Abstract: Among other things, techniques and systems for 3D modeling of a FinFET device and for detecting a variation for a design layout based upon a 3D FinFET model are provided. For example, a fin height of a FinFET device is determined based upon imagery of the FinFET device. The fin height and a 2D FinFET model for the FinFET device are used to create a 3D FinFET model. The 3D FinFET model takes into account the fin height, which is evaluated to identify fin height variations amongst FinFET devices within the design layout. For example, a fin height variation is determined based upon a proximity pattern density, a fin pitch, a gate length, or other parameters/measurements. A voltage threshold variation is determined based upon the fin height variation. This allows the design layout to be modified to decrease the variation.

Abstract: A method of optimizing timing performance of an IC design is provided. The IC design is expressed as a graph that includes a plurality of paths. Each path includes a plurality of nodes that represent IC components including clocked elements and computational elements. The method optimizes the timing performance of the IC design by retiming a set of paths. The retiming includes skewing clock signals to a set of clocked elements by more than a clock period without changing the position of any clocked element relative to the position of the computational elements in the set of paths. The method performs simulation on the optimized IC design and provides the result of the simulation as a clock skew scheduling of the IC design instead of retiming of the IC design.

Abstract: A method for designing a power distribution network (PDN) for a system implementing a target device includes computing a target PDN impedance value for the PDN. For each switching frequency of the target device where an effective PDN impedance value for the PDN is greater than the target PDN impedance value, one or more decoupling capacitors for one or more capacitor types are identified to add to the PDN to drive the effective PDN impedance value below the target PDN value. A selection of decoupling capacitors identified is refined to reduce one or more of a cost of the PDN and space required for implementing the PDN.

Abstract: One or more systems and methods for a cell based hybrid resistance and capacitance (RC) extraction are provided. The method includes generating a layout for a semiconductor arrangement, performing a three-dimensional (3D) RC extraction on a target unit cell to obtain a 3D RC result including a coupling capacitance between unit cells, generating a 3D RC netlist based upon the 3D RC result, performing a 2.5 dimensional (2.5D) RC extraction on a peripheral cell to obtain a 2.5D RC netlist, and combining the 3D RC netlist with the 2.5D RC netlist to create a hybrid RC netlist for the layout. In some embodiments, the hybrid RC netlist is generated by stitching the coupling capacitance for at least one of the target unit cell, a repeating unit cell, or the peripheral cell together. In some embodiments, the 3D RC result for the target unit cell is stitched to the repeating unit cell.

Abstract: Various techniques are provided to efficiently implement user designs in programmable logic devices (PLDs). In one example, a computer-implemented method includes receiving a design identifying operations to be performed by a PLD and synthesizing the design into a plurality of PLD components. The synthesizing includes detecting a mixed-mode memory operation in the design. The mixed-mode memory operation specifies memory access having different read and write data widths using a plurality of embedded memory blocks each having a fixed data width. The synthesizing further includes determining a reduced number of embedded memory blocks to implement the mixed-mode memory operation, and modifying the mixed-mode memory operation to remap the memory access to the reduced number of embedded memory blocks.

Abstract: Methods and systems for checking or verifying shapes in electronic designs are disclosed. The method identifies a dictionary (if pre-existing) or determining the dictionary by creating the dictionary and reduces dimensionality of design data by using a sliced line. Shapes are transformed into sliced line segments along the sliced line. Dictionary entries for shapes are associated with corresponding sliced line segments, and the design is checked or verified using the sliced line segments and the associated dictionary entries rather than using two-dimensional shapes or geometric data. Sliced line segments may be further partitioned or merged. Non-conforming shapes corresponding to no tracks of track patterns are identified and determined whether violations of design rules or requirements may be resolved by one or more other shapes using the corresponding sliced line segments.

Abstract: A system and method of determining a cell layout are disclosed. The method includes receiving a circuit design corresponding to a predetermined circuit design, the circuit design having a first set of cells and abutting adjacent cells in the first set of cells, the abutted cells having a first boundary pattern therebetween. The first boundary pattern is exchanged with a second boundary pattern based on a number or positions of signal wires in the first boundary pattern. A cell layout for use in a patterning process can then be determined, the cell layout including the second boundary pattern.

Abstract: A system and method for providing a scalable server-implemented regression query environment for remote testing and analysis of a chip-design model receives chip-design information, including the chip-design model to be tested and one or more attributes for testing the chip design model; receives a first regression simulation test request from the client-side integration client; initiates a proxy instance for a first regression simulation test to be executed by an application programming interface (API), based on the first regression simulation test request; selects, by the API, the attributes for testing the chip-design model; executes, by the API, the first regression simulation test on the chip-design model using the selected attributes; monitors, by a server-side database manager, the first regression simulation test during execution of the first regression simulation test; and stores, by the server-side database manager, one or more results of the first regression simulation test in a database.

Abstract: A method of calculating an overlay correction model in a unit for the fabrication of a wafer is disclosed. The method comprises measuring overlay deviations of a subset of first overlay marks and second overlay marks by determining the differences between the subset of first overlay marks generated in the first layer and corresponding ones of the subset of second overlay marks generated in the second layer.

Abstract: A method to generate a reduced delay twinaxial SPICE model is provided. The method may include measuring near-end S-parameter components and far-end S-parameter components of a twinaxial cable, reducing an original time delay of the far-end S-parameter components by multiplying each of the far-end S-parameter components by a complex exponential based on an equivalent delay length, a signal frequency, and an effective dielectric constant, simulating a signal transmitted across a twinaxial cable by running a 4-port SPICE model using the near-end S-parameter components and the multiplied far-end S-parameter components, and recording a magnitude and a phase of the transmitted signal with respect to frequency as outputs of the reduced delay twinaxial SPICE model.

Abstract: Some methods provide an electronic design file, which includes an integrated circuit (IC) component that is operably coupled to a package component. The IC component and package component collectively form a resistor inductor capacitor (RLC) resonant circuit. The method also provides a damping component in the electronic design file. This damping component is configured to reduce a pre-resonant time during which energy exchanged in the RLC resonant circuit approaches a steady-state, and thereby speeds simulation time.

Abstract: A replacement method for scan cell of an integrated circuit (IC) is provided. A gate-level netlist of the IC is obtained. A place-and-route process is performed on the gate-level netlist to obtain a first netlist. A clock tree synthesis process is performed on the first netlist to obtain a second netlist. Static timing analysis is performed to analyze a plurality of first scan cells of the second netlist in normal mode and scan mode. The first scan cell is replaced with a second scan cell according to the static timing analysis that indicates the replaced first scan cell has a specific time margin in the scan mode. A first skew of the normal mode and a second skew of the scan mode are adjusted symmetrically in the first scan cell. The first skew and the second skew are adjusted asymmetrically in the second scan cell.

Abstract: In a particular embodiment, a wireless power receiver apparatus includes a coil configured to wirelessly receive power via a magnetic field generated by a transmitter. The wireless power receiver apparatus can include a housing that includes a first volume configured to house the coil. The housing can also include a second volume configured to house electronic components. The second volume can be bound by a horizontal shielding member along a first portion of the second volume. The horizontal shielding member can define a horizontal shielding member plane substantially parallel to a plane defined by the coil. The second volume can also be bounded by a vertical shielding member along a second portion of the second volume. The vertical shielding member can define a vertical shielding member plane substantially orthogonal to the plane defined by the coil.

Abstract: The present disclosure provides a method for pattern correction for electron-beam (e-beam) lithography. In accordance with some embodiments, the method includes splitting a plurality of patterns into a plurality of pattern types; performing model fittings to determine a plurality of models for the plurality of pattern types respectively; and performing a pattern correction to an integrated circuit (IC) layout using the plurality of models.

Abstract: The present disclosure relates to a method of inspecting a photomask to decrease false defects, which uses a plurality of image rendering models with varying emphasis on different design aspects, and an associated apparatus. In some embodiments, the method is performed by forming an integrated circuit (IC) design comprising a graphical representation of an integrated circuit. A first image rendering simulation is performed on the IC design using an initial image rendering model to determine a plurality of initial mask defects. A second image rendering simulation is performed on the IC design using a modified image rendering model that emphasizes a design aspect to determine a plurality of modified mask defects. By comparing the plurality of initial mask defects with the plurality of modified mask defects, falsely identified mask defects can be detected and eliminated.

Abstract: A method for functional verification of a circuit description comprises generating a first set of crossover paths based on the circuit description, generating a low power information based on a power design description associated with the circuit description, the low power information determining a set of power state combinations, and generating a second set of crossover paths based on the first set of crossover paths and the low power information, the second set of crossover paths being a subset of the first set of crossover paths. Each of the second set of crossover paths is evaluated to identify circuit description errors, in particular functional circuit description errors.

Abstract: Embodiments relate to managing layer promotion of interconnects in the routing phase of integrated circuit design. An aspect includes a system to manage layer promotion in a routing phase of integrated circuit design. The system includes a memory device to store instructions, and a processor to execute the instructions to identify a set of candidate interconnects for layer promotion, score and sort the set of candidate interconnects according to a respective score to thereby establish a respective rank, assess routing demand and resource availability based on layer promotion of the set of candidate interconnects, and manage the set of candidate interconnects based on the respective rank and the resource availability, the processor assessing the routing demand and resource availability and managing the set of candidate interconnects iteratively, wherein the processor, in at least one iteration, generates a second set of candidate interconnects by reducing the set of candidate interconnects.

Abstract: A system for verifying register information includes a design database containing a description of the electronic system, a register description database containing register information relating to the electronic system, a customization information module for storing a customization information extracted from the design database and a simulator which is arranged to execute verification stimuli in accordance with at least one check function and to generate a verification result. Verification stimuli are generated by combining register information with customization information. A mismatch between the expected and actual register implementation is recorded and the register in question identified. This permits corrections to be applied as appropriate to the document database or to the register description database. The corrected register description database may be used in a document generation process to produce an up-to-date reference manual for the electronic system.

Abstract: In some embodiments, in a method, placement of a design layout is performed. The design layout includes a power rail segment, several upper-level power lines and several cells. The upper-level power lines cross over and bound the power rail segment at where the upper-level power lines intersect with the power rail segment. The cells are powered through the power rail segment. For each cell, a respective current through the power rail segment during a respective SW of the cell is obtained. One or more groups of cells with overlapped SWs are determined. One or more EM usages of the power rail segment by the one or more groups of cells using the respective currents of each group of cells are obtained. The design layout is adjusted when any of the one or more EM usages of the power rail segment causes an EM susceptibility of the power rail segment.

Abstract: An integrated circuit is manufactured by a predetermined manufacturing process having a nominal minimum pitch of metal lines. The integrated circuit includes a plurality of metal lines extending along a first direction and a plurality of standard cells under the plurality of metal lines. The plurality of metal lines is separated, in a second direction perpendicular to the first direction, by integral multiples of the nominal minimum pitch. The plurality of standard cells includes a first standard cell configured to perform a predetermined function and having a first layout and a second standard cell configured to perform the predetermined function and having a second layout different than the first layout. The first and second standard cells have a cell height (H) along the second direction, and the cell height being a non-integral multiple of the nominal minimum pitch.