Abstract: In a method and apparatus for fabricating a semiconductor device having a flexible tape substrate, a hole is punched in the flexible tape substrate. The flexible tape substrate includes a metal layer attached to a polyimide layer without an adhesive there between. A cover is placed on the metal layer to cap a base of the hole. A metal is deposited on the cover exposed at the base of the hole, the metal being used to form a bond with the metal layer. The metal being deposited causes the hole to be plugged up to a selective height. Upon removal of the cover, the metal may also be deposited on the metal layer to increase a thickness of the metal layer.

Abstract: In a method and a device for non-rotatably connecting a hollow shaft with at least one component located on the hollow shaft with which the component is positioned with clearance on the hollow shaft and is fastened thereon in a certain position by eliminating the clearance, the clearance being eliminated by expanding the hollow shaft using a joining tool that passes through at least part of the hollow shaft, and the joining tool including at least one first shaping element and at least one further shaping element, and the shaping elements being movable relative to each other, so that the motion of the shaping elements relative to each other causes an at least partial expansion of the hollow shaft. A design of this type has the advantage, in particular, that the joining tools cause the hollow shaft to expand only at the necessary points.

Abstract: An outer member and an inner member constituting a wheel bearing device are assembled and the brake rotor is fixed to the hub ring of the inner member. In this state, the pad slide surfaces of the brake rotor are lathed with the reference provided by a wheel pilot end surface. Alternatively, the wheel pilot end surface of the hub ring by chucking the knuckle pilot of the outer member with the wheel bearing device put in its assembled state, and the pad slide surfaces of the brake rotor are lathed with the reference provided by the wheel pilot end surface.

Abstract: A method of fabricating a printed circuit board having capacitance components, including: providing a core board having first and second surfaces with first and second wiring layers provided thereon, respectively, and electrically connected, a second dielectric layer, and a carrier board sequentially provided thereon with a second metal layer, a high dielectric material layer, and a third wiring layer with a plurality of first electrode plates thereon; laminating the core board, second dielectric layer, and carrier board to one another; removing the carrier board so as to expose the second metal layer; and patterning the second metal layer so as to form a fifth wiring layer having a plurality of second electrode plates and a plurality of second conductive vias electrically connected to the third wiring layer, thereby allowing the first electrode plates, high dielectric material layer, and second electrode plates together to form a plurality of capacitance components.

Abstract: An electrical enclosure that includes a sidewall, a back and a top, defining an interior. The top of the enclosure is adapted to open and provide access to the interior. The enclosure includes a backplane mounted to the interior of the enclosure. The backplane has at least one cutout where the cutout is positioned on the backplane to align with an obstacle positioned on the enclosure sidewall and extending into the enclosure interior.

Abstract: An intermediate layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit board 10 without using lead members and a sealing resin. Also, by providing the intermediate layer 38 made of copper on an aluminum pad 24, it is possible to prevent a resin residue on the pad 24 and to improve connection characteristics between the die pad 24 and a via hole 60 and reliability.

Abstract: Embodiments of the present invention provide a method of forming an electrical connection on a device. In one embodiment, the electrical connection is attached to the device via an adhesive having electrically conductive particles disposed therein. In one embodiment, the adhesive is cured while applying pressure such that the conductive particles align, have a reduced particle-to-particle spacing, or come into contact with each other to provide a more directly conductive (less resistive) path between the electrical connection and the device. In one embodiment of the present invention, a method for forming an electrical lead on a partially formed solar cell during formation of the solar cell device is provided.

Abstract: In a method for forming bumps 19 on electrodes 32 of a wiring board 31, a fluid 14 containing conductive particles 16 and a gas bubble generating agent is supplied onto a first region 17 including the electrodes 32 on the wiring board 31. Then, a substrate 40 which has a protruding surface 13 having the same area as that of the first region 17 and formed on a main surface 18 of the substrate 40 having a larger area than that of the first region 17 is disposed so that the protruding surface 13 faces the first region 17 of the wiring board 31. Then, the fluid 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.

Abstract: A multilayer core board 10 includes tapered first via hole conductors 51 extending from the outer surface of a first insulating layer 24 to conductive portions 42a of a power source layer 42, second via hole conductors 52 extending from the outer surface of a second insulating layer 26 to the conductive portions 42a of the power source layer 42, tapered third via hole conductors 53 extending from the outer surface of the second insulating layer 26 to conductive portions 40a of a ground layer 40, and fourth via hole conductors 54 extending from the outer surface of a center insulating layer 22 to the conductive portions 40a of the ground layer 40. The first via hole conductors 51 are tapered, and thus the interval distance to the adjacent first via hole conductor 51 is shorter than straight-shaped first via hole conductors, and thus the pitch of the first via hole conductor 51 at the positive pole side and the fourth via hole conductor 54 at the negative pole side can be sufficiently reduced.

Abstract: A work (W) with a part assembling surface on many faces is rotated by a work holding jig (10) so as to sequentially convert each of the part assembling surfaces to the upward horizontal attitude, a bolt is fastened from above vertically while gripping an assembly part (B) by a part gripping device (12), and this is repeated so that an assembling operation can be carried out smoothly and an assembly space can be saved.

Abstract: A composite membrane acoustic transducer structure comprising a magnet assembly is arranged adjacent the composite membrane material. The magnet assembly is arranged to produce a flux field. A first layer of thin, elongate composite membrane material is held under tension. A second conductive layer is attached to the first layer of composite membrane material wherein the first and second layers of membrane material are arranged adjacent, generally parallel and offset from the magnet assembly. The assembly is arranged to produce the flux field through at least part of the first layer and the second layer.

Abstract: A method of manufacturing an electronic component substrate is provided, the method allowing manufacturing yield to be improved. The method of manufacturing an electronic component substrate in which a plurality of electronic components are mounted on a first substrate includes the steps of: aligning and disposing the plurality of electronic components on a second substrate; transferring the electronic components on the second substrate onto the first substrate; detecting an electronic component un-mounted portion on the first substrate; and repairing by selectively re-transferring the electronic component from the second substrate onto the detected un-mounted portion on the first substrate.

Abstract: An electronic device with a reworkable electronic component, a method of manufacturing the electronic device, and a method of reworking the electronic component are disclosed. The electronic device includes a first cavity provided in a board body. A first metal pattern is provided on the board body and adjacent to the first cavity. A first electronic component is provided in the first cavity. A first connection pattern is provided adjacent to an upper edge portion of the first electronic component and extends to the first metal pattern so that the first metal pattern is electrically connected to the first electronic component.

Abstract: An insulation sleeve assembling apparatus that assembles a tubular insulation sleeve to a lead wire that is formed of a plurality of conductors includes an actuator unit that rotates the insulation sleeve while actuating the lead wire and the insulation sleeve in a direction in which the lead wire and the insulation sleeve approach each other.

Abstract: A challenge to be met by the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that enable a reduction in the frequency of operation required with switching of a component type, to thus enhance productivity.

Abstract: An assembly system includes an electronic component, a gripper, and a socket. The electronic component has sides and a top face, the top face has a top-face peripheral area and a top-face central area. The gripper has a gripper head, the gripper head being movable to an open and closed position. The gripper head has an extension configured to contact opposing sides of the electronic component when the gripper head is in the closed position, and a surface configured to contact the top-face peripheral area of the electronic component when the gripper head is in the closed position. The socket has a top peripheral surface. An insertion depth guide is associated with the gripper head and has a depth guide with a bottom surface configured to contact the top peripheral surface of the socket. A method for assembly is also included.

Abstract: A method of enabling selective area plating on a substrate (201) includes forming a first electrically conductive layer (310) on the substrate, covering the electrically conductive layer with an anti-electroless plating layer (410), patterning the substrate in order to form therein a feature (510, 520) extending through the anti-electroless plating layer and the first electrically conductive layer, forming a second electrically conductive layer (610) adjoining and electrically connected to the first electrically conductive layer, forming a third electrically conductive layer (710) over the second electrically conductive layer, and removing the anti-electroless plating layer and the first electrically conductive layer.

Abstract: Disclosed are a method for connecting a bus bar of a capacitor, improving temperature characteristics and reliability of the capacitor by reducing inductance and impedance such that heat generation is restrained during use of the capacitor, and a product fabricated by the same. A pair of bus bars are insulatedly connected to sprayed surfaces on both sides of a plurality of capacitor devices, in such a manner that lead frames arranged alternately on a first bus bar are connected in contact with the sprayed surfaces facing in a diagonal direction, of neighboring capacitor devices. Other lead frames arranged alternately on a second bus bar are connected to the sprayed surfaces facing in another diagonal direction across the above diagonal direction in an X-shape. Then, the pair of bus bars are assembled to be insulated from each other and overlapped at one side of the capacitor device.

Abstract: A circuit board component installation tool includes a tool head having a surface receptive of a press; a seating member connected to the tool head and receptive of at least one circuit board component; and a post attached to and extending from a side of the tool head to ensure proper orientation of the tool with respect to the circuit board component or proper orientation of the component with respect to the circuit board.

Abstract: A thin film sensor, such as a glucose sensor, is provided for transcutaneous placement at a selected site within the body of a patient. The sensor includes several sensor layers that include conductive layers and includes a proximal segment defining conductive contacts adapted for electrical connection to a suitable monitor, and a distal segment with sensor electrodes for transcutaneous placement. The sensor electrode layers are disposed generally above each other, for example with the reference electrode above the working electrode and the working electrode above the counter electrode. The electrode layers are separated by dielectric layer.