Patents Examined by Carl E. Hall
  • Patent number: 6357106
    Abstract: A method for mounting parts, and an IC card and its manufacturing method. The method reduces the number of steps, increases productivity, lowers costs, and miniaturizes the chip. A first electrode of the IC chip for processing signals received from a coil is connected to an internal end of a coil pattern formed on a first substrate, and an external end of the coil pattern and a second electrode of the IC chip are connected via a jumper wire.
    Type: Grant
    Filed: February 25, 1999
    Date of Patent: March 19, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Mitsumasa Oku, Takashi Akiguchi, Shinji Murakami, Yutaka Harada, Norihito Tsukahara, Mitsunori Yokomakura, Kenichi Sato
  • Patent number: 6353994
    Abstract: A base plate is used to attach the head/gimbal assembly of a disc drive to an actuator arm. The base plate has a boss which fits into an opening in the actuator arm. In one embodiment, the boss includes a plurality of raised portions defining a cylinder having a relaxed outer diameter greater than the inner diameter of the opening in the actuator arm. The outer surfaces of the plurality of portions engage the inner surface of the actuator arm to elastically deform and conform to and bias against the inner surface of the actuator arm, thereby providing a connection with superior holding friction, and retention torque.
    Type: Grant
    Filed: October 28, 1999
    Date of Patent: March 12, 2002
    Assignee: Seagate Technology LLC
    Inventors: Zine-Eddine Boutaghou, Richard August Budde
  • Patent number: 6351880
    Abstract: A multi-chip module has an integral capacitor element embedded within the substrate and comprises a plurality of substrate layers forming a multi-chip module substrate. The substrate has a cut edge and forms at the cut edge a bondable edge. A via is formed in the substrate, and a dielectric capacitive material fills the via for a plurality of substrate layers and defines a multilayer capacitor. The multilayer capacitor and via are positioned at the bondable edge and connects to the bondable edge. In one aspect, the via having the dielectric capacitive material is positioned at the cut edge, and includes a conductive material filling at least a portion of the cut via to form the bondable edge. The dielectric capacitive material and bondable edge form a junction surface. A signal trace can be formed on a substrate layer and connected to the capacitor to form a DC blocking capacitor structure. A ground line can be formed on one substrate layer and engage the capacitive material.
    Type: Grant
    Filed: December 2, 1999
    Date of Patent: March 5, 2002
    Assignee: Harris Corporation
    Inventors: Edward G. Palmer, Charles M. Newton
  • Patent number: 6349454
    Abstract: A thin film resonator (TFR) is produced with an improved piezoelectric film which is epitaxially grown on a growing surface, resulting in a piezoelectric film with less grain boundaries. Epitaxial growth refers to the piezoelectric film having a crystallographic orientation take from or emulating the crystallographic orientation of a single crystal substrate or growing surface. For example, by epitaxially growing a piezoelectric film on a single crystal silicon substrate as the growing surface, an improved piezoelectric film is produced with little or no grain boundaries. Also provided is a method of making a TFR in which the piezoelectric film is grown on a substrate. Subsequently, a portion of the substrate is removed, and the electrodes are deposited on either side of the piezoelectric film.
    Type: Grant
    Filed: July 29, 1999
    Date of Patent: February 26, 2002
    Assignee: Agere Systems Guardian Corp.
    Inventors: Michael James Manfra, Loren Neil Pfeiffer, Kenneth William West, Yiu-Huen Wong
  • Patent number: 6349455
    Abstract: A method for forming piezoelectric/electrostrictive film element at low temperature using electrophoretic deposition includes the steps of: dissolving or dispersing the raw material of constituent ceramic elements in a solvent or a dispersion medium; adding citric acid into the solution or the dispersed mixture; obtaining ultrafine ceramic oxide powder of particle size less than 1 &mgr;m with uniform particle diameter size distribution by forming ceramic oxide by a nonexplosive oxidative-reductive combustion reaction by thermally treating the mixed solution at 100-500° C.
    Type: Grant
    Filed: October 13, 1999
    Date of Patent: February 26, 2002
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Kyeong Yun, Dong Hoon Kim
  • Patent number: 6349464
    Abstract: A method of making a balance-compensated (BC) rotary actuator for use in a rotatable BC head stack assembly (HSA) portion in a disk drive based upon track-follow characteristics of a rotatable test HSA portion is provided. The test HSA portion includes a test rotary actuator having a test actuator weight specification. The test rotary actuator has an actuator body portion, a test pivot axis extending through the actuator body portion and a head connected to the actuator body portion. The test rotary actuator is controlled to rotate about the test pivot axis for positioning the head over a selected disk track. The test rotary actuator has a test rotary actuator center-of-gravity torque vector associated therewith about the test pivot axis. The method provides for vibrating the disk drive at a vibration frequency in order to vibrate the test HSA portion. Position error information is read using the head while performing a track-follow operation during the vibrating of the test HSA portion.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: February 26, 2002
    Assignee: Western Digital Technologies, Inc.
    Inventors: Raffi Codilian, Shawn E. Casey
  • Patent number: 6347441
    Abstract: A manufacturing method for a multilayered piezoelectric/electrostrictive ceramic actuator by sintering process at low temperature, making feasible a high quality image and high speed printing, as large displacement and high speed actuation are feasible because it can get greater displacement and driving speed, even with small variation in driving voltage, because of piezoelectric/electrostrictive layer and upper electrode being alternately heaped to produce a multilayer structure.
    Type: Grant
    Filed: October 29, 1999
    Date of Patent: February 19, 2002
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang Kyeong Yun, Dong Hoon Kim, Jong-Myeon Lee
  • Patent number: 6345433
    Abstract: An induction motor rotor comprises a rotor shaft, a rotor core, which may be solid or may include a plurality of rotor laminations, having rotor bar slots, a plurality of rotor bars extending through the rotor bar slots, and two rotor end rings brazed to the rotor bars and extending to the rotor shaft, the rotor bars and rotor end rings pre-stressing the rotor core.
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: February 12, 2002
    Assignee: General Electric Company
    Inventors: Gerald Burt Kliman, Raymond Alan White, Wen Liang Soong, Roger Neal Johnson, Joseph Eugene Miller, John Raymond Hughes
  • Patent number: 6345435
    Abstract: A method and design for the fabrication of a laminated yoke for a high data rate magnetic read-write transducer head. A full film layer of first ferromagnetic material is formed on a base using either plating or sputtering. The base comprises a read head, a ferromagnetic pole piece, and a ferromagnetic shield which also serves as a pole piece. A patterned layer of first non-magnetic dielectric is then formed on the full film layer of first ferromagnetic material. A patterned layer of photoresist is then formed on the full film layer of first ferromagnetic material and the patterned non-magnetic dielectric and used as a frame for a frame plating deposition of a patterned layer of second ferromagnetic material. The full film layer of first ferromagnetic material and the non-magnetic dielectric are then patterned, using the patterned layer of second ferromagnetic material as a mask and ion beam etching.
    Type: Grant
    Filed: November 22, 1999
    Date of Patent: February 12, 2002
    Assignee: Headway Technologies, Inc.
    Inventors: Cherng-Chyi Han, Chyu-Jiuh Torng, Rodney Lee, Kochan Ju
  • Patent number: 6343413
    Abstract: A chip inductor is made up of a coiled conducting wire and a magnetic member which is formed by sintering and in which the coiled conducting wire is embedded. Both end portions of the coiled conducting wire are exposed to both end surfaces of the magnetic member. External electrodes are formed with conducting thin films and are connected to respective end portions of the coiled conducting wire. An inorganic material is interposed in a clearance between winds of both end portions of the conducting wire and external surfaces of the magnetic member and a clearance between adjoining winds of the conducting wire.
    Type: Grant
    Filed: August 30, 2000
    Date of Patent: February 5, 2002
    Assignee: Taiyo Yuden Kabushiki Kaisha
    Inventors: Hiroyuki Masuda, Kinya Iri, Kenichiro Nogi, Nobuo Mamada
  • Patent number: 6341412
    Abstract: In electromagnetically operable valves which have been proposed, having a fuel inlet connecting piece which is surrounded by a magnet coil and is used as a core, at least a part of the valve is surrounded by a plastic sheath on which an electrical connecting plug is integrally formed. However, different valve extrusion coating tools are required depending on the embodiment of the electrical connecting plug. In the valve, the electrical connecting plug (21) is injection moulded at the same time as the extrusion coating of the magnet coil (4) and thus forms an independent plastic injection molding. Only one valve extrusion coating tool is now required for different embodiments of the electrical connecting plug, resulting in greater flexibility in the assembly line. The valve is used as an injection valve for fuel injection systems.
    Type: Grant
    Filed: November 21, 1997
    Date of Patent: January 29, 2002
    Assignee: Robert Bosch GmbH
    Inventors: Peter Romann, Ferdinand Reiter, Rudolf Babitzka
  • Patent number: 6341416
    Abstract: A dimple magnetic recording head in a transducer assembly for linear tape drives haviang a flat transducing surface extending laterally a partial width of the magnetic recording tape is mass produced by lapping a row of transducers on a substrate to form a flat transducing surface. The row of substrate elements is then diced into separate substrate elements. Two parallel, spaced apart tape support surfaces are provided extending laterally the full width of the tape, and one of the diced substrate elements is mounted intermediate the tape support surfaces with the flat transducing surface exposed for forming a tape facing surface.
    Type: Grant
    Filed: November 9, 1998
    Date of Patent: January 29, 2002
    Assignee: International Business Machines Corporation
    Inventors: Robert Glenn Biskeborn, James Howard Eaton
  • Patent number: 6341408
    Abstract: A method of manufacturing a multiple-element acoustic probe including piezoelectric transducers and an array of interconnections connecting the transducers to an electronic signal processing and control device. The probe also includes a continuous ground electrode integrated between the transducers and the acoustic matching elements, facing the piezoelectric transducers, the acoustic matching elements being totally uncoupled from one another mechanically. This probe may be used in medical imaging or underwater imaging.
    Type: Grant
    Filed: July 27, 1998
    Date of Patent: January 29, 2002
    Assignee: Thomson-CSF
    Inventors: Jean-Marc Bureau, Jean-Fran├žois Gelly
  • Patent number: 6341414
    Abstract: The resent disclosure relates to an inductance element and its preparation method. The inductance element comprises a coil structure, an insulation layer, a conductive metal layer and a metal core layer. The preparation method comprises, preparation of a coil structure, applying an insulation material on said coil structure to fix said coil structure, applying a conductive metal layer to form a multiple-layered core structure. In the preparation of the multiple-layered core structure, an intermittent plating approach is adopted, such that the cross-sectional area of the magnetic circuit may be increased. The coil structure applicable to this invention includes one prepared on a printed circuit board or a winded enameled wire coil structure. When a group of two coils is prepared, the inductance element may function as a transformer.
    Type: Grant
    Filed: September 30, 1999
    Date of Patent: January 29, 2002
    Assignee: Industrial Technology Research Institute
    Inventor: Tsung-Fu Leu
  • Patent number: 6341413
    Abstract: An electronic equipment such as a proximity sensor. A groove for discharging air is formed at coil casing (7) arranged at a front surface of the proximity sensor. An opening (43) is formed at a clamp portion (9) holding a code (10) behind a metal casing (8). The proximity sensor (1) is held at a low pressure, and resin is supplied through the opening (43) at the clamp portion (9), whereby the casing can be filled with the resin in a short time.
    Type: Grant
    Filed: August 5, 1999
    Date of Patent: January 29, 2002
    Assignee: Omron Corporation
    Inventors: Takeshi Shimizu, Hideo Uda, Giichi Konishi, Kyouji Kitamura, Kazuhiro Hayashi, Chikashi Niimi, Toshiki Kitani, Satoshi Noda
  • Patent number: 6339870
    Abstract: A method of manufacturing electrical windings, according to which it is possible to manufacture, with high efficiency, the electrical windings differing in function and capable of performing the functions required of the respective windings. In the steps of forming the windings by winding the conductors and applying insulation on the windings, there are formed the insulating layers 12, 22 and 32 suitable for the respective types of windings, viz. main pole coil 10, interpole coil 20 and compensating coils 30, and a same impregnating resin is impregnated and hardened in each of said main pole coil 10, interpole coil 20 and compensating coils 30.
    Type: Grant
    Filed: January 5, 1993
    Date of Patent: January 22, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Syoichi Maruyama, Sinichi Yamashiro, Kenji Mishima
  • Patent number: 6339872
    Abstract: A single-sided, notched write head is provided for writing narrow erase band servo tracks as well as a double-notched write head, and for writing data tracks better than a double-notched write head. The single-sided, notched write head writes a narrow erase band on the notched side and a wide erase band on the unnotched side. In one embodiment, only one side of the first pole piece layer is notched, and in another embodiment a first side of the first pole piece layer is notched more than a second side. By writing servo tracks only a fraction of the track width of the write head, a wide erase band region is overwritten so that a narrow erase band is on each side of the servo track. Data tracks are written with a narrow erase band on one side and a wide erase band on the other side. The wide erase band on one side of the data track allows more flexibility in spacing the read head from adjacent tracks.
    Type: Grant
    Filed: May 3, 2000
    Date of Patent: January 22, 2002
    Assignee: International Business Machines Corporation
    Inventors: Thomas Young Chang, Edward Hinpong Lee, Jyh-Shuey Jerry Lo
  • Patent number: 6332262
    Abstract: Flat knitted tinsel wires (2h) are sewn on a base cloth (B) of a conductive suspension (1) with a sewing thread (3) and the ends (2ha, 2hb) of the flat knitted tinsel wires extend outward from the conductive suspension (1). In this suspension device, a work load of peeling off the flat knitted tinsel wire ends (2ha and 2hb) from the base cloth (B) is reduced and associated problems are solved. The flat knitted tinsel wires (2h) are sewn on the base cloth (B), with the flat knitted tinsel wire ends (2ha, 2hb) being positioned at base close holes (B1), and thermally pressed and trimmed together with the base cloth (B).
    Type: Grant
    Filed: November 19, 1999
    Date of Patent: December 25, 2001
    Assignee: Kabushiki Kaisha Kenwood
    Inventor: Yoshio Sakamoto
  • Patent number: 6330742
    Abstract: In detecting a boundary line between areas different in light reflectance, it has so far been impossible to specify the boundary line at a distance shorter than the arrangement pitch of photodetectors (pixels) arranged in the camera. In the present invention, luminance variations near the boundary line between areas different in light reflectance are derivated. Further, in unit blocks G corresponding to pixels and arranged in a direction (Y direction) in which the boundary line extends, derivated values of luminance for each row of unit blocks are added and then a variation curve of the added values of derivated luminance values in unit block rows is drawn to specify a peak position thereof and also specify the position of the boundary line X0. Thus, it is possible to specify the position of the boundary line with a high accuracy at a distance shorter than the unit block pitch.
    Type: Grant
    Filed: July 29, 1998
    Date of Patent: December 18, 2001
    Assignee: Alps Electric Co., Ltd.
    Inventors: Toshiaki Ozawa, Shoichi Moriyama, Hiroshi Aimura
  • Patent number: 6327760
    Abstract: A piezoelectric/electrostrictive microactuator is made by forming piezoelectric/electrostrictive film using a mixture of the polyvinylidene fluoride, excellent in moldability and a ceramic powder, excellent in piezoelectricity. The powder has basic composition elements of lead titanium with a particle size below 5 &mgr;m, made by a nonexplosive oxidative-reductive combustion reaction at a relatively low temperature of 100-500° C. The piezoelectric/electrostrictive microactuator may be modulated in mechanical strength and linkability between particles by using an improved colloid process which can achieve low energy consumption and low cost, because the low temperature process is simplified by using ceramic powder calcined at low temperatures.
    Type: Grant
    Filed: October 29, 1999
    Date of Patent: December 11, 2001
    Assignee: Samsung Electro-Mechanics Co.
    Inventors: Sang Kyeong Yun, Dong Hoon Kim, Yeon Kyoung Jung