Abstract: It is an object of the present invention to provide an electrodeposited copper foil which has a lower profile and a higher gloss than low-profile electrodeposited copper foil conventionally supplied in markets. For achieving this object, the present invention employs an electrodeposited copper foil which has a super low profile, the surface roughness (Rzjis) of the deposit side of lower than 1.0-micron meter, and the gloss [Gs(60-deg.)] thereof of not lower than 400 irrespective to its thickness. The present invention also provides a manufacturing method of an electrodeposited copper foil obtained by electrodeposition using a sulfuric acid base copper electrolytic solution obtained by adding 3-mercapto-1-propanesulfonic acid and/or bis(3-sulfopropyl)disulfide, a quaternary ammonium salt polymer having a cyclic structure, and chlorine.

Abstract: A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 ?m or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 ?m or less. The metal particles defining the lower plating films may be Cu particles.

Abstract: A method of manufacturing a printed circuit board includes arranging a core layer in which a bending prevention portion of at least two layers that are metal layers having different thermal expansion coefficients is disposed between a plurality of insulating members; forming a circuit pattern so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and forming an insulating layer including an opening portion that exposes the circuit pattern on the core layer.

Abstract: It is an object to provide a surface-treated electro-deposited copper foil which has a low profile at a level equal to or excellent than that of low-profile surface-treated electro-deposited copper foils that have conventionally been supplied to the market and in which waviness affecting the straight line performance of wiring is small, and a method for manufacturing the same. In order to achieve this object, in the surface-treated electro-deposited copper foil, the maximum waviness height (Wmax) of the bonding surface to be bonded with an insulation layer-constituting material to be 0.05 ?m to 0.7 ?m, the maximum peak to valley height (PV) to be 0.05 to 1.5 ?m, and the surface roughness (Rzjis) to be 0.1 ?m to 1.0 ?m.

Abstract: A card guide may include an aluminum substrate and a hard anodized coating formed on the aluminum substrate. In some examples, the hard anodized coating may have an electrical resistance of greater than about 100,000,000 ohms. Additionally or alternatively, the hard anodized coating may have a thickness of greater than about 38.1 ?m (0.015 inch).

Abstract: A method for anodizing aluminum, wherein an object (29) made of aluminum or an aluminum alloy is anodized in an electrolytic solution (25), and thereby an anodized aluminum film is formed on a surface of the object (29), is provided. The electrolytic solution (25) is comprised of at least one acid selected from organic acids having two or more carboxylic groups, moves at an average speed of 15 cm/sec or less along at least an outer surface of the object (29). The anodization is performed under conditions that a temperature of the outer surface of the object (29) is 80° C. or less, and current density is in a range from 10 to 170 A/dm2.

Abstract: A method of manufacturing a circuit board is described herein. The method may include adding a resin, forming first and second fiberglass fibers, and forming first and second signal line traces capable of transmitting electrical signals. In some examples, a ratio between fiberglass and resin material near the first signal line trace is similar to a ratio between fiberglass and resin material near the second signal line trace. In some examples, the first and second fiberglass fibers diagonally cross near the first and second signal line traces. In some examples, the first and second fiberglass fibers cross near the first and second signal line traces in a zig-zag pattern.

Abstract: Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the copper foil comprises a nickel or nickel alloy layer with a lower etching rate than copper formed on an etching side of the rolled copper foil or electrolytic copper foil, and a heat resistance layer composed of zinc or zinc alloy or its oxide formed on the nickel or nickel alloy layer.

Abstract: An objective of this invention is to provide an interlayer dielectric film with a carrier material used in a multilayer printed circuit board, which exhibits sufficient rigidity for a thin multilayer printed circuit board. According to the present invention, there is provided an interlayer dielectric film with a carrier material comprising a carrier material comprised of a metal foil or resin film and an interlayer dielectric film formed on one side of the carrier material, wherein the interlayer dielectric film is comprised of a base material impregnated with a resin; the base material has a thickness of 8 ?m to 20 ?m; and when the resin is cured at 170° C. for one hour under a pressure of 30 kgf/cm2, an elongation percentage of the interlayer dielectric film in a planar direction is 0.05% or less as determined by a TMA method.

Abstract: A decorative metal finish for a part with a non-conductive surface where the non-conductive surface is lightly roughened to improve its adherence capabilities. A thin metal layer is electrolessly deposited on the lightly roughened surface to provide a bright durable metal finish on the non-conductive surface. An translucent finish is deposited over the thin metal layer to provide protection for the metal finish.

Abstract: A laminate donor element can be used to transfer a composite of a metal grid and an electronically conductive polymer to a receiver sheet for use in various devices. The laminate donor element has a donor substrate, a metal grid that is disposed over only portions of the donor substrate, leaving portions of the substrate uncovered by the metal grid, and an electronically conductive polymer that covers the portions of the donor substrate that are uncovered by the metal grid. The composite of metal grid and electronically conductive polymer exhibits a peel force of less than or equal to 40 g/cm for separation from the donor substrate at room temperature.

Abstract: In a manufacturing method of a package carrier, a substrate including a first metal layer, a second metal layer having a top surface and a bottom surface opposite to each other, and an insulating layer between the first and second metal layers is provided. The second metal layer has a greater thickness than the first metal layer. A first opening passing through the first metal layer and the insulating layer and exposing a portion of the top surface of the second metal layer is formed. The first metal layer is patterned to form a patterned conductive layer. Second openings are formed on the bottom surface of the second metal layer. The second metal layer is divided into thermal conductive blocks by the second openings that do not connect the first opening. A surface passivation layer is formed on the patterned conductive layer and the exposed portion of the top surface.

Abstract: An emblem assembly configured for attachment to a vehicle includes a first element and a second element. The first element is configured for attachment to the vehicle and has a first surface and a second surface recessed from the first surface. The second element is configured for attachment to the first element and has a third surface, a fourth surface spaced apart from the third surface, and a fifth surface extending between the third and fourth surfaces, wherein the fifth surface is spaced apart from the second surface to define a channel therebetween. The assembly includes a first coating disposed on the third surface and a tape disposed in contact with at least a portion of each of the second surface, the first coating, and the fifth surface to thereby fill at least a portion of the channel. A method of forming the assembly is also disclosed.

Abstract: An emblem assembly configured for attachment to a vehicle includes a first element configured for attachment to the vehicle and a second element configured for attachment to the first element. The first element has a first surface and a second surface recessed from the first surface. The second element has a third surface, a fourth surface spaced apart from the third surface, and a fifth surface extending between the third and fourth surfaces. The emblem assembly further includes a coating disposed on the third surface, and a molded resin disposed adjacent and in fixed contact with each of the fifth surface and the coating to contiguously encapsulate the coating and at least a portion of the fifth surface, wherein the molded resin is bondable to the first element. A method of forming the emblem assembly is also disclosed herein.

Abstract: Embodiments of the invention include articles comprising a diamond like carbon coating or doped diamond like carbon coating on one or more surfaces of a plastic substrate or a plastic enclosure. Embodiments of the DLC or doped DLC coatings reduce the gas permeation of the coated plastic or thermoplastic to hydrogen or helium compared to the permeability of the plastic alone. The DLC or doped DLC coatings coating provides a surface resistivity of from about 107 to about 1014 ohm/square and have a transmittance that range from about 0% to about 70% less than the transmittance of the underlying plastic substrate in the range of about 300 nm to about 1100 nm. The DLC coated plastic can be used in environmental enclosures for protecting environmentally sensitive substrates such as semiconductor wafers and reticles.

Abstract: Disclosed is a prepreg obtained by impregnating a woven fabric base with a thermosetting resin composition, wherein the thermosetting resin composition contains 80 to 200 volume parts of an inorganic filler per 100 volume parts of a thermosetting resin, and the inorganic filler contains (A) gibbsite aluminum hydroxide particles having an average particle diameter (D50) of 2 to 15 ?m, (B) at least one inorganic component selected from the group consisting of boehmite particles having an average particle diameter (D50) of 2 to 15 ?m and inorganic particles that have an average particle diameter (D50) of 2 to 15 ?m and that contain crystal water having a release initiation temperature of 400° C. or higher or contain no crystal water, and (C) aluminum oxide particles having an average particle diameter (D50) of 1.

Abstract: A heat dissipation substrate including a metal substrate, a metal layer, an insulating material layer and a patterned conductive layer is provided. The metal layer is disposed on the metal substrate and entirely covers the metal substrate. The metal layer has a first metal block and a second metal block surrounding the first metal block. A thickness of the first metal block is greater than a thickness of the second metal block. The insulating material layer is disposed on the second metal block. The patterned conductive layer is disposed on the insulating material layer and on the first metal block.

Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

Abstract: Provided is a rolled copper foil or electrolytic copper foil for an electronic circuit to be used for forming a circuit by etching, wherein the copper foil comprises a heat resistance layer composed of zinc or zinc alloy or its oxide formed on an etching side of the rolled copper foil or electrolytic copper foil, and a layer of nickel or nickel alloy, which is a metal or alloy with a lower etching rate than copper, formed on the heat resistance layer.

Abstract: The present invention relates to a metallic laminate and a manufacturing method of a light emitting diode package using the same. The present invention provides a metallic laminate including: a core layer made of an insulating material; a metal layer disposed on one surface of the core layer; a heat radiating metal layer disposed on the other surface of the core layer; and a protective metal oxide layer disposed along an outer surface of the heat radiating metal layer and made of an oxide of the heat radiating metal layer.