Abstract: A first side of a tapeless leadframe package is etched to form a ring shaped protrusion and a lead protrusion extending from a base layer. An integrated circuit die is mounted to tapeless leadframe package in flip chip orientation with a front side facing the first side. An electrical and mechanical attachment is made between a bonding pad of the integrated circuit die and the lead protrusion. A mechanical attachment is made between the front side of the integrated circuit die and the ring shaped protrusion. The integrated circuit die and the protrusions from the tapeless leadframe package are encapsulated within an encapsulating block. The second side of the tapeless leadframe package is then etched to remove portions of the base layer and define a lead for a leadframe from the lead protrusion and further define a die support for the leadframe from the ring shaped protrusion.

Abstract: A display device is disclosed, which may reduce an interval between subpixels and maximize a light emission area. The display device comprises a substrate provided with a first subpixel and a second subpixel arranged to adjoin the first subpixel, a first electrode provided in each of the first subpixel and the second subpixel on the substrate, including a first material, and an oxide insulating film provided to cover at least a portion of a side of the first electrode and made of a second material. The first material is a metal material, and the second material is an oxide of the first material.

Abstract: A light-emitting device and a method of manufacturing the same. The light-emitting device includes a body portion, and a light-emitting portion arranged in the body portion and configured to emit light to the outside. The light-emitting portion includes a plurality of pixels. At least two of the pixels are configured to emit pieces of light having different wavelengths from each other.

Abstract: A color-converting substrate including light-emitting areas and a light-blocking area surrounding the light-emitting areas, the light-emitting areas including first light-emitting areas configured to emit a same color light and spaced apart from each other by the light-blocking area, a partition wall including a first opening continuously overlapping the first light-emitting areas and a first portion of the light-blocking area disposed between the first light-emitting areas, a first color-converting layer including a wavelength-converting material and disposed in the first opening to overlap the first light-emitting areas and the first portion of the light-blocking area, and a color filter layer including a portion configured to block a first color light emitted through the first light-emitting areas, the color filter layer overlapping the first color-converting layer and the first portion of the light-blocking area.

Abstract: A display device having a non-display region is provided. The display device includes a first conductive line to which a voltage is applied and a second conductive line which is at least partially overlapped with the first conductive line. There is a distance between the first conductive line and the second conductive line in a normal direction of the display device is greater than or equal to 3500 angstroms, and less than or equal to 4500 angstroms.

Abstract: New organometallic complexes having bis- or tris-heteroleptic ligands and large aspect ratio in one direction and their use in OLEDs to enhance the efficiency is disclosed.

Abstract: A semiconductor chip or die is mounted at a position on a support substrate. A light-permeable laser direct structuring (LDS) material is then molded onto the semiconductor chip positioned on the support substrate. The semiconductor chip is visible through the LDS material. Laser beam energy is directed to selected spatial locations of the LDS material to structure in the LDS material a pat gstern of structured formations corresponding to the locations of conductive lines and vias for making electrical connection to the semiconductor chip. The spatial locations of the LDS material to which laser beam energy is directed are selected as a function of the position the semiconductor chip which is visible through the LDS material, thus countering undesired effects of positioning offset of the chip on the substrate.

Abstract: A tiled electronic device includes a plurality of display panels, and at least one of the display panels includes a flexible substrate, a pixel, and two signal wires. The flexible substrate has a display portion and a bent portion connected to the display portion. The pixel is disposed on the display portion. The signal wires are disposed on the flexible substrate, and electrically connected to the pixel. Each of the signal wires has a first segment disposed on the display portion, and a second segment disposed on the bent portion. The two first sections have a first pitch, and the two second sections have a second pitch. The first pitch is different than the second pitch.

Abstract: A semiconductor device includes a conductive support member, a first semiconductor element, a second semiconductor element, an insulating element, and a sealing resin. The conductive support member includes a first die pad and a second die pad, which are separated from each other in a first direction. The first die pad and the second die pad overlap each other when viewed along the first direction. When viewed along a thickness direction, a peripheral edge of the first die pad has a first near-angle portion including a first end portion in a second direction orthogonal to both the thickness direction and the first direction. The first near-angle portion is separated from the second die pad in the first direction toward the first end portion in the second direction.

Abstract: A method of encapsulating a display substrate and a counter substrate, an encapsulated display panel, a display apparatus, and a counter substrate are provided. The encapsulated display panel includes a display substrate; a counter substrate facing the display substrate; and a sealant filled in a space between the display substrate and a counter substrate. The display substrate in a peripheral area has a plurality of protruding parts and a plurality of recessing parts, resulting in an uneven surface topography. The counter substrate in at least a portion of the peripheral area has a counter surface topography substantially complementary to the surface topography of the display substrate. The counter substrate in the peripheral area has a plurality of counter protruding parts.

Abstract: A display device may include a substrate including a display area and a bending area, a buffer layer disposed on the substrate, a first dummy pattern disposed in the bending area on the buffer layer; a first insulating layer disposed on the buffer layer, the first insulating layer exposing an upper surface of the first dummy pattern, a second insulating layer disposed on the first insulating layer, the second insulating layer having an opening exposing an upper surface of the first dummy pattern, a second dummy pattern disposed on the first dummy pattern, and a transmission line disposed on the second dummy pattern.

Abstract: A nitride-based semiconductor device includes a buffer, a first nitride-based semiconductor layer, a shield layer, a second nitride-based semiconductor layer, S/D electrodes, and a gate electrode. A first nitride-based semiconductor layer is disposed over the buffer. A shield layer is disposed between the buffer and the first nitride-based semiconductor layer and includes a first isolation compound that has a bandgap greater than a bandgap of the first nitride-based semiconductor layer, in which the first isolation compound is made of at least one two-dimensional material which includes at least one metal element. A second nitride-based semiconductor layer is disposed on the first nitride-based semiconductor layer and has a bandgap less than the bandgap of the first isolation compound and greater than the bandgap of the first nitride-based semiconductor layer. The pair of S/D electrodes and the gate electrode are disposed over the second nitride-based semiconductor layer.

Abstract: A display device includes a first substrate where a display area and a non-display are defined, wherein a plurality of pixels are arranged at the display area and the non-display area surrounds the display area; a dam surrounding the display area and arranged at the non-display area; an organic light emitting diode provided in the display area; an encapsulation film disposed on the organic light emitting diode; a buffer layer disposed on the encapsulation film; an insulating film disposed on the buffer layer; a pad area arranged outside the dam, wherein the buffer layer and the insulating film extend from the display area to the pad area; a link line disposed between the dam and the first substrate; and a routing line provided on the insulating layer between the display area and the pad area.

Abstract: An organic light-emitting diode (OLED) display panel and a display device are provided. The OLED display panel includes a substrate, a driving circuit layer, a luminous functional layer, a first coupling layer, and a second coupling layer. The second coupling layer includes a first coupling portion, a second coupling portion, and a third coupling portion respectively corresponding to red, green, and blue pixels. A thickness of the first coupling portion is greater than or equal to a thickness of the second coupling portion, and greater than a thickness of the third coupling portion. The thickness of the second coupling portion is greater than or equal to the thickness of the third coupling portion.

Abstract: Semiconductor devices, and more particularly arrangements of fluorinated polymers with low dielectric loss for environmental protection in semiconductor devices are disclosed. Arrangements include conformal coatings or layers of fluorinated polymers that cover a semiconductor die on a package substrate of a semiconductor device. Such fluorinated polymer arrangements may also conformally coat various electrical connections for the semiconductor die, including wire bonds. Fluorinated polymers with low dielectric constants and low moisture permeability may thereby provide reduced moisture ingress in semiconductor devices while also reducing the impact of associated dielectric loss.

Abstract: A display device includes a first substrate including at least one first opening part defined, a pixel disposed on the first substrate, at least one first heat dissipation layer disposed in the at least one first opening part, an insulation layer disposed under the first substrate and including at least one second opening part overlapping the at least one first opening part, and a second heat dissipation layer disposed in the at least one second opening part.

Abstract: A quantum dot composition includes a quantum dot, and a ligand bonded to a surface of the quantum dot, wherein the ligand includes a head portion bonded to the surface of the quantum dot and containing a polar solvent dissociative functional group, and a tail portion connected to the head portion. A quantum dot composition according to an embodiment is used to form an emission layer of a light emitting element to enhance luminous efficiency of the light emitting element including an emission layer formed through the quantum dot composition.

Abstract: A semiconductor package includes a die attach pad, a plurality of lead terminals positioned about the die attach pad and disposed along side edges of the semiconductor package, a semiconductor die mounted on the die attach pad, a molding compound encapsulating the plurality of lead terminals and the semiconductor die, and at least one dummy lead disposed in a corner region of the semiconductor package between the plurality of lead terminals.

Abstract: A display unit includes a plurality of pixels, a reflector layer, and an auxiliary electrode. Each of the plurality of pixels has a first electrode, an organic layer, and a second electrode in this order. The organic layer and the second electrode are provided on the first electrode. The organic layer includes a light-emitting layer. The reflector layer has a light-reflecting surface around each of the pixels. The auxiliary electrode is provided on the reflector layer and is projected from an upper end of the light-reflecting surface. The auxiliary electrode has a portion which is exposed from the organic layer, and the exposed portion is covered with the second electrode.

Abstract: A method for manufacturing a display device including forming a first color filter transmitting a first color light on a base substrate to overlap first light-emitting areas, forming a second color filter transmitting a second color light different from the first color light to overlap second light-emitting areas and a first portion of a light-blocking area disposed between the first light-emitting areas, forming a partition wall including a first opening continuously overlapping the first light-emitting areas and the first portion of the light-blocking area, providing a first composition including a wavelength-converting material in the first opening, and curing the first composition to form a first color-converting layer.