Patents Examined by Christopher Horgan
  • Patent number: 5393951
    Abstract: A flexible laminated jumper is formed from a stack of half hard tempered copper sheets. Contact plates are clamped to opposite sides of one end of the stack, such plates being provided with short stress relief sections away from the end of the stack. The clamped end is positioned properly in a press welder so that the flat portion of the contact plates are gripped by graphite electrodes of a press welder. The gripped end of the stack is then press welded while the balance of the stack is cooled so that the heat from the press welding does not affect the temper of the sheets of the stack. This is preferably done by immersion in chilled water with the water level being in close proximity to the electrode. After the press welding, the entire stack is cooled and the still tempered stack is formed to the desired configuration.
    Type: Grant
    Filed: February 1, 1993
    Date of Patent: February 28, 1995
    Assignee: Watteredge-Uniflex, Inc.
    Inventor: James J. Kasper
  • Patent number: 5389739
    Abstract: An electronic device package assembly including a base member; a cover member; a lead frame having a plurality of leads disposed between the base member and the cover member; an electronic device disposed between the base member and the cover member and electrically attached to the leads; bonding rings for bonding the base member and the cover member to the lead frame; and spacers disposed between the lead frame and the base member and the lead frame and the cover member for maintaining the base member and the cover member at a predetermined spacing from the lead frame.
    Type: Grant
    Filed: December 15, 1992
    Date of Patent: February 14, 1995
    Assignee: Hewlett-Packard Company
    Inventor: Louis T. Mills
  • Patent number: 5386625
    Abstract: A method of assembling an integrated circuit (IC) by a TAB (Tape Automated Bonding) system, and an IC assembled thereby. Leads extending from a TAB tape and connected to an IC are each partly reduced in width. Hence, even when the end portions of the leads are deformed by some object by accident, it is not necessary to correct the shape of the leads since such end portions will be eventually cut off and discarded in the event of packaging of the IC.
    Type: Grant
    Filed: March 9, 1994
    Date of Patent: February 7, 1995
    Assignee: NEC Corporation
    Inventor: Kenji Tsukamoto
  • Patent number: 5387762
    Abstract: An electronic component is provided which comprises a resin package for enclosing inside parts, and at least one lead terminal projecting out from the resin package to have a bonding end. The lead terminal is bent to provide an armpit-like portion between the lead terminal and the resin package for retaining a solder wire in a sandwiched state. At the time of mounting the electronic component to a circuit board, the solder wire be caused to melt at a soldering temperature for merging with solder fillets along the bonding end of the lead terminal.
    Type: Grant
    Filed: December 21, 1993
    Date of Patent: February 7, 1995
    Assignee: Rohm Co., Ltd.
    Inventors: Miki Hasegawa, Yasuo Kanetake
  • Patent number: 5386280
    Abstract: An electrophotographic imaging apparatus using a continuous form recording sheet is provided, in which the recording sheet carrying an unfixed toner image is passed through a fixing device and the toner image is fixed thereon. The imaging apparatus includes a recording sheet transporting device, disposed on the downstream side of the fixing device, to ensure that the recording sheet is stably transported and discharged from the imaging apparatus.
    Type: Grant
    Filed: October 15, 1991
    Date of Patent: January 31, 1995
    Assignee: Asahi Kogaku Kogyo Kabushiki Kaisha
    Inventor: Tomoyuki Nishikawa
  • Patent number: 5386084
    Abstract: An electronic device enclosure is provided having a top and a bottom, preferably each made of a polycarbonate plastic material and having respective lower and upper edges which are the same shape, and an elastomeric cover which fits over the top and wraps around the lower edge thereof so as to seal the joint between the top and the bottom. Preferably, the cover is made of silicone rubber or urethane of a durometer in the range of 40 to 60. Push buttons with associated suspensions are moulded integrally into the cover so as to protrude downwardly through apertures in the top and engage push button switches on the electronic device therein. A display aperture may be provided in the top and, if so, a portion of the cover also wraps around the edges of the display aperture so as to be disposed between the display and the cover.
    Type: Grant
    Filed: July 22, 1993
    Date of Patent: January 31, 1995
    Assignee: II Morrow Inc.
    Inventor: John J. Risko
  • Patent number: 5384430
    Abstract: A cable for a submersible pump has three insulated power conductors assembled in a flat configuration. The power conductors are wrapped with an inner armor such as a metal strip. An auxiliary line is placed alongside the inner armor and wrapped in an outer armor. The outer armor is also a metal strip.
    Type: Grant
    Filed: May 18, 1993
    Date of Patent: January 24, 1995
    Assignee: Baker Hughes Incorporated
    Inventors: Roger B. Anthony, David H. Neuroth
  • Patent number: 5382754
    Abstract: A central region of the bottom surface of a resin in which a diode chip and a base end portion of each of two lead terminals electrically connected to the chip is burning-treated by irradiating a laser beam in order to remove fat and oil existing in the bottom surface. Thereby, the deterioration of adhesive strength of an adhesive agent for fixing the bottom surface of the resin to a circuit board is prevented.
    Type: Grant
    Filed: March 18, 1993
    Date of Patent: January 17, 1995
    Assignee: Rohm Co., Ltd.
    Inventor: Shigemasa Sunada
  • Patent number: 5382753
    Abstract: An enclosure for housing electronic circuitry and the like, having a case and a cover which are mated together along edges thereof by substantially C-shaped flanges oriented in the same direction and asymmetrically with respect to each other to form semi-interlocking joints. Assembly and disassembly of the joints is accomplished by direct insertion and extraction without the need for sliding motion. The mating elements are locked together through the use of fasteners inserted into circular recesses formed by the flange members. The construction enables the use of internal dividing walls and shielding gaskets for forming electromagnetically isolated compartments within the housing enclosure.
    Type: Grant
    Filed: April 9, 1993
    Date of Patent: January 17, 1995
    Assignee: Mitsubishi Consumer Electronics America, Inc.
    Inventor: Mark H. Farley
  • Patent number: 5381599
    Abstract: Disclosed is a high temperature, high pressure process of encapsulating electronic devices. The high pressure process is particularly suitable for encapsulating flip-chip devices wherein the collapse of flip-chip solder bumps is prevented. A special mold may be used to prevent the ceramic substrate of the flip-chip device from breaking under the high injection pressure conditions. The encapsulant is a rigid liquid crystal polymer.
    Type: Grant
    Filed: April 12, 1993
    Date of Patent: January 17, 1995
    Assignee: Delco Electronics Corp.
    Inventor: Gregory L. Hall
  • Patent number: 5380955
    Abstract: A device is provided for passing a member through the wall of a sealed chamber. The member has an outer surface having a portion thereof which is substantially formed of metal. A flange has an opening therein which surrounds and is spaced from the metal portion of the member. A solder member completely fills the space between the flange opening and the metal portion of the member for creating a seal therebetween which is capable of maintaining a high pressure differential between opposite sides of the sealed chamber wall. The member is preferably a flat, multi-conductor electrical cable having thin, flat, copper shielding layers on the top and bottom thereof. The metal portion preferably includes a wedge-shaped copper member which surrounds the electrical cable and is intricately affixed to the shielding layers. The solder member is preferably a solder compound comprising 52 percent indium and 48 percent tin.
    Type: Grant
    Filed: December 8, 1992
    Date of Patent: January 10, 1995
    Assignee: International Business Machines Corporation
    Inventors: Straty N. Argyrakis, Willard S. Harris, Richard W. Oldrey, Edward J. Ossolinski
  • Patent number: 5380952
    Abstract: A stabilizer bar made of non-conductive material (such as a poly enid plastic) is secured to the top side of extended leads on each side of a flat high density integrated circuit package. The bar is located intermediate the length of the leads, and is used as a lead form during a subsequent forming operation. The leads are formed around the stabilizer bar, which remains in place throughout the forming operation and during subsequent mounting of the integrated circuit package.
    Type: Grant
    Filed: November 24, 1993
    Date of Patent: January 10, 1995
    Assignee: VLSI Technology, Inc.
    Inventor: Paul S. Levy
  • Patent number: 5379095
    Abstract: An image reading apparatus includes a photoelectric conversion unit which is held, together with a first movable optical reading unit and a second movable optical reading unit, on a guide member instead of a chassis. Since all of the first movable optical reading unit, second movable optical reading unit and photoelectric conversion unit are held on the common guide member, the positional relationship between the photoelectric conversion unit and the guide member is held always constant even when a chassis is deformed due to an environmental change or an external force. This arrangement insures a high image quality reading. The image reading apparatus also includes a transparent plate disposed on an upper surface of an original holding glass plate so as to cover a moving original reading position defined at that glass plate portion. An exit guide have a front end which is disposed adjacent to a downstream end of the transparent plate and held at a level below an upper surface of the transparent plate.
    Type: Grant
    Filed: June 18, 1992
    Date of Patent: January 3, 1995
    Assignee: Matsushita Graphic Communication Systems, Inc.
    Inventor: Nozomu Oishi
  • Patent number: 5374781
    Abstract: A step-transformer drum formed with throughgoing apertures each centered on a respective axis has a contact assembly in each aperture having an insulating washer lining the aperture and having an inside part lying on an inside surface of the drum and an outside part lying on an outside surface of the drum. A stud has an enlarged head bearing outward on the inside washer part and a shaft projecting through the washer past the outside washer part and formed outside the outside washer part with a transversely throughgoing hole. A pin extends transversely through the hole and bears inwardly on an outwardly directed ramp so that rotation of the stud and pin in one direction relative to the structure makes the pin ride up on the ramp and tightens the stud in the aperture and opposite relative rotation loosens the stud.
    Type: Grant
    Filed: October 29, 1992
    Date of Patent: December 20, 1994
    Assignee: Maschinenbaufabrik Reinhausen GmbH
    Inventors: Dieter Dohnal, Leonhard Pillmeier
  • Patent number: 5374780
    Abstract: A composite link and insulator, and method of construction, includes a fiberglass body. The body is formed by coating glass fibers with a liquid resin and winding the fibers around a plurality of tubular fittings or bushings in two layers, a first extending longitudinally of the body and the second transversely and around the first. A polymer shield layer and weathersheds are injection molded over the fiberglass body to create an insulator.
    Type: Grant
    Filed: September 2, 1992
    Date of Patent: December 20, 1994
    Assignee: MacLean Fogg Company
    Inventor: Jiri Pazdirek
  • Patent number: 5374779
    Abstract: For sufficiently shielding an undesired electro-magnetic wave from penetrating into a communication apparatus, for instance, a car telephone through stray coupling, or leaks therefrom, an electronic circuit substrate and a case of the communication apparatus are formed of flat plates which consist of insulating material comprising magnetic material. One side surface of the flat plates are covered with conductive films. The communication apparatus itself is accommodated in the case and an electric power source connecting cable is wrapped by a similar arrangement, so as to remarkably reduce obstructions caused by undesired waves and other communications in comparison with the conventional arrangement.
    Type: Grant
    Filed: July 8, 1993
    Date of Patent: December 20, 1994
    Assignee: Uniden Corporation
    Inventor: Yoshihiro Konishi
  • Patent number: 5373101
    Abstract: An electrical interconnect apparatus (503) comprises a housing (500), an electrically conductive contact (209) and an electrically conductive spring member (211). The housing (500) has an electrically insulative outer layer (602) and an electrically conductive inner layer (603). The electrically conductive contact (209) includes a protrusion (311) having an edge (317) and partially displaced from a plane (307) of the contact (209) at an acute angle. The electrically conductive spring member (211), coupled to the electrically conductive contact (209), biases the electrically conductive contact (209) towards the housing (500) in a manner such that the edge (317) of the protrusion (311) extends through the electrically insulative outer layer (602) and into the electrically conductive inner layer (603) to form an electrical interconnection between the electrically conductive contact (209) and the electrically conductive inner layer (603).
    Type: Grant
    Filed: May 19, 1993
    Date of Patent: December 13, 1994
    Assignee: Motorola, Inc.
    Inventor: Mark A. Barabolak
  • Patent number: 5373102
    Abstract: The structure of this invention provides a means for shielding an optically ensitive detector, device, or components from electromagnetic fields without shielding them from the optical spectra desired to be transmitted. The structure of the invention is in the form of an optically transmissive Faraday cage or box having optically transparent material selected from optical glass and optically transparent plastic which functions as a substrate. The substrate is provided a thin film of predetermined skin depths in the form of a conductive coating selected from silver and a nickel-chromiumiron-manganese-silicon-copper-alloy. The conductive coating is applied in a thickness equivalent to a predetermined number of skin depths in order to attenuate an external electromagnetic field strength to meet the tolerance of the detector, device, or components which are to be shielded.
    Type: Grant
    Filed: August 19, 1993
    Date of Patent: December 13, 1994
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: John J. Ehrlich, Wayne E. Davenport, Travis S. Taylor
  • Patent number: 5373099
    Abstract: A fixing device for fixing an electronic component (10) against a first wall (11) of a heatsink (12) includes at least one end branch engaged in a recess (81) provided in a second wall (82) of the heatsink (12) at right angles to the first wall (11). An abutment segment or support section opposite to the end branch is designed to bear against the front face of the component (10) and is connected to the end branch by a resilient segment so that a spring biased pressure is exerted on the front face of the component (10). The end branch is substantially freely engaged in the recess (81), which recess is in a direction perpendicular to the second wall (82). The end branch is held inside the recess (81) by being braced therein when the abutment segment presses the component (10) against the first wall (11) of the heatsink (12).
    Type: Grant
    Filed: January 26, 1993
    Date of Patent: December 13, 1994
    Assignee: Alcatel Converters
    Inventors: Pierre-Yves Boitard, Bernard Furier
  • Patent number: RE34840
    Abstract: An electrophotographic apparatus includes an image forming mechanism for forming an image on a paper sheet, and a magnetic cleaning system for magnetically cleaning cleaning a surface of an image carrier of the mechanism for each cycle of image formation. A mechanical cleaning system is provided for mechanically cleaning the image carrier. The mechanical cleaning system includes a blade movable between a contact position where it contacts with the surface of the carrier and an off position where it is kept apart from the surface. The blade is intermittently moved to the contact position, by a drive mechanism and a control unit, for predetermined operating times at predetermined time intervals. The blade is arranged to be manually operable through a lever attached to the blade.
    Type: Grant
    Filed: November 25, 1992
    Date of Patent: January 31, 1995
    Assignee: Tokyo Electric Co., Ltd.
    Inventors: Yasuyoshi Yamaguchi, Susumu Matsuda