Abstract: A cover for a socket that is to be soldered to a printed circuit board is described. The socket has connections to be soldered to the printed circuit board and connections to contact a die that will be carried by the socket. The socket includes a top surface to cover the die contacts of the socket and side walls surrounding the top surface and extending toward the socket to separate the top surface from the die contacts. The top surface has a plurality of inlet vents, and the side walls have a plurality of outlet vents.

Abstract: Disclosed therein are an apparatus for and a method of automatically welding a flange to a guide thimble tube in a nuclear fuel assembly. The automatic welding apparatus includes: a welding part located on an axially conveying line of a tube for welding a welded surface of the tube inserted thereinto and a welded surface of a flange; a flange supplying part for supplying the flange at a tube inlet of the welding part onto the axially conveying line; and a conveying part mounted on the axially conveying line in such a way as to move the tube and the flange on the axially conveying line, so that they are inserted into and drawn from the welding part.

Abstract: A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. In this case, it is preferable that the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.

Abstract: A method of room-temperature bonding a plurality of substrates via an intermediate member, includes: forming the intermediate member on a surface to be bonded of the substrate by physically sputtering a plurality of targets; and activating the surface to be bonded by an ion beam. Preferably, the target composed of a plurality of types of materials is physically sputtered. Since the materials of the intermediate member are sputtered from the plurality of targets arranged in various directions from the surface to be bonded of the substrate, the intermediate member can be uniformly formed on the surface to be bonded. Further, since the intermediate member is composed of the plurality of types of materials, the room-temperature bonding of substrates difficult to bond together when an intermediate member is composed of a single type of material can be performed without heating and excessively pressing the substrates during bonding.

Abstract: A method of forming an internal structure in a hollow component that includes the steps of forming an assembly having first, second, and third plates the first and second plates each with a substantially planar surface and a surface that includes at least one protrusion and is on the exterior facing surfaces of the assembly. The third plate is sandwiched between the first and second plates. The method also includes the steps of selectively bonding portions of the third plate to sections of the first and second plates substantially opposite the at least one protrusions of the first and second plates; and forming the assembly against a die such that the at least one protrusions of the first and second plates are transferred from the exterior facing surfaces to the interior facing surfaces of the first and second plates.

Abstract: Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an enclosure for providing an inerting gas into an atmosphere above a solder reservoir during soldering of a work piece comprising: a tube in fluid communication with an inerting gas source wherein the tube comprises one or more openings for the flow of the inerting gas therethrough, a base wherein the tube resides in therein and comprises an interior volume, a neck comprising an opening and an interior volume in fluid communication with the interior volume of the base, and a cap proximal to the opening wherein the inerting gas source travels through the tube into the interior volume and into the atmosphere through the opening defined by the neck and cap.

Abstract: A mandrel tool probe is provided for performing a friction-stir process. The mandrel tool probe includes a shank and a tip coupled to the shank, where the shank and tip are concentric and rotatable about a given axis. The tip includes a set of a plurality of physically-separate, spiraled surfaces each of which has a linear or curved cross-section that extends along a length of the tip at a constant or varying spiral angle around the circumference of the tip. The tip also has a cross-section with a constant shape along the length of the tip, with the cross-section of the tip including a plurality of major segments each of which is formed of the cross-section of a respective spiraled surface.

Abstract: A solder paste mounting tool is provided, and includes a base, a positioning plate, a screen plate, and a pushing element. The base includes a first surface, a second surface, a through hole extending through the first surface and the second surface, a first chip accommodating portion, and positioning pillars. The first chip accommodating portion and the positioning pillars are located on the first surface, and the position of the first chip accommodating portion is corresponding to the position of the through hole. The positioning plate includes a second chip accommodating portion and first positioning holes corresponding to the positioning pillars. The screen plate includes a mesh region and second positioning holes corresponding to the positioning pillars. The pushing element is movably disposed in the through hole and includes a first end portion and a second end portion.

Abstract: A solder paste transfer process is provided and includes defining an arrangement of solder pad locations on a surface, applying solder paste onto a transfer tool in a pre-defined configuration reflective of the arrangement, disposing the transfer tool in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the transfer tool to the solder pad locations.

Abstract: In joining an Fe-based metallic member comprising an Fe-based material and an Al-based metallic member comprising an Al-based material by a Zn-based filler metal, a joined part of the Fe-based metallic member is heated at a temperature higher than a melting point of the Fe-based material.

Abstract: A method is taught for creating a hollow sphere that is created by joining two cylinders together that have a semispherical hollow formed in the ends being joined together, wherein a metallic reinforcing disk is inserted at an interface between the two ends of the cylinders, wherein the two cylinders and reinforcing disk are joined using friction stir welding to create an inner sphere from the two hemispherical hollows that is bisected by the metallic reinforcing disk, and wherein the joined cylinders and reinforcing disk are machined to thereby create an outer spherical surface that is centered around the inner sphere.

Abstract: Wire is fed to a bonding tool of a wire bonder by a pneumatic device that is operative to urge the wire to feed through an outlet of the pneumatic device towards the bonding tool. A wire clamp is located adjacent to the outlet of the pneumatic device and a wire guider with a hole is located adjacent to the wire clamp between the wire clamp and the bonding tool for threading the wire through the hole before being fed to the bonding tool.

Abstract: A brazing method includes the steps of providing a first part and a second part, at least a first portion of the first part is configured to fit inside a second portion of the second part, preplacing a first self-fluxing braze alloy on one or more of the first portion and second portion, preplacing a non-phosphorous braze alloy on the first self-fluxing braze alloy, preplacing another layer of the first self-fluxing braze alloy on the non-phosphorous braze alloy, thermally treating at least one of the first portion and second portion, to create a temperature differential between the first portion and second portion, inserting the first portion into the second portion, and heating at least one of the first portion and second portion to melt both layers of the first self-fluxing braze alloy and the non-phosphorous braze alloy. The first portion is joined by brazing to the second portion.

Abstract: [Problems] To provide a process for producing a thermal sprayed, metal plated steel tube having a metal layer substantially uniform and favorable over the whole surface in a highly productive manner. [Means for solving] A process for producing a metal tube comprising continuously forming a metal plate composed of a first component into a tubular shape and continuously welding its butted ends to form the metal tube, wherein, after the continuous welding, a metal layer composed of a second component which is different from the first component is formed by thermal spraying directly over the surface of the metal tube, the metal layer having no discontinuities in the circumferential and lengthwise directions. Especially it is preferred that the process comprises a process step of making the thickness distribution of the metal layer more uniform after formation of the thermal sprayed metal layer over the external surface.

Abstract: A method for manufacturing a module with a hollow area by hot isostatic compression, including: making an assembly including superposed elements defining the hollow area, the assembly forming a sealed casing containing the hollow area, including at least one meltable obturation member separating the hollow area from the outside of the assembly; followed by hot isostatic compression of the assembly, to obtain diffusion-welding of its elements, by letting temperature and pressure conditions change over time to cause a rupture of the meltable obturation member allowing pressurization gas to penetrate into the hollow area.

Abstract: The invention relates to a device for supplying inert gas in order to protect the surface of a solder bath in a wave soldering installation and the components to be soldered against oxidation. Wave soldering installations form solder waves over which parts to be soldered are transported. The parts to be soldered are generally electronic printed circuit boards which have electronic components soldered onto their undersides by the solder wave making contact with the printed circuit board.

Abstract: A process for cohesive bonding between a metal surface and a nonmetallic substrate is provided. The non-metallic substrate may comprise a plurality of microfilaments and/or nanofilaments dispersed into and below the surface of the substrate. The application of pressure and laterally-oriented high frequency and low amplitude vibration may allow for diffusion bonding between the metal surface and material of the nanofilaments. Another method includes discharging energy from a bank of capacitors to melt adjoining surfaces of the metal surface and nonmetallic substrate. Additionally, a cohesive bonding method may further comprise converting electrical oscillations of ultrasonic frequency into ultrasonic vibrations which are transmitted to the metal body and/or substrate for fusing the two materials together.

Abstract: A mobile manufacturing platform is provided. The mobile manufacturing platform has a base, a cutting platform, and a welding platform. Additionally the mobile manufacturing platform has a rail system capable of moving the stock material in X, Y, Z coordinates around the platform. Stock material can be manufactured into a final desired piece at a building site by being cut on the cutting platform and then welded on the welding platform. A finishing station for painting and other finishing may also be added. The mobile manufacturing platform can be moved from building site to building site or wherever on-site manufacturing is preferred.

Abstract: Methods of connecting solder bumps located on dies to leads located on substrates are disclosed herein. One embodiment includes applying a first compression force between the solder bump and the lead; relieving the first compression force between the solder bump and the lead; and applying a second compression force between the solder bump and the lead.

Abstract: A method of operating a wire bonding machine is provided. The method includes the steps of: (1) providing a workpiece secured in a bonding position by a device clamp of a wire bonding machine; (2) raising the device clamp to a first height above the workpiece, the device clamp remaining at the first height for a first predetermined period of time; and (3) raising the device clamp to a second height above the workpiece after step (2), the second height being further away from the workpiece than the first height.