Patents Examined by Carl J. Arbes
  • Patent number: 10910152
    Abstract: A laminated core manufacturing device includes: an overlapping unit configured to overlap the plurality of laminated core materials conveyed along different conveyance routes; an edge position correction unit configured to align edge positions in a width direction of the plurality of laminated core materials between the plurality of laminated core materials and to correct shift of each edge position of the plurality of laminated core materials with respect to a standard edge position; an uplift prevention unit configured to prevent uplift of the plurality of laminated core materials; and a punching unit configured to punch out the plurality of laminated core materials which are overlapped by the overlapping unit and have been subjected to a process to align the edge positions and to correct shift of the edge positions performed by the edge position correction unit, and a process to prevent the uplift performed by the uplift prevention unit.
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: February 2, 2021
    Assignee: JFE Steel Corporation
    Inventors: Masanori Uesaka, Kunihiro Senda, Yoshihiko Oda, Yoshihide Kamitani, Yasuhito Shioiri
  • Patent number: 10912203
    Abstract: A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: February 2, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ryota Inoue, Naoki Azuma
  • Patent number: 10905012
    Abstract: Disclosed is a method of manufacturing a wiring board, which allows a desmearing process to be carried out appropriately without roughening a surface of an insulating layer. The method of manufacturing a wiring board includes a light irradiation step for irradiating a wiring board material with ultraviolet light in an atmosphere containing oxygen. The wiring board material has an insulating layer laminated on a conductive layer, a protective layer formed on the insulating layer, and a through hole (viahole) that penetrates the insulating layer and the protective layer. The method also includes a plating step for forming a plating layer, which is made from a conductive material, on the surface of the wiring board material from which the protective layer has been removed. The surface of the wiring board material includes a bottom of the through hole.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: January 26, 2021
    Assignee: USHIO DENKI KABUSHIKI KAISHA
    Inventors: Tomoyuki Habu, Shinichi Endo
  • Patent number: 10894419
    Abstract: A quick connect assembly includes a connector housing and fluid connectors that fluidly couple an ink assembly and a print assembly. The quick connect assembly also includes conductive connectors that conductively couple hardware circuitry in the ink assembly with hardware circuitry in the print assembly. First and second portions of the connector housing mate with each other to couple the fluid connectors and to couple the conductive connectors. The first and second housing portions mate with each other by rotating the first housing portion and/or the second housing portion relative to the other of the first housing portion and/or the second housing portion.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: January 19, 2021
    Assignee: Illinois Tool Works Inc.
    Inventors: Keith Allen Bartel, Robert E. Gehrin
  • Patent number: 10893613
    Abstract: A manufacturing method for a printed circuit board includes: transferring roughness of a metal film to an insulating layer by laminating the metal film on the insulating layer, the metal film having the roughness formed on one surface thereof and having a discrete metal layer laminated thereon; exposing a surface of the insulating layer, on which the roughness is transferred, by removing the metal film; processing the surface of the insulating layer having the roughness formed thereon with an acidic solution; and forming a circuit pattern on the insulating layer by a plating process.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: January 12, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong-Guk Kim, Chul-Min Lee, Sung-Jun Park, Dong-Chul Shin, Chang-Jae Lee, Seon-Hye Kim, Joong-Mo Hwang, Sim-Hwan Park, Myung-Gun Chong, Tae-Wook Jung
  • Patent number: 10886683
    Abstract: A method for manufacturing a terminal-equipped electric wire includes a coating forming process for forming, on a terminal-equipped electric wire having a terminal including a core wire crimping part that holds a core wire of an electric wire and a covering crimping part crimped to a covering of the electric wire, a coating of an ultraviolet-curing resin that integrally covers the core wire and the terminal, and an irradiating process for irradiating the coating with ultraviolet rays. At the coating forming process, while a discharge port that intermittently ejects droplets of the ultraviolet-curing resin and the terminal-equipped electric wire are moved relative to each other, the coating is formed from the ultraviolet-curing resin ejected from the discharge port. A direction of the relative movement of the discharge port and the terminal-equipped electric wire at the coating forming process includes directions orthogonal to an ejection direction of the droplets.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: January 5, 2021
    Assignee: YAZAKI CORPORATION
    Inventor: Masanori Onuma
  • Patent number: 10888013
    Abstract: Techniques for managing data center electronic devices in a data center include operating data center server devices that define a particular amount of computing power of a data center, the devices supported in server racks positioned in a frame assembly that includes bays defined along a lengthwise dimension of the frame assembly, the bays arranged in stacked layers that include at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays, the server racks positioned in at least one of the bays of the first or second layers of bays; determining that at least one of the server devices requires a maintenance operation; based on the determination, operating an automated service machine to move to a location in the data center that is adjacent to the data center server device; and performing the maintenance operation on the at least one data center server device with the automated service machine.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: January 5, 2021
    Assignee: Google LLC
    Inventors: Jayson Michael Jochim, Michael Chi Kin Lau, Bill Dailey, Angela Chen, Winnie Leung
  • Patent number: 10881041
    Abstract: A component mounting machine includes: a feeder device; a component transfer device; a splice portion detecting section detecting a splice portion further on a near side than a supply position of the feeder device; a passing determination section determining if the splice portion is in the passing state in which the splice portion is positioned within a passing area; a suction abnormality determination section determining the suction abnormality state in which a suction nozzle is not able to suck a component; a work defect determination section determining the splicing work defect when the suction abnormality state is determined and the splice portion is determined to be in the passing state; and an abnormality display section that performs dedicated abnormality display when the splicing work defect is determined.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: December 29, 2020
    Assignee: FUJI CORPORATION
    Inventor: Akira Hara
  • Patent number: 10879776
    Abstract: A joining method for coil ends includes: pressing a pair of tapered portions such that a pair of first pressing jigs provided with a pair of detent portions is brought closer to the coil ends along an axial direction of the stator core, the pair of detent portions being fitted to the tapered portions; fixing axial positions of the pair of tapered portions such that the pair of detent portions is fitted to the pair of tapered portions so that the pair of tapered portions is sandwiched in a circumferential direction; fixing radial positions of the pair of tapered portions such that the pair of tapered portions is sandwiched by a pair of second pressing jigs so that the tapered portions of the pair of tapered portions make contact with each other; and welding a contacting portion where the tapered portions make contact with each other.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: December 29, 2020
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Daisuke Mizushima, Yasuyuki Hirao
  • Patent number: 10881037
    Abstract: Printed circuit boards include conductive metallic paths, such as vias, traces, and pads on the printed circuit board. One or more metal additive structures are additively manufactured onto the printed circuit boards in a manner that forms a continuous weld with at least one of the conductive metallic paths. As a result, the metal additive structures are continuous with the printed circuit board and do not require separate attachment mechanisms (e.g., soldering or mechanical fastening). The metal additive structures may include shield cans, frames, antennas, or heat sinks for the printed circuit board, for example.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: December 29, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Kurt Allen Jenkins, Gary Russell McClary, Lincoln Matthew Ghioni
  • Patent number: 10875301
    Abstract: An actuator device includes: an actuator including a first element contact; and a wire member including (a) a first contact connected to the first element contact and (b) a first wire configured to conduct with the first contact. A first wide portion is formed at a distal end portion of the first wire at an edge portion of the wire member. The first wide portion is disposed beyond the first element contact in a wire direction of the first wire. The first contact is disposed at a basal end portion of the first wire. The basal end portion is located further from the edge portion of the wire member than the first wide portion. The first contact is connected to the first element contact.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: December 29, 2020
    Assignee: BROTHER KOGYO KABUSHIKI KAISHA
    Inventor: Toru Kakiuchi
  • Patent number: 10873177
    Abstract: A circuit breaker racking system and method may include a movable A-frame operable to attach to and release a circuit breaker, and move it forward and rearward along two space-apart arms. Rails associated with each of the arms may be movable upward and downward to lift and release the circuit breaker from a floor or platform. A drive screw assembly on the circuit breaker racking system may be actuated to pull a circuit breaker forward out of a cabinet or to push the circuit breaker back into the cabinet by engaging with a screw mounted to a wall of the cabinet. The circuit breaker racking system may be manually operated and moved about a control room, or may be remotely moved and actuated by an operator outside of the control room.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: December 22, 2020
    Assignee: ULC Robotics, Inc.
    Inventors: Benjamin J. Lagosz-Sinclair, Robert E. Kodadek, III
  • Patent number: 10874041
    Abstract: A power supply control device that controls consumption currents that are supplied from power supply devices in a component supply device in which multiple tape feeders are replaceably installed, the device including: a total consumption current measuring section that obtains, based on measurement, a total consumption current by adding actual consumption currents which are supplied to a plurality of tape feeders; and an overcurrent protection section that causes a specific tape feeder, which is in an operation state, to transition to a stop state or a standby state, in a case of an overcurrent state where the total consumption current exceeds an output current capacity of the power supply device. Accordingly, even though the overcurrent state occurs during setup changing work in which the multiple tape feeders can operate, the overcurrent state is rapidly canceled, and thus a protecting function is improved.
    Type: Grant
    Filed: November 27, 2015
    Date of Patent: December 22, 2020
    Assignee: FUJI CORPORATION
    Inventors: Kazuya Matsuyama, Yoshiyuki Fukaya, Hisato Sawanami
  • Patent number: 10869634
    Abstract: A device and method for manufacturing an implantable cardiac monitor device are provided. The method joins a feed-through assembly to a device housing having electronic components therein. The feed-through assembly includes conductors having distal ends connected to the electronic components and has proximal ends projecting from the feed-through assembly. The method assembles a header having a sensing electrode and an antenna embedded within a non-conductive header body. The electrode and antenna includes corresponding interconnection plates. The header body includes a housing mounting surface that includes at least one passage aligned with an interconnect cavity that includes the interconnection plates. The header body further includes a window exposing the interconnect cavity and interconnect regions.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: December 22, 2020
    Assignee: PACESETTER, INC.
    Inventors: Wisit Lim, Reza Imani, Brett Villacencio, Mitch Goodman, Ofer Rosenzweig
  • Patent number: 10861647
    Abstract: A method for manufacturing a monolithic ceramic electronic component includes preparing a mother block including ceramic green sheets stacked on each other, and an internal electrode pattern arranged along interfaces between the ceramic green sheets, cutting the mother block along first and second cutting lines that are perpendicular or substantially perpendicular to each other to obtain green chips each having a laminated structure including ceramic layers and internal electrodes in a raw state, the internal electrodes being exposed on a cut side surface produced by cutting along the first cutting line, forming a raw ceramic protective layer on the cut side surface to obtain a raw component body, and firing the raw component body, wherein the cut side surface is treated with a degreasing agent.
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: December 8, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yuya Takagi, Akira Fujita, Hideaki Tanaka, Togo Matsui
  • Patent number: 10863659
    Abstract: In a component mounter, a cut and clinch unit is arranged below a circuit board that is conveyed by a conveyance device, and the cut and clinch unit can be moved to a given position by a moving device. When imaging a fiducial mark of the circuit board using an imaging device, the cut and clinch unit is moved such that an identification assistance sticker arranged on the cut and clinch unit is positioned as the background to the fiducial mark. The color of the circuit board surrounding the fiducial is white and the color of the identification assistance sticker is black. Thus, the outline of the fiducial mark is clear and the fiducial mark can be appropriately recognized based on the image data.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: December 8, 2020
    Assignee: FUJI CORPORATION
    Inventors: Noriaki Iwaki, Kazuya Degura
  • Patent number: 10856764
    Abstract: A preferred conformal penetrating multi electrode array includes a plastic substrate that is flexible enough to conform to cortical tissue. A plurality of penetrating semiconductor micro electrodes extend away from a surface of the flexible substrate and are stiff enough to penetrate cortical tissue. Electrode lines are encapsulated at least partially within the flexible substrate and electrically connected to the plurality of penetrating semiconductor microelectrodes. The penetrating semiconductor electrodes preferably include pointed metal tips. A preferred method of fabrication permits forming stiff penetrating electrodes on a substrate that is very flexible, and providing electrical connection to electrode lines within the substrate.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: December 8, 2020
    Assignee: The Regents of the University of California
    Inventors: Shadi A. Dayeh, Farid Azzazy, Sang Heon Lee
  • Patent number: 10848038
    Abstract: A winding method for a BLDC motor is disclosed. The winding method is configured to successively wind two magnetic wires across each core slot and its adjacent core slot (over two pitches) in a brushless direct current (BLDC) motor including a U-phase winding, a V-phase winding, a W-phase winding and a GND winding, 12 core slots, and a ground terminal. The winding method includes: a first step of moving and winding the magnetic wires; a second step of moving and winding the magnetic wires; a third step of moving and winding the magnetic wires; a fourth step of moving, winding, moving, and cutting the magnetic wires; a fifth step of moving and winding the magnetic wires; and a sixth step of moving the magnetic wires, passing the magnetic wires through an adjacent core slot and the ground terminal, and moving and cutting the magnetic wires.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: November 24, 2020
    Assignee: Hyoseong Electric Co., Ltd.
    Inventor: Jingeun Jung
  • Patent number: 10847405
    Abstract: A semiconductor device manufacturing method includes: (A) orienting an upper surface of a semiconductor element which has the upper surface and a suction surface of a collet which has a suction hole so that the upper surface of the semiconductor device and the suction surface of the collet face each other, the upper surface including a first region and a second region, the second region lying higher than the first region; (B) bringing the suction surface of the collet into contact with a part of the second region of the semiconductor element; and (C) picking up the semiconductor element using the collet while the collet sucks in air between the first region and the suction surface via the suction hole, wherein in (B), an entirety of an uppermost surface of the second region is in contact with a region of the suction surface exclusive of the suction hole.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: November 24, 2020
    Assignee: NICHIA CORPORATION
    Inventor: Kensuke Yamaoka
  • Patent number: 10842026
    Abstract: An object printing system printer enables printing of electrical circuits on non-planar areas of objects and the accurate placement of electronic components within the printed circuits. The system includes a direct-to-object printer and an electronic component placement system. The direct-to-object printer is configured to form an electrical circuit on an object secured within the direct-to-object printer. The electronic component placement system is configured to retrieve an electronic component and install the electronic component in the electrical circuit on the object secured within the direct-to-object printer in response to the direct-to-object printer generating a signal for the electronic component placement system that indicates the electronic component is to be installed in the circuit on the object secured within the direct-to-object printer.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: November 17, 2020
    Assignee: Xerox Corporation
    Inventors: Chad S. Smithson, Ethan Shen, Johann Junginger, Tianxiao Xu