Abstract: The present invention provides a thermosetting resin composition useful as a highly filled low CTE underfilling sealant composition which completely fills the underfill space in a semiconductor device, such as a flip chip assembly which includes a semiconductor chip mounted on a carrier substrate, enables the semi-conductor to be securely connected to a circuit board by heat curing and with good productivity, and demonstrates acceptable heat shock properties (or thermal cycle properties). The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component, a latent hardener component, and a polysulfide-based toughening component. The latent hardener component includes a modified amide component and a latent catalyst therefor.

Abstract: The present invention relates to alicyclic epoxy compounds obtained by selectively hydrogenating aromatic rings of aromatic epoxy compounds in the presence of a hydrogenation catalyst, the concentration of the platinum group element in the product alicyclic epoxy compound being not more than 2 ppm.

Abstract: A curable composition comprising a) an epoxy resin having on average more than one epoxide group per molecule and b1) an alkyldipropylenetrimine of general formula (I) and/or b2) an adduct of an alkyldipropylenetrimine of general formula (I) with b3) an epoxide compound having on average at least one epoxide group per molecule in which R is hydrocarbon radical 8 to 22 carbon atoms, and the use of this composition for mineral and metallic substrates.

Abstract: Disclosed are a resin dispersion and a cationic electrodeposition coating composition including the same, in which the dried coating film of the electrodeposition paint is lead-free and has an epoxy-acrylic double-layered structure for displaying excellent properties, and in which an organic solvent content can be minimized. A resin dispersion of a cationic electrodeposition includes an aqueous dispersion prepared by the following processes. The resin dispersion includes a cationic electrodeposition resin, deionized water, an acid for neutralization, a reaction product of manganese phosphate and an acid diluted in an deionized water to 10%, and a cationic surfactant.

Abstract: A composition comprising a cationic polymerization compound and a porous fine particle, a coating made from the composition and a laminated plate comprising a substrate and the coating are provided. The coating is superior in adhering properties to a substrate and is equipped with an adequate hardness.

Abstract: A liquid epoxy resin composition includes (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) a silicone-modified resin resulting from addition reaction of an alkenyl-containing epoxy or phenolic resin with an organopolysiloxane, the liquid epoxy resin composition curing into a product having a Tg of 30-120° C. and a specific dynamic viscoelasticity behavior. The composition is adherent to silicon chips, the cured product is highly resistant to heat and thermal shocks, and the composition is useful as sealant for flip chip type semiconductor devices.

Abstract: A water-dispersible polymer and a coating composition containing the water-dispersible polymer are disclosed. The water-dispersible polymer is prepared from: (a) an epoxy compound having about two epoxy groups, such as an epoxy resin, (b) a linking compound having (i) conjugated carbon--carbon double bonds or a carbon--carbon triple bond and (ii) a moiety capable of reacting with an epoxy group, such as sorbic acid, and (c) acrylic monomers, at least a portion of which are capable of rendering the polymer water dispersible, such as acrylic acid, wherein the epoxy portion (a) of the polymer is covalently linked to the polymerized acrylic portion (c) by linking compound (b). The coating composition contains the water-dispersible polymer, a fugitive base to solubilize the polymer, a curing agent, and a carrier containing water.

Abstract: A class of catalysts for the anionic copolymerization of cyclic lactams in the presence of .omega.-(N-acyllactam)polyorganosiloxanes, .alpha.,.omega.-di-(N-acyllactam)polyorganosiloxanes or star-shaped .omega.-(N-acyllactam)polyorganosiloxanes is disclosed. The catalysts successfully protect the siloxane prepolymer from harmful depolymerization reactions at elevated temperatures while anionically polymerizing the cyclic lactams via ringopening. Diblock, triblock, multiblock and star-block copolymers, e.g., of a polyorganosiloxane and a polyamide, with advantageously high polyorganosiloxane and polyamide block molecular weights and superior heat resistance can be synthesized with the catalysts. The composition of these block copolymers, with the structure AB, ABA, and star-(BA).sub.r, r .gtoreq.3, where A=polyamide and B=polyorganosiloxane, and the process for producing them are also described.

Abstract: A thermosetting resin composition comprising a maleimide having at least one N-substituted maleimide group in the molecule thereof and a silicon compound having conjugated double bonds is easily workable and yields cured products having improved heat resistance.

Abstract: A silicone-based composite rubber composition having good processability on rolls which is obtained by compounding a rubber-forming polymer (A) comprising a polyorganosiloxane and an organic rubber, a silicon compound (B) having at least two hydrolyzable groups per molecule which are able to undergo hydrolysis and condensation reactions with silanols, and a heavy metal compound, amine, or quaternary ammonium salt (C) which catalyzes the hydrolysis and condensation reactions, and allowing the resulting formulation to undergo hydrolysis and condensation reactions while the formulation is kept being deformed by shearing; a crosslinkable, silicone-based composite rubber composition comprising the silicone-based composite rubber composition having blended therewith an organic rubber-crosslinking agent; and an oil seal and a rubber hose both obtained from the crosslinkable, silicone-based composite rubber composition.

Abstract: An amorphous modified poly(2,6-dimethyl-p-oxyphenylene) (PPO) is described with a glass transition temperature (Tg) within the range of 170.degree.-220.degree. C., of which the macromolecules contain units having trialkylsilyl groups bonded to the nucleus and/or to the methyl: ##STR1## together with units having hydroxyethyl groups bonded to the nucleus and/or to the methyl: ##STR2## This modified PPO is prepared by metalating PPO with a metalating agent and reacting the formed metalated PPO with a trialkylsilyl halide and with ehtylene oxide in succession.The use of the thus modified PPO for the preparation of flat, including asymmetric, membranes useful in gas mixture separation processes is described.

Abstract: This invention relates to certain new high modulus silicones, toughened epoxy thermoset resin systems made from those silicones, and composites that are prepared from the new toughened epoxy resin systems. The silicone resins are specifically monophenyl-containing polysiloxanes.

Abstract: A composite material is comprised of an in situ polymerized rigid rod polymer and an in situ polymerized matrix polymer. The composite material is isotropic and has enhanced mechanical properties as well as improved temperature resistance, improved solvent resistance and improved moisture resistance.

Abstract: Block copolymers of polyimide and poly (phenylquinoxaline) have been synthesized. They are useful, particularly as dielectric layers in thin film multilayer structures. The most preferred embodiments are formed from polyimides which are those from pyromellitic dianhydride and oxydianiline. The most preferred poly (phenylquinoxaline) is a monofunctional oligomer, which yields the best microstructure.