Patents Examined by David Foster
  • Patent number: 6442032
    Abstract: An apparatus and system is provided for coupling an ethernet switch to communication link(s) in a communication network without requiring the disconnection and reconnection of the communication link(s). A module is configured to accommodate components of an ethernet switch, and can be modularly introduced into a communication rack and quickly engaged with rack-mounted mating connectors which are coupled to the communication link(s).
    Type: Grant
    Filed: August 10, 2001
    Date of Patent: August 27, 2002
    Assignee: Alcatel, societe anonyme
    Inventors: Ignacio A. Linares, James C. McKinley, Teck Q. Chin, Dennis J. Harkin
  • Patent number: 6434008
    Abstract: A semiconductor device in which a plurality of semiconductor elements are bonded onto at least one electrode pattern on an insulator substrate formed a plurality of electrode patterns on the main surface, each of the electrodes of the semiconductor element being electrically connected to the electrode pattern, the other surface of the insulator substrate being bonded to a heat dissipating base, the upper surface of the heat dissipating base being covered with a member for cutting off the semiconductor elements from the outer environment, terminals electrically connecting the electrodes on said insulator substrate and the electrode placed outside the cutoff member being provided, wherein the material of the heat dissipating base has a linear expanding coefficient larger than the linear expansion coefficient of the semiconductor element and smaller than three times of the linear expansion coefficient of the semiconductor element, and a thermal conductivity larger than 100 W/mK, the semiconductor elements being
    Type: Grant
    Filed: August 27, 1998
    Date of Patent: August 13, 2002
    Assignees: Hitachi, Ltd., Hitachi Haramachi Electronics Co., Ltd.
    Inventors: Kazuji Yamada, Akira Tanaka, Ryuichi Saito, Yasutoshi Kurihara, Tadao Kushima, Takashi Haramaki, Yoshihiko Koike, Takashi Hosokawa, Mamoru Sawahata, Masahiro Koizumi, Jin Onuki, Kazuhiro Suzuki, Isao Kobayashi, Hideo Shimizu, Yutaka Higashimura, Shigeki Sekine, Nobuya Koike, Hideya Kokubun
  • Patent number: 6434016
    Abstract: A method and apparatus interconnecting multiple devices on a circuit board. One disclosed circuit board has a first attach region on a first surface for coupling a first set of pins from a first device to a set of signal lines. A second attach region on a second surface is for coupling a second set of pins from a second device to the set of signal lines. The second attach region is predominantly non-overlapping with respect to the first attach region.
    Type: Grant
    Filed: May 4, 2001
    Date of Patent: August 13, 2002
    Assignee: Intel Corporation
    Inventors: Ming Zeng, Sanjay Dabral
  • Patent number: 6426873
    Abstract: A CD-ROM drive (2) is disclosed which has a safety circuit (40). The safety circuit (40) includes a NOR gate (51) having one input connected to a disk motor drive control signal terminal (48) of a system controller (31), and another input connected to the output (P1) of a sensor (13). The system controller (31) puts out a signal that goes low for activating a motor (18) and high for inactivating the same. The motor (18) is set into rotation when the NOR gate (51) is high, and out of rotation when the NOR gate is low. When the sensor (13) is high, however, the NOR gate (51) goes low, stopping the motor (18), regardless of the other input to the NOR gate from the system controller (31).
    Type: Grant
    Filed: May 30, 2000
    Date of Patent: July 30, 2002
    Assignee: TEAC Corporation
    Inventors: Minoru Minase, Susumu Niinuma, Hiroomi Watanabe
  • Patent number: 6426872
    Abstract: A pen-based portable computer, or pen-tablet computer, for use with a vehicular docking station that allows for the exchange or replacement of components thereof without the need for returning the computer to the manufacturer. The computer utilizes a main or primary housing for the major components of the computer, and a separate, independent, auxiliary expansion unit having its own housing for mounting a replaceable radio module that is connected to the main computer via a multi-pin connector, whereby the replacement or exchange of the radio module for a different one is easily and readily achieved, and where auxiliary or expansion devices may be connected to the main computer thereby, and where the auxiliary device itself serves as a handle for holding the main computer.
    Type: Grant
    Filed: November 27, 1998
    Date of Patent: July 30, 2002
    Assignee: Xplore Technologies, Corp.
    Inventors: John Sutton, Danile Swindler, Brian Groh, Richard Perley, Glen Clifton
  • Patent number: 6426870
    Abstract: A portable electronic device comprises, in one embodiment, one or more risers that protect an upper surface of the housing from being scratched. Additionally, the risers serve as bumpers to reduce damage to the device if it is dropped or bumped. Another embodiment of the present invention incorporates support members made from metal or metal alloy parts that are selectively attached to the laptop housing. These metal support members provide structural support for the housing and therefore aid in preventing the housing from twisting and bending. To further strengthen the housing, a metal frame is used in the upper and/or lower surface of the housing. The frame also serves to protect the enclosed electronics from electromagnetic interference.
    Type: Grant
    Filed: January 31, 2000
    Date of Patent: July 30, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Glen A Oross, Dennis R Esterburg
  • Patent number: 6426878
    Abstract: The present invention provides a bare chip carrier comprising: a carrier body having a base portion on which a bare chip is mounted and also having at least one cap holder ; and a carrier cap having a pressing member for pressing the bare chip toward the base portion of the body, and the carrier cap being separated from the carrier body, wherein the at least one cap holder has at least a holder engagement portion which is to be engaged with a cap engagement portion of the carrier cap, so that the carrier cap separated from the carrier body is held by the at least one cap holder, whereby the bare chip is mounted by only a single operation of dropping the carrier cap onto the carrier body for realizing the automation.
    Type: Grant
    Filed: July 2, 2001
    Date of Patent: July 30, 2002
    Assignee: NEC Corporation
    Inventors: Michinobu Tanioka, Takahiro Kimura
  • Patent number: 6424522
    Abstract: A structure and a circuit of an input/output (I/O) port bar to connect between a computer and a computer peripheral. The structure of the I/O port bar has a laminate, a loop and a sliding member (with a pushing portion, a first protrusion portion and a second protrusion portion). Thus constructed, the connecting cable can be restored to the inside of the I/O port bar. In the circuit of the I/O port bar, a power switching circuit is formed to control whether the power of the main circuit is supplied by an external computer via the connecting cable or directly by an external DC power source.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: July 23, 2002
    Assignee: Twinhead International Corp.
    Inventors: Ruey-I Lin, De-He Huang
  • Patent number: 6424541
    Abstract: Improved methods and apparatus for forming an assembly by attaching an electronic package to a substrate are disclosed. The electronic package includes a microelectronic device, conductive leads to couple the device to the substrate, and an encapsulant surrounding the device and a portion of the conductive leads. A filler is added to the assembly to surround the otherwise exposed portion of the leads. The filler material is selected such that the dielectric constant of the filler is approximately the same as the dielectric constant of the encapsulant. Surrounding the lead with material having substantially similar dielectric constants reduces impedance variation along the length of the lead.
    Type: Grant
    Filed: April 21, 1999
    Date of Patent: July 23, 2002
    Assignee: Conexant Systems, INC
    Inventor: Siamak Fazelpour
  • Patent number: 6421233
    Abstract: A pocket personal computer having improved battery compartment enclosing structures is disclosed. The battery compartment enclosing structures include a battery compartment defined in a rear side of the pocket personal computer for accommodating a battery therein, a battery compartment cap for enclosing the battery compartment and an unlocking means form unlocking the cap. The battery compartment has two positioning openings defined in a rear side wall of the compartment and a bulge inwardly formed on an inner face of a front side wall and the bulge has a slanted upper face and a flat lower face. The cap has two protrusions formed at a rear end thereof which can be received in the openings as the cap is positioned over the compartment and a latch downwardly formed at the front end of the cap and the latch has a slanted lower end and a depressed neck portion to cooperate with the bulge to lock the cap in position.
    Type: Grant
    Filed: June 12, 2000
    Date of Patent: July 16, 2002
    Assignee: High Tech Computer Corporation
    Inventor: Mi-Rong Hong
  • Patent number: 6421248
    Abstract: A chip card module contains, in addition to conductor tracks and a chip carrier, one or more semiconductor chips and, if necessary, a stiffening frame. The semiconductor chip(s) and/or stiffening frame are attached with the aid of an adhesive, with which particles of a defined size are admixed as spacers. The adhesive in preferably a flexible adhesive, and the particles preferably are formed of a deformable material. The invention has the effect that the semiconductor chip(s) and/or stiffening frame are adhesively attached to the underlying surface at a defined, uniform distance. The flexible adhesive and the deformable particles adapt to deformations of the chip card module and thus prevent damage to the adhesively bonded mating surfaces.
    Type: Grant
    Filed: July 15, 1999
    Date of Patent: July 16, 2002
    Assignee: Infineon Technologies AG
    Inventors: Hans-Georg Mensch, Stefan Emmert, Detlef Houdeau
  • Patent number: 6418011
    Abstract: For simply mounting an optical disk drive device or the like within a computer body to locate it accurately, a channel-shaped adaptor is mounted detachably on the upper part of the drive device, an inner guide pin and vertical guide groove are mutually located in a longitudinal direction, the drive device is horizontally inserted into a mounting frame, the drive device is placed on a place bed, and the adaptor is located in longitudinal and vertical directions within the mounting frame by a plate spring part compressing an outer guide pin.
    Type: Grant
    Filed: June 18, 2001
    Date of Patent: July 9, 2002
    Assignee: Sony Corporation
    Inventor: Kiyoshi Omori
  • Patent number: 6418034
    Abstract: A stacked printed circuit board memory module in which a plurality of daughter circuit boards can be stacked onto a primary circuit board. The primary board and each of the plurality of daughter boards have electronic memory ICs mounted on the respective surfaces. The primary board and each of the daughter boards have mounted connectors so that the boards can be electronically and mechanically interconnected with another board.
    Type: Grant
    Filed: November 27, 2001
    Date of Patent: July 9, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Rick Weber, Corey Larsen, James Howarth
  • Patent number: 6414844
    Abstract: A portable information processing apparatus is configured to dissipate heat generated in a cabinet mainly from a part which a user hardly touches, and thus the temperature at a palm rest is suppressed. The cabinet includes a heat conducting spacer 16 provided over a heat-generating component 15 to conduct heat thereof, a heat absorption area 10ah to absorb the heat of the heat-generating component 15 through the heat conducting spacer 16, and a heat conduction obstructing area 10rb provided on a heat conduction path between the heat absorption area 10ah and the palm rest 11 to reduce a cross-sectional area of the heat conduction path. Accordingly, heat conduction from the high-temperature heat generating component 15 to the palm rest 11 is restricted, and thus the temperature of the palm rest 11 can be limited.
    Type: Grant
    Filed: September 1, 2000
    Date of Patent: July 2, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Isao Shimada, Hideki Harada, Junichi Kubota, Akihiro Kuranaga
  • Patent number: 6411506
    Abstract: A web server chassis having a plurality of web server processing cards coupled with a midplane is provided. A first network interface card may also be coupled with the midplane. The midplane may include printed circuitry operable to provide data communications between the plurality of web server processing cards and the first network interface card. A second network interface card may also be coupled with the midplane, the second network interface card operable to couple the plurality of web server processing cards with a private network. In a particular embodiment the first network interface card may be operable to couple the plurality of web server processing cards with a public network. A third network interface card may also be provided. The third network interface card may be operable to couple the plurality of web server processing cards with a management network.
    Type: Grant
    Filed: July 20, 2000
    Date of Patent: June 25, 2002
    Assignee: RLX Technologies, Inc.
    Inventors: Christopher G. Hipp, David M. Kirkeby
  • Patent number: 6407930
    Abstract: A structure of a printed circuit board with stacked daughter board. The structure has a motherboard and at least a daughter board. The motherboard has a first signal layer, a second signal layer, a first power layer, a first ground layer and isolation layers between every layer. The first signal layer and the second signal layer serve as surfaces of the motherboard and first contacts are formed on the first signal layer. The daughter board includes a third signal layer, a fourth signal layer, a second power layer, a second ground layer and isolation layers between every layer. The second power layer or the second ground layer serves as a surface of the daughter board and second contacts are formed on the surface. The daughter board is stacked on the motherboard and the second contacts are coupled with the first contacts.
    Type: Grant
    Filed: July 9, 1999
    Date of Patent: June 18, 2002
    Assignee: ASUSTek Computer Inc.
    Inventor: Hsien-Yueh Hsu
  • Patent number: 6400562
    Abstract: A portable computer includes a computer housing, a decorative piece and a mounting unit. The computer housing includes an upper housing part that is provided with a display unit, and a lower housing part that is connected to the upper housing part and that is provided with a keyboard unit. The computer housing has an outer wall surface that is formed with a mounting portion. The decorative piece is disposed on the mounting portion. The mounting unit is provided on the mounting portion and the decorative piece for mounting the decorative piece removably on the mounting portion of the outer wall surface of the computer housing.
    Type: Grant
    Filed: January 31, 2000
    Date of Patent: June 4, 2002
    Assignee: Compal Electronics, Inc.
    Inventors: Chia-Chung Lee, Chih-Wen Chiang
  • Patent number: 6400575
    Abstract: A plurality of integrated circuits are efficiently interconnected to improve the electrical performance of the overall system. This is accomplished by providing high speed, high density, system level interconnect, including interchip routing lines, on the integrated circuit devices, thereby reducing the routing complexity of the substrate or board. The devices are mounted directly on the board. An integrated circuit device comprises an integrated circuit region including integrated circuit elements. An interconnect layer includes an insulative material, a plurality of conductive traces, and a plurality of conductive bond pads arranged in first and second subsets. A first subgroup of the conductive traces are connected to the integrated circuit elements in the integrated circuit region and are connected to the first subset of conductive bond pads.
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: June 4, 2002
    Assignee: Alpine Microsystems, LLC
    Inventors: Sammy K. Brown, George E. Avery, Andrew K. Wiggin, Samuel W. Beal
  • Patent number: 6396686
    Abstract: A mounting device for mounting a data storage device in a cage of a computer enclosure includes a board body and a plurality of fixing clips. The board body defines a plurality of mounting holes and receiving slots. Each fixing clip includes a inserting portion extending through the mounting hole of the board body and a corresponding side hole of the data storage device for attaching the board body to the data storage device, and first and second grounding fingers for respectively contacting the data storage device and the computer enclosure thereby forming a grounding path therebetween while fixing the data storage device to the computer enclosure.
    Type: Grant
    Filed: February 17, 2000
    Date of Patent: May 28, 2002
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Yu-Tai Liu, Yun-Long Chen, Alvin Liu
  • Patent number: 6396706
    Abstract: Separate heating elements are embedded in a printed circuit board near integrated circuit (IC) packages or other parts mounted on the circuit board. Each heating element supplies heat to the part residing near it in response to an input voltage pulse. The heating elements are used to selectively melt solder or adhesives attaching the parts to the circuit board so that they can be easily removed or to temporarily melt solder or cure adhesive when the parts are mounted on the circuit board. The heating elements are also used to supply heat to IC packages for regulating their operating temperatures.
    Type: Grant
    Filed: July 30, 1999
    Date of Patent: May 28, 2002
    Assignee: Credence Systems Corporation
    Inventor: Paul D. Wohlfarth