Abstract: There is provided a technique that includes: processing a substrate in a process vessel by supplying a processing gas to the substrate and exhausting the processing gas from an exhaust part including an exhaust pipe and a pump; cleaning an interior of the exhaust part by supplying a first cleaning gas from a supply port installed in the exhaust pipe directly into the exhaust pipe; and cleaning an interior of the process vessel by supplying a second cleaning gas into the process vessel, wherein a frequency of performing the act of cleaning the interior of the exhaust part is set higher than a frequency of performing the act of cleaning the interior of the process vessel.

Abstract: There is provided a substrate processing apparatus, including: a substrate holder configured to hold a substrate with a surface of the substrate on which a concavo-convex pattern is formed oriented upward; a liquid supply unit configured to supply a processing liquid to the substrate held by the substrate holder to form a liquid film at least in a concave portion of the concavo-convex pattern; a heating unit configured to irradiate the substrate held by the substrate holder or the liquid film with a laser beam for heating the liquid film; and a heating controller configured to control the heating unit, wherein the heating controller controls the heating unit to expose the entire concave portion in a depth direction from the processing liquid by irradiating the laser beam onto the substrate or the liquid film from the heating unit.

Abstract: A gas supply unit is configured such that when a first gas whose temperature has been controlled at a first temperature is supplied to a chamber through an upper device and then a second gas which starts a chemical reaction at a reaction start temperature lower than the first temperature is supplied to the chamber through the upper device, before cleaning gas is supplied to the chamber through the defined between a base plate and the upper device to cool the upper device down to the reaction start temperature or lower.

Abstract: A substrate processing method includes a process of cooling a substrate to below a freezing point of a processing liquid using a cooling fluid brought into contact with the substrate opposite. While the substrate is cooled to below the freezing point of the processing liquid, a droplet of processing liquid is dispensed onto a surface of the substrate at a specified location of a foreign substance. The droplet then forms a frozen droplet portion at the specified location. The frozen droplet portion is then thawed.

Abstract: A system for cleaning a tube is provided. The system includes an enclosure, a laser, and an actuator. The enclosure receives the tube. The laser is disposed within the enclosure and operative to ablate a substance disposed on a surface of the tube. The actuator is operative to move the tube relative to the laser.

Abstract: Disclosed is an apparatus for depowdering a workpiece printed from a laser powder bed fusion process, having: a base; a turntable that rotates relative to the base, the turntable configured to receive the workpiece; and in operation, when the turntable is rotating, rotational forces applied to the workpiece depowder the workpiece.

Abstract: Dishwashing appliances and methods, as provided herein, may include features or steps such as measuring an initial pressure in a sump with a pressure sensor, activating a drain pump when the measured initial pressure in the sump is greater than or equal to a first pressure threshold, and starting a timer when the drain pump is activated. Dishwashing appliances and methods may further include features or steps for monitoring pressure within the sump with the pressure sensor after activating the drain pump, recording a value of the timer as a first time when the monitored pressure reaches a second pressure threshold, calculating a time limit based on the recorded first time value, and determining that the filter is clogged when the monitored pressure does not reach a third pressure threshold before the time limit expires.

Abstract: A processing solution containing solvent and solute is supplied onto a substrate (9). The processing solution transforms into a particle retention layer as a result of at least part of the solvent being volatilized from the processing solution and causing the processing solution to solidify or harden. The particle retention layer is removed from the substrate (9) by supplying a removal liquid onto the substrate (9). A solute component contained in the particle retention layer is insoluble or poorly soluble in the removal liquid, whereas the solvent is soluble. The solute component contained in the particle retention layer has the property of being altered to become soluble in the removal liquid when heated to a temperature higher than or equal to an alteration temperature. The removal liquid is supplied after the formation of the particle retention layer, without undergoing a process of alternating the solute component.

Abstract: A hose clearing apparatus has a cylindrical body, a fluid coupler on the rear side, and a fluid nozzle on the front side. A method of clearing a hose involves coupling a fluid to the fluid coupler, adjusting the fluid nozzle to achieve the desired spray, powering on the vacuum with the hose coupled thereto, inserting the front of the body and accompanying nozzle into the hose, and allowing the hose to traverse through the hose.

Abstract: The present inventive concept relates to a method for optimizing water usage in a device utilizing water for a group of cleaning procedures, wherein the device comprises a sensor arrangement (518) and a data processing device, wherein the method comprises the steps of: determining a first substance content (400a) of first cleaning phase water from a first cleaning phase of the cleaning procedure (428) using the sensor arrangement (518); in the data processing device, receiving data comprising a target substance content interval requirement (844) of at least one of a plurality of cleaning phases (314); in the data processing device, comparing the first substance content to the target substance content interval requirement (844); and forming cleaning phase water to be used in the at least one of the plurality of cleaning phases (314) by transferring the first cleaning phase water to the at least one of the plurality of cleaning phases (314) based on the comparison.

Abstract: A gas ejection apparatus ejects gas by use of a compressor that compresses the gas, and the gas ejection apparatus includes a detector and a microcomputer. The detector detects a signal relating to an ejection target device. The microcomputer controls the compressor to change a number of times of ejection of the gas in accordance with an amount of time elapsing between a detection of the signal by the detector and a next detection of the signal by the detector.

Abstract: In one exemplary embodiment, described herein are innovative techniques for reducing the attractive force between particles and a substrate surface to aid in the removal of particles from the substrate surface. More specifically, a multi-electrode chuck is utilized to assist in cleaning a substrate. The multi-electrode chuck is utilized to reduce the attractive forces between particles and the substrate and to move the loosened particles that are present on the substrate surface. The electrodes of the chuck are biased with alternating current (AC) voltages with a phase shift between the electrode bias waves. The resulting electric field wave on the substrate surface loosens the particles by polarizing the particles and moves the loosened particles across the substrate.

Abstract: Systems and methods for rinsing beverage residue from a mechanical interface between threads of a bottle and threads of a bottle cap is described. The bottle cap may include a sealable coating to create a seal against a rim of the bottle. The bottle cap may also include passages to allow pressurized water to be injected into an upper inner region of the bottle cap. The pressurized water is prevented from entering the bottle due to the seal between the rim of the bottle and the sealable coating of the bottle cap. Therefore, the pressurized water is caused to escape through the mechanical thread interface toward a lower inner region of the bottle cap where the water escapes from the cap at atmospheric pressure.

Abstract: A drawing apparatus includes: a drawing part; a cleaning-gas generator; a first valve between the cleaning-gas generator and the drawing part and adjusting a supply amount of gas to the drawing part; a first pressure gauge measuring a pressure in the drawing part; a compensation-gas introducing part introducing compensation-gas to be supplied between the cleaning-gas generator and the first valve; a second valve between the compensation-gas introducing part and the first valve and adjusting a supply amount of the compensation-gas; and a valve controller controlling the first and second valves, wherein the valve controller controls the first valve to supply the cleaning-gas at a predetermined flow rate to the drawing part and controls the second valve to cause a pressure in the drawing part to be a predetermined pressure when the first pressure gauge detects a pressure reduction due to a reduction in a supply flow rate of the cleaning-gas.

Abstract: The present disclosure relates to a cleaning composition for removing an oxide including an acid selected from an organic acid, an inorganic acid, and a combination thereof; a salt selected from an organic salt, an inorganic salt, and a combination thereof; a surfactant; and water, and a method of cleaning using the cleaning composition.

Abstract: A robot cleaner is provided. The robot cleaner includes a battery, and a processor configured to, in response to the battery being consumed in accordance with a cleaning operation for the cleaning area and a remaining capacity of the battery reaching a predetermined value, control the robot cleaner to charge some of the battery and clean a remaining area using the charged battery.

Abstract: Systems and methods for cleaning vehicle sensors are disclosed that optimize sensor cleaning fluid usage. An exemplary vehicle sensor cleaning system includes a sensor cleaning fluid delivery system that delivers sensor cleaning fluid to a sensor of a vehicle and a sensor cleaning control system in communication with the sensor cleaning fluid delivery system. The sensor cleaning control system determines a target cleanliness level for the sensor based on sensor cleaning data associated with the sensor. The target cleanliness level is less than a maximum cleanliness level indicating indicates a contaminate-free sensor. The sensor cleaning control system further monitors a cleanliness level of the sensor and initiates a sensor cleaning operation when the cleanliness level of the sensor is less than an operational cleanliness threshold, such that the sensor cleaning fluid delivery system delivers sensor cleaning fluid to the sensor to clean the sensor to the target cleanliness level.

Abstract: A substrate processing method includes a processing liquid supplying step of supplying a processing liquid to a patterned surface of a substrate having the patterned surface with projections and recesses, a processing film forming step of solidifying or curing the processing liquid supplied to the patterned surface to form, so as to follow the projections and the recesses of the patterned surface, a processing film which holds a removal object present on the patterned surface and a removing step of supplying a peeling liquid to the patterned surface to peel the processing film from the patterned surface together with the removal object, thereby removing the processing film from the substrate, while such a state is kept that the removal object is held by the processing film.

Abstract: A substrate processing method including a vapor atmosphere filling step in which a vapor atmosphere which contains vapor of a low surface tension liquid whose lower surface tension than a processing liquid is filled around a liquid film of the processing liquid, a thin film region forming step in which, in parallel with the vapor atmosphere filling step, a substrate is rotated at a predetermined thin film region forming speed, to partially remove the processing liquid, thereby forming a thin film region on the liquid film of the processing liquid, a thin film region expanding step in which, in parallel with the vapor atmosphere filling step, the thin film region is expanded to an outer circumference of the substrate, and a thin film removing step in which the thin film is removed from the upper surface after the thin film region expanding step.

Abstract: A method for structured coating of a surface of a substrate. The surface includes spaced optical elements and at least partially metallic elements provided adjacent the optical elements. After the application of the method, the optical elements should be completely covered with the coating, whereas at least some of the metallic elements should not be coated on the major part of their surface. The method includes: a) providing the substrate with the spaced optical elements and metallic elements; b) applying a sacrificial material to at least some of the metallic elements to form sacrificial spots; c) coating the surface of the substrate with a layer system; and d) detaching the sacrificial spots from the substrate, wherein the regions of the layer system on the sacrificial spots are also detached from the substrate. The application of the sacrificial material is carried out at least partially by jetting.