Abstract: A method for forming a metallization layer (30). A first layer (14) is formed outwardly from a semiconductor substrate (10). Contact vias (16) are formed through the first layer (14) to the semiconductor substrate (10). A second layer (20) is formed outwardly from the first layer (14). Portions of the second layer (20) are selectively removed such that the remaining portion of the second layer (20) defines the layout of the metallization layer (30) and the contact vias (16). The first and second layers (14) and (20) are electroplated by applying a bi-polar modulated voltage having a positive duty cycle and a negative duty cycle to the layers in a solution containing metal ions. The voltage and surface potentials are selected such that the metal ions are deposited on the remaining portions of the second layer (20). Further, metal ions deposited on the first layer (14) during a positive duty cycle are removed from the first layer (14) during a negative duty cycle.

Abstract: A method of producing potassium permanganate in an electrolytic cell is described where the cell is separated into a catholyte and anolyte region, potassium hydroxide is made in the catholyte region and is recycled back into upstream portions of the process to oxidize permanganate dioxide bearing ore.

Abstract: A method of packaging an electronic component includes forming a hole (24) in a substrate (21) having a first surface (22) opposite a second surface (23) and disposing and patterning a malleable layer (26) over the first surface (22) and over the hole (24) of the substrate (21). The malleable layer (26) has a third surface (27) opposite a fourth surface (28). A portion (29) of the fourth surface (28) is exposed by the hole (24) in the substrate (21). An electrically conductive layer is simultaneously disposed over the portion (29) of the fourth surface (28) and over a different portion of the third surface (27) of the malleable layer (26). The malleable layer (26) is deformed into the hole (24). Then, a semiconductor die (43) is coupled to the malleable layer (26), and an underencapsulant (37) is disposed under the semiconductor die (43) and over the hole (24).

Abstract: The invention concerns an electrochemical process for the production of mllic hydroxides and/or metallic-oxide hydroxides from metal ions and hydroxide ions, as well as a device for carrying out the process. The metallic hydroxide and/or metallic-oxide hydroxide is formed in a chamber K, bordered on the cathode side by a bipolar membrane, and the required hydroxide ions arise by means of a bipolar membrane, the anion-selective layer being arranged on the anode side. The metal ions are either fed into the chamber K or formed in the chamber K in the presence of an agent, present in the chamber K and at a pH>7, which complexes the metal ions. The device for implementation of the process exhibits a cylindrical head geometry, connected to a conical geometry.

Abstract: The novel jumper switch means of the invention is directed to by-passing an electrolyzer in a row of electrolyzers electrically connected in series to permit removal of the by-passed electrolyzer for maintenance. The jumper switch means comprises one or more internal bus bars connected to suitable arrays of switches, the internal bus bars being dimensioned in such a way that when substantially all the electrolysis current flows through the jumper switch means, the voltage at its two connection terminals and therefore at the contact points of the by-passed electrolyzer, is close to, but in any case lower than the voltage spontaneously reached by the electrolyzer when electrolysis current is no more fed. Further, the present invention offers the possibility of housing the array of switches and said internal bus bars in a structure having a U-shape wherein the planar part has a limited height which does not hinder the lateral removal of the by-passed electrolyzer by a suitable fork-lift truck.

Abstract: An electroplating apparatus has a cathode base for supporting a substrate, and a clamper for clamping a peripheral edge portion of the substrate against the cathode base. A plating solution is supplied onto the substrate so that the surface of the substrate is plated. A negative pressure source clamps the substrate by drawing the clamper under a negative pressure through a suction conduit.

Abstract: A method for forming a plating coating having a non-homogeneous distribution of a dispersed substance in the outward direction, on a work such as a cylinder of an internal combustion engine block, is characterized in the steps of changing the plating liquid flow rate and/or the electric current density to a degree sufficient to change the amount of a dispersed substance at intervals or continuously in a plating coating, so that the amount of the dispersed substance in the plating coating is changed in the outward direction at intervals or continuously.

Abstract: An electrochemical remediation apparatus comprising a cylindrical tank having a plurality of vertical anodes suspended downwardly from a dome-shaped lid and positioned around the circumference of the tank spaced radially inwardly from the inner sidewalls of the tank. A single cathode is positioned at the axis of the cylindrical tank and removably mounted to the lid. A cylindrical metal ion permeable membrane is positioned between the anodes and the cathode. A plurality of nozzles spaced circumferentially around the tank directs pressurized fluid into the tank at a direction having radial, axial and circumferential components. A mixture of water, acid and contaminated earth consisting of approximately 50% contaminated earth is poured into the region between the membrane and the tank sidewalls. The mixture is incubated and fluidized, and contact between metals in the mixture and the anodes causes the metal contaminants to act as sacrificial anodes and thereby to ionize.

Abstract: A method for synthesizing a particulate product including electrostatically charging a fuel and/or oxidizer and/or ionizable inert gas present during the synthesis is provided. The method can include a step of collecting the particulate product which exploits the charged nature of the particulate reaction product.

Abstract: A method for the production of a gas diffusion electrode having particles of a platinum group metal deposited on a carbon sheet is disclosed. This method comprises placing a water-repelling carbon sheet into contact with ozone, thereby oxidizing the surface of the sheet and forming a functional group on the surface, then immersing the sheet in a solution containing platinum group metal complex cations as dissolved seeds, thereby inducing ion exchange between the hydrogen ions present in the functional group and the platinum group metal complex cations and deposition of the platinum group metal complex cations on the carbon sheet, and further reducing the platinum group metal complex cations on the carbon into platinum group metal particles.

Abstract: In the disclosed electrochemical cell for the production of an alkaline solution of peroxide, especially on-site production, the electrolyte is divided into an aqueous alkaline catholyte and an aqueous alkaline anolyte, and the cathode is a gas-diffusion electrode. The active material of the electrolyte side of the gas-diffusion cathode comprises a particulate catalyst support material having a surface area of about 50 to about 2000 m.sup.2 /g, and, deposited on the particles of this support material, 0.1 to 50 weight-%, based on the weight of the active layer, of gold or gold alloy particles having an average size >40 but less than about 200.ANG.. These gold or gold alloy particles are substantially selectively catalytic for the reduction of oxygen to peroxide (e.g. HOO.sup..crclbar.). The electrolyte flow patterns are designed to avoid loss of peroxide resulting from oxidation at the anode. In the operation of the cell, a product with a hydroxyl:perhydroxyl ratio less than 2:1 can be obtained.

Abstract: A method for producing a conductive pattern includes the steps of forming a mask layer on a conductive base plate, the mask layer having a pattern defining an exposed area of the conductive base plate; forming a conductive pattern on the exposed area of the conductive base plate by electroforming using a plating liquid which substantially maintains the pattern of the mask layer; and transferring the conductive pattern onto a support layer without removing the mask layer.

Abstract: In a bonding method for a chip-type electronic part, the electronic part is prefixed onto an element-mounting section of a wiring substrate by using a non-conductive adhesive agent while an external metal electrode of the electronic part is brought close to, or in contact with the metal wiring pattern formed on the wiring substrate. Then, the wiring substrate, on which the electronic part has been prefixed, is subjected to an electroplating process while it is immersed into plating liquid containing a metal component, so that the metal component, which is deposited on the metal wiring pattern, grows to form a metal layer, and the external metal electrode and the metal wiring pattern are thus electrically connected to each other through the metal layer.

Abstract: The present invention is a method of forming a phosphate chemical treatment film which is efficient and allows a high-quality chemical film to be obtained, by which a substance to be treated is subjected to electrolytic treatment while removing the sludge, which consists of impurities other than the unavoidable impurities in the phosphate chemical treatment bath. According to this method, an adequate phosphate chemical treatment film may be formed onto any type of metal material, to provide phosphate chemical treatment films having thicknesses not obtainable by the prior art.

Abstract: It is intended to provide an etching method for semiconductor devices in which the etching depth or the thickness of a thin thickness portion can be precisely controlled. According to experiment results, when a P-type substrate in which an N-type epitaxial layer is formed is immersed in an etching solution such as KOH or the like, and a voltage for reverse bias of PN junction is applied between an electrode plate opposing the substrate and the epitaxial layer to perform electrochemical etching, it has been found that the distance from the PN junction plane to the etching stop position is approximately equal to a depletion layer width at the substrate side of the PN junction portion. Namely, the etching stops at the forward end of the depletion layer.

Abstract: An electrolytic cell and process for the cogeneration of a peroxy acid and salts thereof in an anolyte compartment of the cell and hydrogen peroxide at a desired ratio of an alkali metal hydroxide to hydrogen peroxide in the catholyte compartment of the cell. An ammonium compound is present as a reactant in the catholyte compartment. Ammonia is recycled from the catholyte compartment of the cell to the anolyte compartment of the cell or removed as a product.

Abstract: A method for manufacturing a lead frame employing a resist pattern formed on a matrix and having a cavity therein, in which an electro-deposition pattern is formed. A connecting cavity portion interconnects tip ends of inner lead cavity portions such that a connecting portion interconnects the tip ends of inner leads of the electro-deposition pattern formed in the cavity. The connecting piece is maintained while the electro-deposition pattern is separated from the matrix and the resist.

Abstract: A metal-air battery pack is disclosed for external assembly to a portable electronic device with a battery compartment. The battery pack electrically connects to the electronic device through an existing connector of the device that is located in the battery compartment of the device. Another aspect of the present invention provides a palm rest as part of a battery for a portable computing device.

Abstract: A generator cell includes a high voltage assembly having a high voltage electrode, a low voltage assembly having a low voltage electrode, a barrier dielectric between the electrodes defining a discharge region for producing a reactive gas, and a welded seal joining the assemblies to create a permanently sealed chamber between the assemblies including the discharge region. The generator cell may have a gap in the discharge region of 0.005 inch or less. The cells may be modularly combined to form a reactive gas generator system.

Abstract: An electroformed tool that has a uniform air-releasing hole system with high strength and a simple and convenient method to manufacture it has been created. The method includes conducting electroforming by mixing a non-leveling agent with an electrolytic solution and forming an electroformed layer which has a continuous air-releasing hole structure.