Patents Examined by Deoram Persaud
  • Patent number: 10969693
    Abstract: A device and method for producing light-exposed structures on a workpiece having a light-sensitive surface. An optical unit includes a light source and a diffraction grating for producing a strip-shaped illumination pattern having strips extending in a longitudinal direction and having a pattern width extending transversely. A device moves the surface of the workpiece and optical unit relative to each other according to a path sequence, which includes movement longitudinal paths to produce a first and second light-exposed structure having strips, which is oriented parallel to each other on the workpiece surface. The movement paths are mutually spaced apart by less than the pattern width and the light-exposed structures overlap in such a way that strips of the light-exposed structures lie on each other. To obtain good light exposure of the surface by the illumination pattern, the diffraction grating is set oblique to the surface of the workpiece that is light-exposed by the illumination pattern.
    Type: Grant
    Filed: July 4, 2018
    Date of Patent: April 6, 2021
    Assignee: Temicon GmbH
    Inventors: Oliver Humbach, Thomas Ruhl
  • Patent number: 10971352
    Abstract: A method includes transferring a wafer to a position over a wafer chuck; lifting a lifting pin through the wafer chuck to the wafer; introducing a gas to a region between the wafer and the wafer chuck through a plurality of first openings on a sidewall of the lifting pin; and lowering the lifting pin until the wafer reaches the wafer chuck.
    Type: Grant
    Filed: January 9, 2019
    Date of Patent: April 6, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Min-Cheng Wu, Chi-Hung Liao
  • Patent number: 10948829
    Abstract: A pattern forming apparatus configured to form a pattern on a substrate includes a holding portion configured to hold the substrate by suction, an optical system configured to detect, from a suction surface side of the substrate, an alignment mark provided to the substrate held by the holding portion, and a unit configured to shield light entering the optical system.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: March 16, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Naoki Funabashi
  • Patent number: 10928193
    Abstract: This disclosure relates to methods and tools for calibrating a camera-based three-dimensional optical metrology system such as that used for non-contact measurement of strain in a materials test system. A tool is provided which holds a calibration plate within a test space of a load frame of a materials testing device. The tool includes a spindle which rotates around a rotational axis to a series of detent rotational positions. The spindle engages the calibration plate by a bearing configuration which allows the tilt angle of the calibration plate to be varied. The rotation of the spindle and the variation of the tilt angle provides for two degrees of freedom of movement within the test space. The resulting sequence of calibration plate positions is systematic and repeatable.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: February 23, 2021
    Assignee: ILLINOIS TOOL WORKS INC.
    Inventors: Roy Allen, Stephen M. McMahon
  • Patent number: 10890850
    Abstract: An optical imaging arrangement includes an optical projection system, a support structure system and a control device. The optical projection system includes a group of optical elements supported by the support structure system and configured to transfer, in an exposure process using exposure light along an exposure light path, an image of a pattern of a mask onto a substrate. The group of optical elements includes a first optical element and a second optical element and the control device includes a sensor device and an active device. The sensor device is functionally associated to the first optical element and is configured to capture mechanical disturbance information representative of a mechanical disturbance acting on the first optical element in at least one degree of freedom up to all six degrees of freedom.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: January 12, 2021
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Stefan Hembacher, Bernhard Geuppert, Jens Kugler
  • Patent number: 10871722
    Abstract: A photomask purging method includes opening a pod having a photomask therein, gripping the photomask by an end effector, moving the end effector from the opened pod to a destination where a gas exit is toward, exhausting a gas from the gas exit toward the gripped photomask, and rotating the end effector with respect to a horizontal plane when the end effector is at the destination where the gas exit is toward.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: December 22, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chung-Yi Yen, Mei-Tsu Lai, Chen-Hung Lin, Chien-Chou Ke, You-Cheng Yeh, Tai-Hsiang Lin
  • Patent number: 10871714
    Abstract: A lithographic apparatus having a fluid handling structure configured to contain immersion fluid in a space adjacent to an upper surface of a substrate table and/or a substrate located in a recess of the substrate table, a cover including a planar main body that, in use, extends around a substrate from the upper surface to a peripheral section of an upper major face of the substrate in order to cover a gap between an edge of the recess and an edge of the substrate, and an immersion fluid film disruptor configured to disrupt the formation of a film of immersion fluid between an edge of the cover and immersion fluid contained by the fluid handling structure during movement of the substrate table relative to the fluid handling structure.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: December 22, 2020
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Niek Jacobus Johannes Roset, Nicolaas Ten Kate, Sergei Shulepov, Raymond Wilhelmus Louis Lafarre
  • Patent number: 10866531
    Abstract: An alignment system configured to be substantially insensitive to thermal variations in its system during alignment measurements. The alignment system includes a sensor system, a support structure, a sensing element, a position measurement system, and an athermal interface between the sensing element and the support structure. The sensor system is configured to determine a position of an alignment mark on a substrate and the support structure is configured to support the sensor system. The sensing element is configured to detect an unintentional displacement of the support structure and the position measurement system is configured to measure the unintentional displacement relative to a reference element based on the detected unintentional displacement. The athermal interface is configured to prevent detection of temperature induced displacement of the support structure by the sensing element.
    Type: Grant
    Filed: September 4, 2017
    Date of Patent: December 15, 2020
    Assignees: ASML Netherlands B.V., ASML Holding N.V.
    Inventors: Suzanne Johanna Antonetta Geertruda Cosijns, Maarten Van Der Heijden, Frederikus Johannes Maria De Vreede, David Taub, Eric Emery, Joseph Ashwin Franklin
  • Patent number: 10859930
    Abstract: Offline metrology measurements are performed on substrates that have been subjected to lithographic processing. Model parameters are calculated by fitting the measurements to an extended high-order substrate model defined using a combination of basis functions that include an edge basis function related to a substrate edge. A radial edge basis function may be expressed in terms of distance from a substrate edge. The edge basis function may, for example, be an exponential decay function or a rational function. Lithographic processing of a subsequent substrate is controlled using the calculated high-order substrate model parameters, in combination with low-order substrate model parameters obtained by fitting inline measurements to a low order model.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: December 8, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Jasper Menger, Paul Cornelis Hubertus Aben, Everhardus Cornelis Mos
  • Patent number: 10838306
    Abstract: A microlithographic projection exposure apparatus optical 22 system includes a first reflective surface and at least one second reflective surface, each in the optical beam path. The first reflective surface is movable for the correction of an aberration that occurs during the operation of the optical system. The optical system is configured in so that, during the travel movement of the first reflective surface, the relative position of the first reflective surface and of the second reflective surface is maintainable in a stable manner. Either the first reflective surface and the second reflective surface directly succeed one another in the optical beam path, or there are only reflective optical elements between the first reflective surface and the second reflective surface.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: November 17, 2020
    Assignee: Carl Zeiss SMT GmbH
    Inventor: Ulrich Schoenhoff
  • Patent number: 10824083
    Abstract: A light source for extreme ultraviolet (EUV) radiation is provided. The light source includes a target droplet generator, a laser generator, a measuring device, and a controller. The target droplet generator is configured to provide a plurality of target droplets to a source vessel. The laser generator is configured to provide a plurality of first laser pulses according to a control signal to irradiate the target droplets in the source vessel, so as to generate plasma as the EUV radiation. The measuring device is configured to measure process parameters including temperature of the source vessel, droplet positions of the target droplets, and beam sizes and focal points of the first laser pulses. The controller is configured to provide the control signal according to at least two of the process parameters.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: November 3, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi Yang, Ssu-Yu Chen, Shang-Chieh Chien, Chieh Hsieh, Tzung-Chi Fu, Bo-Tsun Liu, Li-Jui Chen, Po-Chung Cheng
  • Patent number: 10811265
    Abstract: Techniques herein include systems and methods for correcting pattern overlay errors by correcting or adjusting bowing of wafers. Location-specific tuning of stress on semiconductor substrates reduces overlay error. Location-specific tuning of stress independently modifies specific regions, areas, or point locations on a substrate to change wafer bow at those specific locations, which reduces overlay error on substrates, which in turn improves overlay of subsequent patterns created on the substrate. Techniques herein include receiving a substrate with some amount of overlay error, measuring bow of the substrate to map z-height deviations across the substrate, generating an overlay correction pattern, and then physically modifying internal stresses on the substrate at specific locations with modifications independent of other coordinate locations. Such modifications can include etching a backside surface of the substrate. One or more processing modules can be used for such processing.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: October 20, 2020
    Assignee: Tokyo Electron Limited
    Inventor: Anton J. deVilliers
  • Patent number: 10802403
    Abstract: A method for the microlithographic production of microstructured components, includes: providing a wafer, to which a photoresist is applied at least partly; providing a mask having structures to be imaged; providing a projection exposure apparatus having an illumination unit and a projection lens; exposing the photoresist by projecting at least one part of the mask onto a region of the photoresist with the aid of the projection exposure apparatus; and ascertaining a deviation between a structure property of the structures produced on the exposed wafer from a predefined desired structure property. Ascertaining includes: determining at least one property of a light field used for exposing the photoresist applied to the wafer. The method further includes aftertreating the wafer on the basis of the ascertained deviation, and chemically developing the after treated wafer.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: October 13, 2020
    Assignee: Carl Zeiss SMT GmbH
    Inventor: Michael Patra
  • Patent number: 10801968
    Abstract: Based on job dumps for defects of interest and nuisance events for multiple optical modes, detection algorithms, and attributes, the best combination of the aforementioned is identified. Combinations of each of the modes with each of the detection algorithms can be compared for all the defects of interest detected at an offset of zero. Capture rate versus nuisance rate can be determined for one of the attributes in each of the combinations.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: October 13, 2020
    Assignee: KLA-Tencor Corporation
    Inventor: Bjorn Brauer
  • Patent number: 10804167
    Abstract: Methods and systems for performing co-located measurements of semiconductor structures with two or more measurement subsystems are presented herein. To achieve a sufficiently small measurement box size, the metrology system monitors and corrects the alignment of the measurement spot of each metrology subsystem with a metrology target to achieve maximum co-location of the measurement spots of each metrology subsystem with the metrology target. In another aspect, measurements are performed simultaneously by two or more metrology subsystems at high throughput at the same wafer location. Furthermore, the metrology system effectively decouples simultaneously acquired measurement signals associated with each measurement subsystem. This maximizes signal information associated with simultaneous measurements of the same metrology by two or more metrology subsystems.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: October 13, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: David Y. Wang, Esen Salcin, Michael Friedmann, Derrick Shaughnessy, Andrei V. Shchegrov, Jonathan M. Madsen, Alexander Kuznetsov
  • Patent number: 10796948
    Abstract: A pattern forming method includes forming a first resist pattern on a substrate using imprint lithography. And forming a resist onto the substrate at least at positions corresponding to a second resist pattern and then curing the resist to form the second resist pattern on the substrate.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: October 6, 2020
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Anupam Mitra, Tetsuro Nakasugi, Kazuhiro Takahata
  • Patent number: 10788659
    Abstract: Systems and methods are provided for monitoring properties of a microelectromechanical systems (MEMS) oscillating structure. A system includes a MEMS oscillating structure configured as a non-linear resonator to oscillate about a rotation axis; a driver configured to generate a driving force for driving the MEMS oscillating structure about the rotation axis according to an operating response curve during which the MEMS oscillating structure is in resonance, the driver further configured to decrease the driving force when the MEMS oscillating structure is at a predefined tilt angle to induce an oscillation decay of the MEMS oscillating structure; a measurement circuit configured to measure an oscillation frequency and a tilt angle amplitude of the MEMS oscillating structure during a decay period; and processing circuitry configured to determine at least one characteristic of the MEMS oscillating structure based on at least one of the measured oscillation frequency and the measured tilt angle amplitude.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: September 29, 2020
    Assignee: Infinean Technologies AG
    Inventors: Hendrikus Van Lierop, Alexander Hulsker, Jaap Verheggen
  • Patent number: 10788758
    Abstract: Methods and apparatus for measuring a parameter of interest of a target structure formed on substrate are disclosed. In one arrangement, the target structure comprises a first sub-target and a second sub-target. The first sub-target comprises a first bias and the second sub-target comprises a second bias. The method comprises determining the parameter of interest using a detected or estimated reference property of radiation at a first wavelength scattered from the first sub-target and a detected or estimated reference property of radiation at a second wavelength scattered from the second sub-target. The first wavelength is different to the second wavelength.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: September 29, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Jin Lian, Nitesh Pandey
  • Patent number: 10784125
    Abstract: Disclosed is a substrate treating apparatus including a first liquid treatment chamber that performs a liquid treatment to a substrate, a second liquid treatment chamber that is disposed below the first liquid treatment chamber and performs a liquid treatment to a substrate, a first feed channel that supplies gases to the first liquid treatment chamber, and a second feed channel that supplies gases to the second liquid treatment chamber. The first feed channel includes a first vertical member that extends substantially vertically. The second feed channel includes a second vertical member that extends substantially vertically. The first vertical member and the second vertical member both extend to a position lower in level than the second liquid treatment chamber.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: September 22, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventor: Yukihiko Inagaki
  • Patent number: 10775703
    Abstract: A method for manufacturing a display panel includes: providing a first substrate and an exposure system, wherein the exposure system includes a light source module and a first shielding unit; disposing the first shielding unit at a position between the first substrate and the light source module in the initial state; moving the first shielding unit along a first direction; moving the light source module to pass through the first shielding unit along a second direction different from the first direction, and exposing the first substrate to the light emitted by the light source module; moving the light source module along the opposite direction of the second direction; and moving the first shielding unit back to the position between the first substrate and the light source module along the opposite direction of the first direction.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: September 15, 2020
    Assignee: INNOLUX CORPORATION
    Inventor: Chen-Kuan Kao