Abstract: A changeover operation configuration device for use in a component mounting line including a registration section configured to register information of at least one of line layout information related to an arrangement of the component mounting line, work area layout information related to an arrangement of a work area at which the changeover operation is to be performed, and personnel quantity information of a quantity of operators who are to perform the changeover operation; an aggregation section configured to select the component type for which to perform changeover operation from the multiple component types, aggregate the component types to a restricted quantity of the component supply devices and designate the component supply devices as work targets; and a setting section configured to set an arrangement position of the component supply devices that are the work targets based on the at least one of the registered information.

Abstract: A component feeding device includes a cover tape lifting portion that carries out a lifting process of lifting a cover tape of a component storage tape, which travels along first guide surface portions, and a cover tape post-processing portion that carries out post-processing. The first guide surface portions are formed into curved shapes. The cover tape lifting portion includes a lifting extent adjusting portion that continuously increases an extent of lifting of the cover tape off a carrier tape. The cover tape post-processing portion includes an upper regulating portion that pushes the cover tape having been subjected to the lifting process outward in a tape width direction. The gap between the first guide surface portions and the upper regulating portion is determined such that the gap becomes narrower as the gap extends from the upstream side to the downstream side in the tape send-off direction.

Abstract: A component feeding device includes a component exposing unit and a tape traveling guide unit. The component exposing unit lifts a cover tape of a component storage tape, and pushes a lifted part of the cover tape outward while folding the lifted part downward. The tape traveling guide unit guides the component storage tape to help it in traveling. The tape traveling guide unit includes a guide body and opening width defining members fitted to the guide body. The guide body has an opening serving as an opening for taking out a component, and a cover tape path demarcating portion that demarcates a path through a lifted part of the cover tape passes. Each of the opening width defining members defines the opening width of the opening, and applies a downward pressure to a first specific area of an upper surface of the carrier tape.

Abstract: An electronic component mounting device including a component holding device to hold and mount on a board an electronic component supplied by a component supply device; a motor to drive the component holding device; a motor control device to control the motor; a load measurement device to measure a load applied from the component holding device upon being pressed by the component holding device while the component holding device performs the same operation as when mounting an electronic component on a board, by replacing the board with the load measurement device; a motor information acquisition section to obtain motor information corresponding to the force with which the motor drives the component holding device in the pressing direction against the load measurement device while the motor control device performs the same operation as when mounting an electronic component on the board, by replacing the board with the load measurement device.

Abstract: A system and method for reworking a flip chip includes use of a mill to remove an old flip chip, and a pick-and-place device for putting a new flip chip in place at the same location. The process may be automated, with the removal and the placement occurring sequentially without need for operator intervention. Other devices and processes may be part of the system/machine and process, for example cleaning following the milling, fluxing prior to the placement, and heating to cause solder reflow, to secure the new flip chip in place. Underfill may be employed to make for a more mechanically robust mounting of the new flip chip.

Abstract: To carry out accurate defect inspection over a wide area, a defect inspection device includes: a radiation source section configured to emit an electromagnetic wave to a separator roll; and a sensor section configured to detect the electromagnetic wave that the radiation source section has emitted to the separator roll, the sensor section being configured to detect the electromagnetic wave before and after the separator roll is moved relative to the radiation source section.

Abstract: A stacking structure is applicable to manufacturing a circuit board. The stacking structure includes a transferring layer and a dielectric layer disposed on the transferring layer. The transferring layer includes a substrate and a thin film disposed on the substrate and having a plurality of recess structures thereon. The recess structures are connected as a single piece and bottom portions and top portions of the recess structures are configured to arrange in a staggered manner to form a multi-dimensional arrangement. At least a portion of the dielectric layer being is located in the recess structures, such that the dielectric layer is at least embedded with the recess structures.

Abstract: Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.

Abstract: Systems and methods are provided to produce electromechanical interconnections within integrated circuits (ICs), printed circuit boards (PCBs) and between PCBs and other electronic components such as resistors, capacitors and integrated circuits. Elements include so-called “smart pins” or “neuro-pins” that facilitate electrical pathways in the dimension normal to the plane of a PCB. Smart pins or neuro-pins may be inserted using automated processes that do not require the high temperatures normally associated with soldering. Resultant circuits generally contain a large number of layers that are more compact and more readily constructed compared with conventional PCB-based circuitry.

Abstract: A conductive network fabrication process is provided and includes filling a hole formed in a substrate with dielectric material, laminating films of the dielectric material on either side of the substrate, opening a through-hole through the dielectric material at the hole, depositing a conformal coating of dielectric material onto an interior surface of the through-hole and executing seed layer metallization onto the conformal coating in the through-hole to form a seed layer extending continuously along an entire length of the through-hole.

Abstract: The present invention relates to a method for forming a circuit using a seed layer. The method for forming a circuit using a seed layer according to the present invention, may realize a fine pitch, increase the adhesion of the circuit, and prevent the migration phenomenon.

Abstract: A component mounting device described herein includes a tape driving section (a driving shaft motor, a front-side sprocket, a timing belt) feeding forward component tapes including components, a tape guide section guiding downward an empty tape that has no component as a result of suctioning with a suction nozzle, a tape cutting section disposed below the tape guide section and cutting the empty tape according to determination that the component tape has no component, and a tape discharge section disposed below the tape cutting section and discharging downward a cut part of the empty tape.

Abstract: An informing device includes a loading section feeding automatically a subsequent component tape that is preset in the tape feeder when the component tape that is being fed by the feeding device has no component. A controller is configured to determine whether the component tape that is being fed by the feeding device and the subsequent component tape are present in the tape feeder or only one of the component tape and the subsequent component tape is present in the tape feeder based on a management table, and configured to control a display section to inform that the subsequent component tape can be preset in the tape feeder before the subsequent component tape is preset when only one of the component tapes is present in the tape feeder.

Abstract: Conductively coated fastening systems are disclosed herein. An apparatus includes a fastening system and a structural assembly. The structural assembly comprises a first structural element made of an electrically conductive fiber reinforced plastic and a second structural element. The first structural element comprises a first hole and the second structural element comprises a second hole. The first and second holes are separately pre-formed prior to assembly of the structural assembly. The structural assembly further comprises an electrically conductive gap filler applied to a first structural element sidewall of the first hole of the first structural element. The fastening system comprises a fastener comprising a head and a shank extending from the head. The shank is configured to be inserted into the first hole and the second hole.

Abstract: A method of fabricating a circuit board includes forming a conductive layer on a surface of a substrate, and patterning the conductive layer to define a plurality of plating regions and a plurality of plating lines. The plating regions have at least two different sizes, a first group of the plating regions are interconnected by a first plating line of the plating lines, and a second group of the plating regions are interconnected by a second plating line of the plating lines. A ratio of a total area of the first group of the plating regions to a total area of the second group of the plating regions is from about 1 to about 5. A solder mask is formed on the surface of the substrate to cover the plating lines and partially expose the plating regions. At least one metal layer is electroplated on the exposed plating regions.

Abstract: A crimp tool calibration system for crimping a prepared wire into a corresponding contact wire barrel includes a computer, a positioner having a memory chip storing positioner data, and a tool frame. The tool frame includes a head having a receiving port therethrough, and configured for the positioner to be removably engaged with the receiving port during a crimping operation. The tool frame also includes a plurality of crimping dies positioned around a periphery of the receiving port, an adjustment device to adjust a crimp depth, and a positioner interface coupled to the tool frame. The positioner interface includes a tool memory for storing tool data, a reader, and a transmitter, where the reader is configured to read the positioner data stored on the memory chip of the positioner, and the transmitter is configured to transmit the positioner data and the tool data to the computer.

Abstract: A component mounting system including multiple component mounting devices to collect components from feeders set at multiple feeder holding sections and mount the components on a board, the multiple feeder holding sections being provided on each of the multiple component mounting devices to removably hold the feeders; and a feeder exchanging device to move along a line along which the multiple component mounting devices are arranged and exchange feeders with respect to each of the component mounting devices. The component mounting system acquires a type and arrangement of each of the feeders set on the multiple component mounting devices, determines whether each of the feeders is set at a predetermined appropriate position, and upon determining that there is a feeder that is not set at the appropriate position, uses the feeder exchanging device to reset the feeder that is not set at the appropriate position.

Abstract: In a component supply device, an opener is configured to move in a second direction with movement of a tape in the second direction when the tape is fed in the second direction opposite to a first direction in which the tape is fed from a tape feeder to the opener.

Abstract: A surface mounter including a component holder that holds a component, which includes a light emitter to emit light and a package having a step between the light emitter and the package along a peripheral edge of the light emitter, and a light irradiator that forms a first shadow along the step by irradiating light toward the component. The component holder further includes an imager that images an image including the first shadow, a position recognizer that recognizes a position of the light emitter from a position of the imaged first shadow, a mounting head that mounts the component taken out from the component holder on a board, and a mounting controller that controls a position where the mounting head mounts the component on the board on the basis of the position of the light emitter recognized by the position recognizer.

Abstract: A component mounting line includes a plurality of component mounting apparatuses, each of which mounts solder and a component other than the solder on a substrate. The component mounting line includes: a time limit management unit configured to manage an elapsed time period of a member; and a usability determiner that determines whether the member is usable based on the elapsed time period of the member. The elapsed time period is a time period that has elapsed after the member is exposed to the air, and the member comprises at least one of a substrate, solder, and a component other than the solder.