Patents Examined by Carl J. Arbes
  • Patent number: 10785586
    Abstract: The present invention relates to the technical field of electroacoustic products, and discloses sound-absorbing material, sound-absorbing particle, speaker module manufacturing processes, a particle and a module. The process comprises the following steps: placing a raw powder of a porous sound-absorbing material into a heating furnace to perform calcination, and introducing a processing gas during the calcination, wherein the calcination temperature is 120° C. to 800° C., and the calcination time is 6 h to 72 h.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: September 22, 2020
    Assignee: GOERTEK INC.
    Inventors: Jinli Liu, Xiaodong Cao
  • Patent number: 10773051
    Abstract: A method of manufacturing a flexible catheter with a locatable sensor includes non-rotatably coupling a spool with a wire to a first portion of a spool carrier, non-rotatably coupling the spool carrier to a catheter body, and rotating the spool carrier with the catheter body, thereby wrapping a portion of the wire about a distal end portion of the catheter body to form a wrapping layer.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: September 15, 2020
    Assignee: COVIDIEN LP
    Inventors: Daniel A. Ranum, Brian T. Stolz, Nathan J. Knutson
  • Patent number: 10773053
    Abstract: A method of manufacturing a flexible catheter with a locatable sensor includes simultaneously rotating first and second spools about a common axis, whereby first and second leads of a wire twist together to form a twisted pair of the wire, and rotating a catheter body about a longitudinal axis defined by the catheter body, whereby the twisted pair of the wire wraps about a proximal end portion of the catheter body.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: September 15, 2020
    Assignee: COVIDIEN LP
    Inventors: Daniel A. Ranum, Brian T. Stolz, Nathan J. Knutson, David M. Costello
  • Patent number: 10775000
    Abstract: An automatic process of making a LED bulb comprising: automatic manufacturing of a glass core column with a driving chip and a resistor, automatic welding of an LED wick, automatic sealing and venting of a lamp cover and the wick and gas protection, automatic installation of a lamp holder, and automatic optical inspection and packaging. With the automatic process, which is a substitution for the manual production having a high cost labor and which reduces the uncertainty of the quality, continuous all-day production without interruptions is achieved, and the production efficiency and quality are improved.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: September 15, 2020
    Assignee: Dongguan Miray E-Tech Co., Ltd.
    Inventor: Jianwen Lei
  • Patent number: 10777457
    Abstract: A method of manufacturing, a carrier, and a semiconductor package are provided. The method involves depositing a plurality of conductive vias, applying a molding material over the lead frame, grinding the molding material to expose the plurality of conductive vias, and depositing a metalized pattern over the molding material. The carrier is manufacture by this method and the semiconductor package is formed based on the carrier.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: September 15, 2020
    Assignee: UBOTIC COMPANY LIMITED
    Inventor: Ming-Wa Tam
  • Patent number: 10773949
    Abstract: A method of manufacturing an electronic device includes providing a component carrier having a laminate of at least one electrically conductive layer structure and at least one electrically insulating layer structure, providing a mounting base for mounting an electronic component on and/or in the component carrier, and integrally forming a wall structure with the component carrier prior to mounting an electronic component on the mounting base, the integrally formed wall structure at least partially surrounding the mounting base for mounting the electronic component on the mounting base and protected by the wall structure.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: September 15, 2020
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Heinz Moitzi
  • Patent number: 10774434
    Abstract: The present invention relates to nonferrous metallurgy, in particular to the process equipment for electrolytic production of primary aluminum, namely to methods for lining cathode assemblies of reduction cells. The method for lining a cathode assembly of a reduction cell for production of aluminum comprises filling a cathode assembly shell with a thermal insulation layer, forming a fire-resistant layer followed by the compaction of layers, installing bottom and side blocks followed by sealing joints therebetween with a cold ramming paste. According to the first embodiment of the present invention, a resilient element made of a dense organic substance is placed between the thermal insulation layer and the fire-resistant layer. According to the second embodiment of the present invention, a flexible graphite foil is placed between the thermal insulation layer and the fire-resistant layer, and under the flexible graphite foil, a resilient element made of a dense organic substance is placed.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: September 15, 2020
    Assignee: United Company Rusal Engineering and Technology Centre LLC
    Inventors: Aleksandr Vladimirovich Proshkin, Vitalij Valer'evich Pingin, Samuil Yakovlevich Levenson, Andrej Gennad'evich Sbitnev, Aleksej Vasil'evich Morozov, Aleksej Sergeevich Zherdev
  • Patent number: 10770857
    Abstract: An electronic equipment assembly apparatus includes a cable holding tool, a work stage, and a robot unit. The cable holding tool holds the cable. The work stage holds the electronic equipment. The robot unit relatively moves the cable holding tool with respect to the electronic equipment held by the work stage. The cable holding tool includes a contactor and a width direction regulator. The contactor holds the cable by vacuum-sucking. The width direction regulator regulates a position in a width direction of the cable which comes into contact with the contactor.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: September 8, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ikuo Kobayashi, Takao Ojima, Minoru Yamamoto
  • Patent number: 10770648
    Abstract: A composite wafer has an oxide single-crystal film transferred onto a support wafer, the film being a lithium tantalate or lithium niobate film, and the composite wafer being unlikely to have cracking or peeling caused in the lamination interface between the film and the support wafer. More specifically, a method of producing the composite wafer, includes steps of: implanting hydrogen atom ions or molecule ions from a surface of the oxide wafer to form an ion-implanted layer inside thereof; subjecting at least one of the surface of the oxide wafer and a surface of the support wafer to surface activation treatment; bonding the surfaces together to obtain a laminate; heat-treating the laminate at 90° C. or higher at which cracking is not caused; and applying ultrasonic vibration to the heat-treated laminate to split along the ion-implanted layer to obtain the composite wafer.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: September 8, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Shoji Akiyama, Makoto Kawai
  • Patent number: 10765050
    Abstract: A component mounting system includes a component mounting line in which a plurality of processing devices are connected to constitute the component mounting line and a management device (management computer) connected to the component mounting line by a network, and each of the plurality of processing devices can be remotely operated via the network by an input unit of the management device. In this component mounting system, a remote operation right allowing a remote operation is set with respect to the management device (ST21), and the remote operation right set with respect to the management device is released (ST23) in a case where a specific operation set in advance with respect to the one or more processing devices is performed (Yes in ST41) in a state where the remote operation right is set with respect to the management device.
    Type: Grant
    Filed: January 18, 2017
    Date of Patent: September 1, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tetsushi Oohori, Kenichiro Ishimoto, Atsushi Nakazono
  • Patent number: 10763596
    Abstract: Following the cylindrical bend processing of the shape crimping portion corresponding part corresponding to the crimping section in the sheet-shaped terminal base material, the high bending-rate processing process of bend processing at a bending rate higher than a bending rate for plastically deforming at least a part of a deformation portion to be plastically deformed in a predetermined bend processing shape in the crimping portion corresponding part, and the shaping process of shaping the crimping portion corresponding part into the cylindrical crimping section are performed in this order.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: September 1, 2020
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA AUTOMOTIVE SYSTEMS, INC.
    Inventors: Ryusuke Terashima, Mikio Kuwabara, Kentaro Sakamoto
  • Patent number: 10751782
    Abstract: At least one caulking group (13) that includes a plurality of caulking parts (14, 15) with different directions is formed on a plurality of thin plates (10) placed in a stacked state to fix the position of the stacked thin plates (10), and then a preset punching process is performed with respect to the thin plates (10) that have been positioned with pilot holes (12). This makes it possible to perform a high-accuracy punching process when punching the plurality of thin plates (10) placed in a stacked state, since positional deviations between the thin plates (10) are avoided and pilot pins (11) are prevented from deforming the periphery of the pilot holes (12).
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: August 25, 2020
    Assignee: Mitsui High-tec, Inc.
    Inventors: Akihiro Hashimoto, Tadashi Iida, Masahiro Izumi
  • Patent number: 10750648
    Abstract: A component mounting apparatus sets a position that is offset with respect to a suction reference position of a component toward the front side in a feeding direction as a suction position based on a difference between a dimension of the recess-shaped cavity in the Y-direction and a dimension of the component accommodated in the cavity in the Y-direction and sucks the component. Therefore, even if the component in the cavity positionally deviates toward the front side in the feeding direction due to inertia when a carrier tape is stopped, a suction nozzle sucks an appropriate position of the component.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: August 18, 2020
    Assignee: FUJI CORPORATION
    Inventor: Takeshi Sakurayama
  • Patent number: 10743423
    Abstract: A manufacturing method of a composite substrate is provided. A first conductive layer is formed on a first liquid crystal polymer layer. The first conductive layer is patterned to form a patterned first conductive layer. A second liquid crystal polymer layer including a soluble liquid crystal polymer is formed to cover the patterned first conductive layer. The second liquid crystal polymer layer which is on the patterned first conductive layer is removed.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: August 11, 2020
    Assignee: AZOTEK CO., LTD.
    Inventor: Hung-Jung Lee
  • Patent number: 10729014
    Abstract: A method for manufacturing a circuit board includes forming a patterned first dielectric layer on a substrate; forming a first adhesive layer on the patterned first dielectric layer; forming a second dielectric layer on the first adhesive layer; patterning the second dielectric layer to expose a portion of a top surface of the first adhesive layer opposite to the substrate; and filling at least the patterned second dielectric layer with a conductive material, such that the conductive material is in contact with the top surface of the first adhesive layer.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: July 28, 2020
    Assignee: Unimicron Technology Corp.
    Inventor: Po-Hsuan Liao
  • Patent number: 10720258
    Abstract: A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: July 21, 2020
    Assignee: HITACHI METALS, LTD.
    Inventors: Seigi Aoyama, Toru Sumi, Takashi Hayasaka, Ryohei Okada, Detian Huang, Tamotsu Sakurai, Satoshi Yajima, Minoru Takatsuto, Hiroshi Bando
  • Patent number: 10721815
    Abstract: A conductive interconnect structure comprises a polymeric substrate (e.g., a thermoplastic) and a plurality of compliant conductive microstructures (e.g., conductive carbon nanofibers) embedded in the polymeric substrate. The microstructures can be arranged linearly or in a grid pattern. In response to heating, the polymeric substrate transitions from an unshrunk state to a shrunken state to move the microstructures closer together, thereby increasing an interconnect density of the compliant conductive microstructures. Thus, the gap or pitch between adjacent microstructures is reduced in response to heat-induced shrinkage of the polymeric substrate to generate finely-pitched microstructures that are densely pitched, thereby increasing the current-carrying capacity of the microstructures.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: July 21, 2020
    Assignee: Raytheon Company
    Inventors: Kyle L. Grosse, Catherine Trent
  • Patent number: 10714125
    Abstract: A magnetic recording head having air bearing surface (ABS) includes a main pole, a side shield laterally spaced from the main pole by a first side gap and a second side gap, an electrically conductive non-magnetic gap material layer disposed between the main pole and the side shield in the first side gap, and a dielectric non-magnetic gap material matrix and a conformal dielectric spacer layer disposed between the main pole and the side shield in the second side gap.
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: July 14, 2020
    Assignee: SANDISK TECHNOLOGIES LLC
    Inventors: Jinqiu Zhang, Ming Sun, Feng Liu, Xiaojun Zhang
  • Patent number: 10707635
    Abstract: Provided is a method for providing a wire connection to a printed circuit board. The method includes attaching a first end of a wire at a first location on the printed circuit board and attaching a second end of the wire at a second location of the printed circuit board, to form an arched wire. The method further includes applying an encapsulant on the printed circuit board, the encapsulant forming a film through which the arched wire protrudes. Furthermore, the method includes cutting the arched wire to yield an out-of-plane wire connected to the printed circuit board.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: July 7, 2020
    Assignee: CURRENT LIGHTING SOLUTIONS, LLC
    Inventors: Eden Dubuc, Hubert Cardinal
  • Patent number: 10707010
    Abstract: Multiple methods are provided to paint a body of an inductor so that there is no residual glue remained in the lead that may cause extra cleaning work and soldering issues when the lead is soldered with an external circuit.
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: July 7, 2020
    Assignee: CYNTEC CO., LTD.
    Inventor: Sen-Huei Chen