to 140,000, a glass transition point of 20 to 50° C.

Abstract: A successive deposition apparatus by which a reduction in the luminous efficiency of a light-emitting element can be suppressed even in high-speed deposition of a light-emitting layer thereof is provided. The apparatus includes: a second deposition chamber; a third deposition chamber coupled to the second deposition chamber; a transfer unit for transferring a substrate from second deposition chamber to third deposition chamber; plural third deposition sources arranged in the substrate transfer direction in the second deposition chamber; and a fourth and fifth deposition sources alternately arranged in the transfer direction in the third deposition chamber. In the third deposition chamber, the fourth deposition source is placed nearest to the second deposition source. The fourth deposition source contains a host material, and the fifth deposition source contains a dopant material. The HOMO level of a material of the third deposition source is adjusted to that of the host material.

Abstract: A nonaqueous cleaning liquid comprising a fluoroalkanol, a quaternary ammonium hydroxide, and an organic solvent. Compounds represented by formulae (1) and (2). Fluoroalkanol compounds include (1) H(CF2)aCH2—OH and (2) F(CF2)b(CH2)c—OH In which a and b are each an integer of from 2 to 6, and c is an integer of 1 or 2.

Abstract: The present invention relates to a method for fabricating a new silver coating/nanoparticle scaffold that significantly enhances the luminescence of near-field fluorophores via the metal enhanced fluorescence phenomenon. The silver coating/nanoparticle scaffold can be used for numerous applications in metal-enhanced fluorescence.

Abstract: An electrostatic chuck, a thin film deposition apparatus including the electrostatic chuck, and a method of manufacturing an organic light emitting display apparatus using the thin film deposition apparatus. The electrostatic chuck includes: a first plate; a first common wire disposed on the first plate and electrically connected to a plus terminal of an electric power source; first electrode patterns electrically connected to the first common wire, separated by a distance from each other, and extending from the first common wire; a second common wire disposed on the first plate and electrically connected to a minus terminal of the electric power source; second electrode patterns electrically connected to the second common wire, separated by a distance from each other, and extending from the second common wire; a first additional wire electrically connected to the first common wire; and a second additional wire electrically connected to the second common wire.

Abstract: A microlens substrate will warp when an oxide film is formed and annealed before forming a mask in order to adjust the etching rate of wet etching. Accordingly, a film exerting a stress that cancels out this warping is formed upon a microlens. This film functions as an optical path length adjusting layer.

Abstract: A method for manufacturing a piezoelectric film wafer includes a first processing step for carrying out an ion etching on a KNN piezoelectric film formed on a substrate by using a gas containing Ar, and a second processing step for carrying out a reactive ion etching by using a mixed etching gas containing a fluorine-based reactive gas and Ar after the first processing step.

Abstract: The inventive concept provides porous, low-k dielectric materials and methods of manufacturing and using the same. In some embodiments, porous, low-k dielectric materials are manufactured by forming a porogen-containing dielectric layer on a substrate and then removing at least a portion of said porogen from the layer.

Abstract: Methods for processing a substrate are described herein. Methods can include positioning a substrate with an exposed surface comprising a silicon oxide layer in a processing chamber, biasing the substrate, treating the substrate to roughen a portion of the silicon oxide layer, heating the substrate to a first temperature, exposing the exposed surface of the substrate to a plasma comprising ammonium fluoride to form one or more volatile products while maintaining the first temperature, and heating the substrate to a second temperature, which is higher than the first temperature, to sublimate the volatile products.

Abstract: One embodiment of the deposit removal method includes: preparing a substrate having a pattern on which a deposit is deposited, the pattern being formed by etching; exposing the substrate to a first atmosphere containing hydrogen fluoride gas; exposing the substrate to oxygen plasma while heating after the step of exposing the substrate to the first atmosphere; and exposing the substrate to a second atmosphere containing hydrogen fluoride gas to remove the deposit on the substrate after the step of exposing the substrate to the oxygen plasma.

Abstract: Provided is a manufacturing method of a CNT emitter with density controlled CNT, comprising: (i) fabricating a CNT paste by dispersing a carbon nanotube (CNT) powder, two kinds or more of inorganic fillers which have a lower melting temperature than the CNT and different oxidation degrees of the CNT, and an organic binder in a solvent; (ii) coating the CNT paste on an electrode formed above a substrate; (iii) sintering the substrate coated with the CNT paste to selectively oxidize the CNT around one kind of inorganic filler among two kinds or more of the inorganic fillers; and (iv) treating the surface of the CNT paste so that the surface of the CNT paste is activated.

Abstract: The present invention provides a method of forming via holes. First, a substrate is provided. A plurality of first areas is defined on the substrate. A dielectric layer and a blocking layer are formed on the substrate. A patterned layer is formed on the blocking layer such that a sidewall of the blocking layer is completely covered by the patterned layer. The patterned layer includes a plurality of holes arranged in a regular array wherein the area of the hole array is greater than those of the first areas. The blocking layer in the first areas is removed by using the patterned layer as a mask. Lastly, the dielectric layer is patterned to form at least a via hole in the dielectric layer in the first area.

Abstract: The invention is directed to a patterned aerogel-based layer that serves as a mold for at least part of a microelectromechanical feature. The density of an aerogel is less than that of typical materials used in MEMS fabrication, such as poly-silicon, silicon oxide, single-crystal silicon, metals, metal alloys, and the like. Therefore, one may form structural features in an aerogel-based layer at rates significantly higher than the rates at which structural features can be formed in denser materials. The invention further includes a method of patterning an aerogel-based layer to produce such an aerogel-based mold. The invention further includes a method of fabricating a microelectromechanical feature using an aerogel-based mold. This method includes depositing a dense material layer directly onto the outline of at least part of a microelectromechanical feature that has been formed in the aerogel-based layer.

Abstract: A deposit removal method for removing deposits deposited on the surface of a pattern formed on a substrate by etching, includes an oxygen plasma treatment process for exposing the substrate to oxygen plasma while heating the substrate and a cycle treatment process for, after the oxygen plasma treatment process, repeating multiple cycles of a first period and a second period. In the first period, the substrate is exposed to a mixture of hydrogen fluoride gas and alcohol gas inside a processing chamber and the partial pressure of the alcohol gas is set to the first partial pressure. In the second period, the partial pressure of the alcohol gas is set to the second partial pressure lower than the first partial pressure by exhausting the inside of the processing chamber.

Abstract: A method of forming an imaging blanket for a printing apparatus comprises preparing a support structure (e.g., mold) for receipt of a polymer blanket compound, introducing the polymer blanket compound in liquid state over the support structure, curing the polymer blanket compound to produce an imaging blanket, releasing the imaging blanket from the support structure, and etching a surface of the imaging blanket to form a texture pattern therein, the surface forming an imaging surface of said imaging blanket. An imaging surface providing desirable dampening fluid retention is provided. Wet etch, dry etch or a combination of both may be used. The polymer may be a silicone compound, may include 3 percent by weight granular material.