Abstract: Provided is an electrode body that exhibits a good cathode side capacitance, and an electrolytic capacitor provided with this electrode body. The electrode body used for a cathode of the electrolytic capacitor has a cathode foil and a carbon layer. The cathode foil is made of a valve acting metal, and an enlarged surface layer is formed on the surface thereof. The carbon layer is formed on the enlarged surface layer. The interface between the enlarged surface layer and the carbon layer has an uneven shape.

Abstract: A capacitor is made using a wafer, and includes structural elevation portions to allow an electrode layer in the capacitor to be extended along surface profiles of the structural elevation portions to thereby increase its extension length, so as to reduce capacitor area, simplify capacitor manufacturing process and reduce manufacturing cost.

Abstract: An electrolytic capacitor according to the present disclosure includes an anode body, a cathode body, a solid electrolyte, and a liquid component. The anode body has a surface provided with a dielectric layer. The solid electrolyte is in contact with the dielectric layer, is disposed between the anode body and the cathode body and contains conductive polymer. The liquid component is in contact with the dielectric layer and the solid electrolyte and contains a solvent and an acid component. The acid component contains a first polymer acid component including a sulfonic acid group or a carboxylic acid group.

Abstract: A capacitor element that has an anode body, a dielectric oxide film layer covering the anode body, and a cathode body formed on the dielectric oxide film layer; an exterior body that covers the capacitor element; a contact layer that is on an anode terminal, which is an end portion of the anode body, and has a surface with a predetermined surface roughness; and an anode-side electrode layer that covers the surface are provided.

Abstract: The multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and first and second internal electrodes disposed inside the ceramic body, and disposed to oppose each other with the dielectric layer interposed therebetween. When an average thickness of the dielectric layer is referred to as td and a standard deviation of a thickness of the dielectric layer in each position is referred to as ?td, while an average thickness of the first and second internal electrodes is referred to as te and a standard deviation of a thickness of a pre-determined region of any layer of the internal electrodes in each position is referred to as ?te, a ratio (?te/?td) of the standard deviation of the internal electrodes in each position to the standard deviation of the thickness of the dielectric layer in each position satisfies 1.10??te/?td?1.35.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a capacitance formation portion including a dielectric layer and first and second internal electrodes with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively, and including first and second base electrodes connected to the first and second internal electrodes and first and second conductive layers disposed to cover the first and second base electrodes. When a thickness of the first and second conductive layers in a central portion of the first and second surfaces of the ceramic body is ‘a’, and a thickness of the first and second conductive layers at an end of the capacitance formation portion is ‘b’, ‘b/a’ is 0.07 or more.

Abstract: A method of manufacturing a solid electrolytic capacitor according to the exemplary embodiment of the present disclosure includes a step of exposing a cathode body end portion, which is a portion of a cathode body, from an exterior body covering the cathode body, which is a conductor, and forming a contact electrode, which is a metal film, on the exposed cathode body end portion.

Abstract: A dielectric material includes a main component represented by (Ba1-xCax)(Ti1-yZry)O3, (Ba1-xCax)(Ti1-ySny)O3, or (Ba1-xCax)(Ti1-yHfy)O3 (0?x?1 and 0?y?0.05) and a subcomponent. When an angle corresponding to a maximum peak is referred to as ?0 and angles corresponding to a full width at half maximum (FWHM) are respectively referred to as ?1 and ?2 (?1<?2) in the peaks of (002) and (200) plane of an x-ray diffraction (XRD) pattern using Cu K?1 radiation (wavelength ?=1.5406 ?), (?2??0)/(?0??1) is greater than 0.54 to 1.0 or less.

Abstract: A capacitor case sealed to retain electrolyte; a sintered anode disposed in the capacitor case, the sintered anode having a shape wherein the sintered anode includes a mating portion; a conductor coupled to the sintered anode, the conductor sealingly extending through the capacitor case to a terminal disposed on an exterior of the capacitor case; a sintered cathode disposed in the capacitor case, the sintered cathode having a shape that mates with the mating portion of the sintered anode such that the sintered cathode matingly fits in the mating portion of the sintered anode; a separator between the sintered anode and the sintered cathode; and a second terminal disposed on the exterior of the capacitor case and in electrical communication with the sintered cathode, with the terminal and the second terminal electrically isolated from one another.

Abstract: A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor sections. There may be six separately wound cylindrical capacitive elements each providing a capacitor section. The capacitor sections have a common element terminal. A pressure interrupter cover assembly is sealingly secured to the open end of case for the elements and has a deformable cover with a centrally mounted common cover terminal and a plurality of section cover terminals mounted at spaced apart locations. A conductor frangibly connects the common element terminal of the capacitor section to the common cover terminal and conductors respectively frangibly connect the capacitor section terminals to the section cover terminals.

Abstract: An improved electrolytic capacitor, and method of making the electrolytic capacitor, is provided. The electrolytic capacitor comprises an anode comprising a dielectric layer on the anode. A primary conductive polymer layer is on dielectric and a mordant layer on the primary conductive layer wherein the mordant layer comprises a mordant compound of Formula A; wherein: each of R1-R6 is independently selected from H and —PO(OR7)2 wherein each R7 is independently selected from H, substituted or unsubstituted alkyl of 1-20 carbons, substituted or unsubstituted aryl of 6-20 carbons or an alkylaryl of 7-21 carbons; with the proviso that at least one of R1-R6 is —PO(OH)2. A secondary conductive polymer layer is on the mordant layer.

Abstract: A multilayer ceramic capacitor includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are stacked, the plurality of internal electrode layers being exposed to at least one of a first end face and a second end face of the multilayer structure, the first end face being opposite to the second end face, a first external electrode provided on the first end face; a second external electrode provided on the second end face; and a fluorine compound that is adhered to at least a part of a region including a surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and surfaces of the first external electrode and the second external electrode, fluorine compound being released at a temperature of 380 degrees C. or more.

Abstract: A multilayer capacitive element and a design method of the same are provided. The capacitive element includes a substrate having a groove, a first aspect ratio modulation structure, and a plurality of conductive layers and a plurality of dielectric layers. The first aspect ratio modulation structure is located in the groove to define the groove as a first region and a first modulation region, wherein an aspect ratio of the first modulation region is different from that of the first region. The plurality of conductive layers and the plurality of dielectric layers are alternately stacked in the groove.

Abstract: A capacitor component comprising a first busbar, a second busbar, one or more capacitor elements and a housing, the housing having a first portion and a second portion, wherein the first portion and the second portion are arranged to extend around an aperture, the first portion includes a section for housing the one or more capacitor elements, with the second portion extending between a first end and a second end of the first portion, wherein the first busbar and the second busbar are arranged to extend around the first portion and the second portion of the housing, a first power supply terminal is formed at the first end of the first portion and a second power supply terminal is formed at the second end of the first portion, wherein the first power supply terminal is coupled to the first busbar and the second power supply terminal is coupled to the second busbar, wherein a first conductive layer of the one or more capacitor elements is coupled to the first busbar and a second conductive layer of the one or m

Abstract: An electronic component includes: a capacitor body; a pair of external electrodes disposed on opposite end surfaces of the capacitor body, respectively; and a pair of metal frames respectively including a pair of connected portions connected to the pair of external electrodes, respectively, and a pair of mounted portions bent at and extending from one ends of the pair of connected portions, respectively, wherein corners of end portions of the pair of mounted portions facing each other have a curved surface.

Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a plurality of internal electrodes disposed inside the ceramic body and each exposed to first and second surfaces of the ceramic body and to one of the third and fourth surfaces, and a first side margin portion and a second side margin portion disposed on sides of the plurality of internal electrodes exposed to the first and second surfaces. The ceramic body includes an active portion including the plurality of internal electrodes disposed to overlap each other with the dielectric layer interposed therebetween to form capacitance, an upper cover portion disposed above the active portion, and a lower cover portion disposed below the active portion. The first and second side margin portions have a dielectric composition different from a dielectric composition of one of the upper cover portion and the lower cover portion.

Abstract: A method for producing a film capacitor, the method including a sealing material supplying step of supplying a curable sealing material 30a to an element accommodating space 20a in which a film capacitor element 10 having a rolled body 12 is accommodated; and a curing step of curing the sealing material 30a in a state in which the rolled body 12 is embedded in the sealing material 30a, in which at the time of initiating the sealing material supplying step, the rolled body 12 is not fixed by the sealing material 30a, and in the sealing material supplying step, the sealing material 30a is supplied to the element accommodating space 20a without curing the sealing material 30a, from the beginning of the supply of the sealing material 30a to the element accommodating space 20a until the rolled body 12 is embedded in the sealing material 30a.

Abstract: Disclosed herein a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer disposed between the lower electrode layer and the upper electrode layer. The dielectric layer has a through hole. An inner wall surface of the through hole has a first tapered surface and a second tapered surface surrounded by the first tapered surface. The first and second tapered surfaces are not covered with the upper electrode layer and have respective first and second taper angles with respect to a surface of the lower electrode layer. The second taper angle is smaller than the first taper angle.

Abstract: A ceramic electronic component includes a multilayer structure having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, the dielectric layers being mainly composed of ceramic, the internal electrode layers being alternately exposed to two edge faces of the multilayer structure opposite to each other, wherein x/y is 0.143 or less where x represents an average concentration of hydrogen in ppm in a capacitance section where the internal electrode layers exposed to one of the two edge faces and the internal electrode layers exposed to the other of the two edge faces are opposed to each other, as measured by secondary ion mass spectrometry (SIMS), and y represents an average concentration of titanium in ppm in the capacitance section, as measured by SIMS at the same time of measuring the average concentration of hydrogen.

Abstract: Provided is an improved capacitor formed by a process comprising: providing an anode comprising a dielectric thereon wherein the anode comprises a sintered powder wherein the powder has a powder charge of at least 45,000 ?FV/g; and forming a first conductive polymer layer encasing at least a portion of the dielectric by applying a first slurry wherein the first slurry comprises a polyanion and a conductive polymer and wherein the polyanion and conductive polymer are in a weight ratio of greater than 3 wherein the conductive polymer and polyanion forms conductive particles with an average particle size of no more than 20 nm.