Abstract: A battery shield for a storage battery includes first and second members which are dimensioned to fit around the battery, forming a shield structure, that is open at its top and encloses the battery on all four sides and on the bottom, forming a heat shield for protecting the battery from hot temperatures, the first and second members being hinged to a common base and are adapted to be pivoted about respective hinges outwardly away from another to an open position to facilitate installation of a battery in the shield and to then be moved upwardly and toward one another, in the manner of a "clamshell", to a closed position for enclosing the battery within the battery shield, the bottom of the storage battery having a plurality of transverse channels therein extending between opposing sides for permitting air flow around the bottom of the storage battery when the battery is enclosed within the battery shield.

Abstract: A bipolar electrode useful in bipolar cell stack electrochemical cells where one of the electrode surfaces is patterned with active and relatively inactive areas where the surface area ratio of the active areas of the electrode surface to the total electrode surface is between 1:2 and 1:50. The use of a grid-like pattern of electrocatalytic material over a conductive substrate is preferred. The electrodes can be used for certain redox reactions to favor particular reaction products.

Abstract: Disclosed is a self-contained device which continuously dispenses a packaged fluid. The device is particularly suited for applications where several months may lapse before performance is manually initiated, after which a consistent steady flow is required for an extended period until the packaged fluid is exhausted. The device is also particularly suited for applications where ease of fabrication and where availability of materials are important factors. A button cell battery provides a driving force to reduce atmospheric oxygen at a simple air cathode, ions are transported through an ion-exchange membrane, and oxygen gas is released at a simple anode. The effective transport of oxygen gas pressurizes a chamber resulting in fluid contained in a flexible bladder within the chamber to be forced through an outlet. This device is intended to be very low in cost and thus disposable.

Abstract: A specially configured intermediate structure used in a stage of selective anodization during the manufacture of a circuit. The specially configured intermediate structure includes: a metal line having at least two edges; and a photoresist mask applied over a portion of the metal line that is to remain unanodized. A configuration of each of the edges of the metal line is such that the length of each edge under the mask is greater than the length of the mask. The extra length of the specially configured edge prevents a problem in later stages of the circuit manufacture due to unwanted, and practically unpreventable, seepage of the anodic oxidation chemical under the mask, along the edge, by the anodic oxidation chemical.

Abstract: This invention relates to a process for making metal wire, comprising: (A) forming metal foil; (B) cutting said foil to form at least one strand of metal wire; and (C) shaping said strand of wire to provide said strand with desired cross-sectional shape and size. This process is particularly suitable for making copper wire, especially copper wire having a very thin diameter (e.g., about 0.0002 to about 0.02 inch).

Abstract: A resilient dielectric wiper blade is mounted between electrodes and a workpiece, particularly in an anodizing operation, to wipe bubbles of oxygen from the anodic work surface, to remove a surface layer of excessively heated electrolytic solution and replace with fresh cooler solution, and in the case of flexible strip processing, to stabilize the strip between cathodes. The resilient dielectric wiper blade is preferably used with perforated electrodes to facilitate removal of overheated electrolytic solution and replace with freshly circulated solution.

Abstract: The present invention provides a process for generating an aqueous solution containing at least one active bromine compound comprising the steps of: electrolyzing an aqueous solution containing bromide ions so that bromate ions are formed in said aqueous solution; and introducing to the aqueous solution containing bromate ions an acid to generate an aqueous solution containing at least one active bromine compound. The present invention also provides an apparatus for generating an aqueous solution containing at least one active bromine compound. The aqueous solution containing the active bromine compound(s) generated using the process and apparatus of the present invention may be used for water treatment and the recovery of precious metals such as gold.

Abstract: A process has been developed in which a deep submicron MOSFET device has been fabricated, featuring a local, narrow threshold voltage adjust region, in a semiconductor substrate, with the narrow threshold voltage adjust region, self aligned to an overlying, narrow, polycide gate structure. The process consists of forming a narrow hole opening in an insulator layer, where the insulator layer overlies a polysilicon layer and a gate insulator layer. An ion implantation procedure, through the polysilicon layer, and gate insulator layer, is used to place a narrow threshold voltage adjust region in the specific area of the semiconductor substrate, underlying the narrow hole opening. Deposition of a metal layer, followed by an anneal procedure, converts the top portion of polysilicon, in the narrow hole opening, to a metal silicide structure.

Abstract: Electrolyzed waters, including an anode water and a cathode water, having either oxidizing or reducing activity and having either acidity or alkalescency, which is obtained by electrolysis of an aqueous solution prepared by addition of a minute amount of electrolytes, is applied wet processings including cleaning, etching and rinsing processings of semiconductor wafers. The effects of the electrolyzed waters are not lower than those the conventional acidic or alkalic chemicals provide, and remarkably reduces quantity of chemicals used in wet processings in semiconductor manufacturing.

Abstract: The invention relates to a vessel arrangement for electroplating dies for production of information-carrying disks. The vessel (14) has a large number of gas extraction openings (34) located in a U-shaped manner around the periphery of the vessel opening (20) and in wall parts of the vessel, which lie close to the opening of the vessel and under a lid (16) covering this opening.

Abstract: This invention relates an electrode composition for electrolysis of water, which is comprised of a panel of which one surface is made from electric conductive material and another surface is made from non electric conductive material. Plural holes are bored through said panel, and two said panels are arranged so as to hold a diaphragm between the surface of non-electric conductive material of each panel. And electrolysis reaction occurs at outer side of an anode and cathode of said electrode composition.

Abstract: Small, closely spaced deposits of solder materials may be formed with high volumetric accuracy and uniformity of shape by depositing a layer of conductive material over surfaces of a dielectric layer having apertures or recesses (e.g. blind apertures) and conductors and/or pads exposed by those apertures or recesses, masking regions of the conductive material with a further patterned dielectric layer, electroplating solder materials onto regions of the conductive material exposed by the mask, removing the mask and portions of the conductive material by selective etching and reflowing solder away from at least a portion of the surfaces of the apertured dielectric layer. Uniformity of electroplating within blind apertures is enhanced by a combination of fluid jet sparging and cathode agitation. Excess conductor material in the resulting solder deposit can be avoided by replacing conductor material with a constituent component of a solder material in an immersion bath prior to electroplating.

Abstract: An improved process is described for the recovery of copper from an aqueous feed solution using solvent extraction and electrowinning in which the electrowinning is conducted in a first step wherein the electrolyte is flowing perpendicular to the cathode surface without auxiliary mixing of the electrolyte between electrodes, and a second step wherein the electrolyte is flowing parallel to the cathode surface. In a second embodiment, solvent extraction of copper and solvent extraction of acid are conducted in alternate steps to allow more complete recovery of copper.

Abstract: The present invention relates to manganese-containing nickel(II) hydroxide powders, wherein at least 50 mole % of the manganese are present in the trivalent oxidation state, a process for the preparation of such powders and battery electrodes and batteries made therefrom.

Abstract: This invention is directed to a process for making copper metal powder from copper-bearing material, comprising: (A) contacting said copper-bearing material with an effective mount of at least one aqueous leaching solution to dissolve copper ions in said leaching solution and form a copper-rich aqueous leaching solution; (B) contacting said copper-rich aqueous leaching solution with an effective amount of at least one water-insoluble extractant to transfer copper ions from said copper-rich aqueous leaching solution to said extractant to form a copper-rich extractant and a copper-depleted aqueous leaching solution; (C) separating said copper-rich extractant from said copper-depleted aqueous leaching solution; (D) contacting said copper-rich extractant with an effective amount of at least one aqueous stripping solution to transfer copper ions from said extractant to said stripping solution to form a copper-rich stripping solution and a copper-depleted extractant; (E) separating said copper-rich stripping soluti

Abstract: Sour natural gas, containing H.sub.2 S and organic sulfide contaminants, is contacted with a sweetening composition comprising an aqueous solution of a substantially equimolar mixture of OCl and HO.sub.2. (preferably NaOCl and NaOOH) for a time sufficient to oxidize the sulfides to an odorless form. The solution has a pH of 9.0-10.5, an oxidation normality of 0.001-0.1. The solution may be produced by mixing Cl.sub.2 into a dilute aqueous solution of NaOH at about pH 10.5 until the pH reaches a level of about 9.5-10.5, or produced electrochemically in a diaphragm cell having a bipolar electrode in the same compartment as the anode, collecting the effluent gas from the cell and absorbing said effluent gas into a dilute aqueous solution of NaOH at about pH 9.5-10.5. The treatment may be run as an adjunct to a metal chelate redox treatment to improve the oxidation by the redox catalyst and to improve the catalyst regeneration.

Abstract: A process for producing a high purity cobalt is provided comprising the following steps. An aqueous solution of cobalt chloride having a hydrochloric acid concentration of 7 to 12N is provided. The solution includes either or both of Fe and Ni as impurities. The solution is contacted with an anion exchange resin so that cobalt is adsorbed on the resin. Cobalt is eluted from the resin with hydrochloric acid at a concentration of 1 to 6N. The solution containing the eluted cobalt is dried or otherwise concentrated to produce a purified aqueous solution of cobalt chloride having a pH of 0 to 6. Organic materials are preferably removed from the purified solution by active carbon treatment. Electrolytic refining is conducted with the purified aqueous solution as an electrolyte to obtain electrodeposited cobalt. A high purity cobalt sputtering target can be obtained wherein Na content is 0.05 ppm or less; K content is 0.

Abstract: A plate made of silicate glass (glass master) (3) is provided with a pressing surface (surface coat) carrying the sound recording in the form of raised contours formed from a photoresist (5) with a layer of primer (adhesion promotor) (4) to hold the photoresist layer (5) to the glass plate (3). A first metal layer (6) is deposited on the photoresist (5) from a sputter target which consists of a NiV alloy; and a protective layer (7) of nickel is electrolytically deposited on the first layer. The metal master (8) consisting of first layer (6) and protective layer (7) is pulled from the photoresist layer (5).

Abstract: Disclosed herein is a technique of removing metal contained in a solution through chelation, which makes it possible to preclude undesired aggregation and permit effective aggregation through an aggregating process. A surface active agent containing a hydrophobic group, a hydrophilic group and a chelating group is added to the solution to be processed, and subsequently an aggregating process is carried out. The chelating group chelates metal, the hydrophilic group prevents undesired aggregation, and the hydrophobic group is effectively aggregated in the aggregating process. Various uses are possible by selecting the charge of ligand.

Abstract: An alloy of formula:Ti.sub.30+x Ru.sub.15+y Fe.sub.25+z O.sub.30+t M.sub.uwherein M represent at least one metal selected from the group consisting of chromium, manganese, vanadium, tungsten, antimony, platinum and lead; x is an integer ranging between -30 and +50; y is an integer ranging between -10 and +35; z is an integer ranging between -25 and +70; t is an integer ranging between -28 and +10; and u is an integer ranging between 0 and +50; x, y, z, t and u being selected so that: x+y+z+t+u=0. This alloy, especially when it has a nanocrystalline structure, is useful for the manufacture cathodes for the electro-chemical synthesis of sodium chlorate. These cathodes have an over-potential of hydrogen lower than the one of the soft-steel cathodes presently in use.