Patents Examined by David Foster
  • Patent number: 6392149
    Abstract: A cable arm for a computer system includes a first leg, a second leg hingedly joined to the first leg, and an enclosure flange hingedly joined to the second leg. The cable arm further includes a rack flange, hingedly joined to the first leg, capable of being attached to a rack for holding the computer system, an enclosure bracket capable of being attached to the computer system and capable of being attached to the enclosure flange, and a hook, extending from the second leg, capable retaining a cable attached to the computer system.
    Type: Grant
    Filed: September 13, 2001
    Date of Patent: May 21, 2002
    Assignee: Sun Microsystems, Inc.
    Inventors: David J. Kim, William W. Ruckman, Steven J. Furuta
  • Patent number: 6392897
    Abstract: A circuit module includes a connector terminal (4A) provided on a front surface of a printed wiring board (2) and connected to a data pin (DQt) of a memory IC (3) through an interconnect line (5a). A conductive connector terminal (4c) corresponds to the connector terminal (4a) and is provided on a back surface of the printed wiring board (2). A through hole (16) extends between part of the front surface of the printed wiring board (2) where the connector terminal (4a) is formed and part of the back surface thereof where the conductive connector terminal (4c) is formed. A conductor fills the through hole (16), thereby suppressing skews resulting from a difference in interconnect line length on the circuit module and decreasing a stub capacitance to achieve the reduction in power consumption.
    Type: Grant
    Filed: August 10, 1998
    Date of Patent: May 21, 2002
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yasunobu Nakase, Tsutomu Yoshimura, Yoshikazu Morooka, Naoya Watanabe
  • Patent number: 6392879
    Abstract: A drawer-type mounting device is adapted to mount a disk drive in a computer housing. The mounting device includes a lower case, an upper case, and a pulling member. The lower case has a first base plate with a first front end and a notch that extends rearwardly from the first front end. The upper case has a second base plate disposed slidably on the first base plate. The second base plate has a trench part which projects downward into the notch. The trench part has a guide rail unit that extends along a direction parallel to a line extending rearwardly from the first front end. The pulling member is mounted slidably in the trench part, and is guided by the guide rail unit for movement relative to the second base plate so as to move the upper case relative to the lower case.
    Type: Grant
    Filed: March 15, 2000
    Date of Patent: May 21, 2002
    Assignee: Compal Electronics, Inc.
    Inventor: Chung-Chi Chien
  • Patent number: 6392872
    Abstract: A computer system includes a chassis which is generally U-shaped in lateral cross-section and a cover which together define an internal cavity. A fan pack for cooling the computer system is removably disposed within the internal cavity. The fan pack includes three stacked pairs of individual fan units which are disposed in a row within a rectangular housing. The computer system also includes three power supplies for providing power for the computer system, each power supply being slidably disposed within associated power supply receiving channel formed in the chassis. Each power supply includes a housing, power supply electronics disposed within the housing, and a male electrical connector having both alternating and direct current connection capabilities.
    Type: Grant
    Filed: March 15, 1999
    Date of Patent: May 21, 2002
    Assignee: EMC Corporation
    Inventors: James Doustou, III, Ralph Larsen, Klaus J. Schneller, Arthur R. Nigro, Jr.
  • Patent number: 6388887
    Abstract: An acceleration sensor is disclosed which includes a capacitance-type acceleration detection element mounted on a ceramic base plate. The element comprises a movable electrode mounted between a pair of fixed electrodes. Acceleration of the sensor in a measurement direction causes the movable electrode to move relative to the fixed electrodes and the element has opposite ends in a direction perpendicular to the measurement direction. The acceleration detection element is mounted on the base at a first one of the opposite ends. Accordingly, the mounting surface of the acceleration sensor is parallel to the direction of acceleration to be detected. Thus the acceleration sensor can be surface-mounted on a printed board, and more be easily mounted in an automobile air bag control system or the like.
    Type: Grant
    Filed: November 28, 2000
    Date of Patent: May 14, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Masahiro Matsumoto, Seikou Suzuki, Masayuki Miki
  • Patent number: 6388873
    Abstract: A disk drive is usable in a chassis having first and second guide channels mounted on side surfaces of the chassis. The disk drive includes a head disk assembly that includes first and second side walls. The disk drive further includes first and second side rails and a securing system for securing the side rails to the side walls. The first and second side rails engage the first and second guide channels, respectively, for supporting the disk drive within the chassis. The securing system includes an engagement mechanism and a double-sided adhesive resilient mechanism. The engagement mechanism projects between the first and second side rails and the first and second side walls, respectively, of the head disk assembly.
    Type: Grant
    Filed: August 20, 1999
    Date of Patent: May 14, 2002
    Assignee: Western Digital Technologies, Inc.
    Inventors: Peter E. Brooks, Lance A. Gabrielson
  • Patent number: 6385045
    Abstract: A water-resistant switching device has an elastomeric body overmoulded to one part of the casing. The elastomeric body has a rib which co-operates with a hooked flange portion to define a space for receiving a hooked flange of another part of the casing to provide a watertight seal.
    Type: Grant
    Filed: February 25, 2000
    Date of Patent: May 7, 2002
    Assignee: Valeo Electronique
    Inventor: Brian Tissington
  • Patent number: 6385036
    Abstract: A computer case assembly that requires few or no screws for assembly includes a chassis that comprises a frame with side panels forming device bays for computer accessory devices. At least one of the side panels includes substantially parallel horizontal protrusions along the interior surface of the panel. A mounting rail has a screwless attachment for applying the mounting rail to a computer accessory device. The mounting rail is configured to slide between the protrusions of the side panel, and includes a latch to engage the chassis frame members. The chassis also includes a rear panel and a motherboard panel attached to the rear panel. The motherboard panel and the attached rear panel may be moved into a position in which the rear panel is substantially flush with the rear of the chassis. When the rear panel is substantially flush with the rear frame members, a latch affixed to the motherboard panel engages one of the rear frame members.
    Type: Grant
    Filed: September 10, 1999
    Date of Patent: May 7, 2002
    Inventor: Robert C. Chien
  • Patent number: 6381127
    Abstract: The present invention provides a laptop computer support having a generally planar support base with shoulder straps attached to a leading edge of the support base and back straps attached to a trailing edge of the support base. The shoulder and back straps converge at a strap junction overlaying the user's back when the computer support is in use. The laptop computer support affords virtually unrestricted access to at least three sides of the laptop computer base wherein hardware/software ports are conventionally located, and the shoulder and back straps are advantageously configured so as to distribute the weight of a laptop computer evenly across the user's shoulders and back. The laptop computer is variably fixed to the support base with a hook and loop type fastener.
    Type: Grant
    Filed: June 20, 2000
    Date of Patent: April 30, 2002
    Inventors: Hari K. Maddali, Meena Maddali
  • Patent number: 6377449
    Abstract: A drive bracket (8) for a data storage device includes a body (10) and a lever (50). The body includes a bottom panel (12) and two side walls (14, 16) extending from opposite side edges of the bottom panel. The body has a pair of sliding slots (18) for receiving bolts (70) attached to a data storage device. The lever has a base (51) and two side plates (53) extending from opposite ends of the base. The two side plates are pivotally attached to the side walls of the body for being movable toward a closed position where the side plates engage the bolts and thus retain the data storage device in the body.
    Type: Grant
    Filed: June 27, 2000
    Date of Patent: April 23, 2002
    Assignee: Hon Hai Aprecision Ind. Co., Ltd.
    Inventors: Nien Chiang Liao, Chiu-Chen Lin
  • Patent number: 6373717
    Abstract: An electronic package, and method of making the electronic package, is provided. The package includes a semiconductor chip and an multi-layered interconnect structure having a high density interconnect layer such as an allylated surface layer. The semiconductor chip includes a plurality of contact members on one of its surfaces that are connected to the multi-layered interconnect structure by a plurality of solder connections. The multi-layered interconnect structure is adapted for electrically interconnecting the semiconductor chip to a circuitized substrate (eg., circuit board) with another plurality of solder connections and includes a thermally conductive layer being comprised of a material having a selected thickness and coefficient of thermal expansion to substantially prevent failure of the solder connections between said first plurality of electrically conductive members and the semiconductor chip.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: April 16, 2002
    Assignee: International Business Machines Corporation
    Inventors: Francis J. Downes, Jr., Donald S. Farquhar, Elizabeth Foster, Robert M. Japp, Gerald W. Jones, John S. Kresge, Robert D. Sebesta, David B. Stone, James R. Wilcox
  • Patent number: 6373689
    Abstract: A display connector including a body having a receiving portion with a predetermined depth at its one end and having input keys on its top surface, and a display member for receiving a picture signal from the body and displaying an image. A rotation bracket is rotatably and slidably installed inside the receiving portion, and rotates between a first position at which the rotation bracket protrudes to the top surface of the body during rotation and a second position at which the rotation bracket is accommodated inside the receiving portion. A hinge pin is rotatably coupled to the rotation bracket and the display member is detachably connected to the hinge pin when the rotation bracket is positioned at the first position. A position fixing mechanism is provided for fixing the position of the rotation bracket. A light emitting module is supported by the rotation bracket to be rotated with the hinge pin, and has a laser diode array for independently irradiating light according to a driving signal.
    Type: Grant
    Filed: November 30, 2000
    Date of Patent: April 16, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Hong-kyun Yim
  • Patent number: 6373694
    Abstract: A fastening device is configured on a frame to have a plurality of pairs of opposed grooves, a block member on one side of the frame with grooves disposed thereon, and a plurality of latched members disposed on the block member each corresponding to the groove. In fastening hard disk to frame, insert hard disk into frame with projections of hard disks sliding along grooves until one projection contacts the latched member to be secured therein. In detaching a hard disk, push engagement section of latched member to release the projection of hard disk clear from the latched member prior to removing one hard disk from frame. The advantage is that other hard disks may not drop from frame while one hard disk is removed.
    Type: Grant
    Filed: August 10, 2000
    Date of Patent: April 16, 2002
    Assignee: Inventec Corporation
    Inventor: Lin-Wei Chang
  • Patent number: 6370019
    Abstract: A plurality of sealing methods may be used either alone or in combination with each other to seal an electronic display structure. The display module includes a first substrate having a plurality of column electrodes. Each of a plurality of portions of a display material are coupled to one of the plurality of column electrodes and to one of a plurality of row electrodes. A pixel seal may be formed over the display material to encapsulate the display material. An area seal may be formed upon the first substrate to encapsulates the row electrodes, the column electrodes, and the portions of display material. A bead seal may be formed around the perimeter of the first substrate to couple it to a second substrate while sealing the internal display material. An edge seal may be formed by a banded structure spanning from the first substrate to the second substrate and extending around the perimeter of the substrates.
    Type: Grant
    Filed: February 16, 1999
    Date of Patent: April 9, 2002
    Assignee: Sarnoff Corporation
    Inventors: Dennis Lee Matthies, Zilan Shen, Roger Green Stewart, James Harold Atherton
  • Patent number: 6370032
    Abstract: The present invention provides an interconnection scheme having complaint contacts arranged in an array to connect conductive surfaces on a microelectronic device and a supporting substrate, such as a printed circuit board. This invention accommodates for the difference in thermal coefficients of expansion between the device and the supporting substrate. Typically, an area array of conductive contact pads are connected into rows by conductive leads on a flexible, intermediate substrate. Each of the conductive leads bridges a bonding hole in the intermediate substrate which is situated between successive contact pads. Each of the conductive leads further has a frangible portion within or near each bonding hole. A stand-off between the intermediate substrate and the device is create by compliant dielectric pads, typically composed of an elastomer material, positioned under each contact pad.
    Type: Grant
    Filed: September 17, 1999
    Date of Patent: April 9, 2002
    Assignee: Tessera, Inc.
    Inventors: Thomas H. DiStefano, John W. Smith, Zlata Kovac, Konstantine Karavakis
  • Patent number: 6366459
    Abstract: A portable information equipment has a main body portion and a display portion hinged each other. A space is secured in the display portion by using a cabinet for a reflection type liquid crystal display which requires no backlight instead of a liquid crystal display with backlight. The space is used for an additional internal battery. The additional internal battery increases an electric capacity to extend an operation time of the portable information equipment and need no externally attached extension battery.
    Type: Grant
    Filed: June 15, 2000
    Date of Patent: April 2, 2002
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Masayuki Katagiri
  • Patent number: 6362954
    Abstract: A case for transporting and operating a mobile office system comprised of a portable computer and a portable printer. The computer and printer are separated to protect them when being transported, yet when the case is opened both computer and printer can quickly and easily be operated from within the case with minimal connecting or repositioning. Printed paper exiting a particular printer model can be accommodated by a cutout in the base of the case or a curved ramp within the case.
    Type: Grant
    Filed: February 24, 1998
    Date of Patent: March 26, 2002
    Inventor: Mark R. LeVander
  • Patent number: 6359836
    Abstract: An isolation mounting system for disk drive and other storage modules in which the operating unit (e.g., a disk drive) is locked more firmly into its operating position. During shipping and installation the lock is disengaged to allow full use of the elastomeric or other shock mounting system. Thus, the storage module of the present invention simulates a hard mount system during operation and a soft mount system during shipping and handling. A data storage module constructed according to one embodiment of the invention includes a data storage device, typically a disk drive, shock mounted in a housing and a lock selectively engagable between the data storage device and the housing. The lock is operable between a first disengaged position in which the lock does not restrict movement of the data storage device within the housing and a second engaged position in which the lock restricts substantially all movement of the data storage device within the housing.
    Type: Grant
    Filed: June 9, 1999
    Date of Patent: March 19, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Richard G. Sevier, Mike Strickler
  • Patent number: 6353539
    Abstract: A printed circuit board includes a first component mounted on a first side of the printed circuit board. A second component has an identical pin-out as the first component. The second component is mounted on a second side of the printed circuit board. A first signal line connects a first landpad coupled to a first contact on the first component with a second landpad coupled to a corresponding first contact on the second component. A second signal line connects a third landpad coupled to a second contact on the first component with a fourth land pad coupled to a corresponding second contact on the second component. The first signal line has is equal in length to the second signal line.
    Type: Grant
    Filed: July 21, 1998
    Date of Patent: March 5, 2002
    Assignee: Intel Corporation
    Inventors: Bryce D. Horine, Michael W. Leddige
  • Patent number: 6351393
    Abstract: An electronic package and method of making the electronic package is provided. The package includes a semiconductor chip and an multi-layered interconnect structure. The semiconductor chip includes a plurality of contact members on one of its surfaces that are connected to the multi-layered interconnect structure by a plurality of solder connections. The multi-layered interconnect structure is adapted for electrically interconnecting the semiconductor chip to a circuitized substrate (eg., circuit board) with another plurality of solder connections and includes a thermally conductive layer being comprised of a material having a selected thickness and coefficient of thermal expansion to substantially prevent failure of the solder connections between said first plurality of electrically conductive members and the semiconductor chip.
    Type: Grant
    Filed: July 2, 1999
    Date of Patent: February 26, 2002
    Assignee: International Business Machines Corporation
    Inventors: John S. Kresge, Robert D. Sebesta, David B. Stone, James R. Wilcox