Abstract: A wire organizer is disclosed for organizing and restraining individual wires. The wire organizer includes a wire comb capable of transitioning individual wires from a radial arrangement to a side-by-side arrangement for connection to a series of electrical contacts arranged in a closely spaced relation. A cable cuff is also included and is capable of restraining individual wires against a jacket of the cable. The wire comb and cable cuff may each be loaded axially or longitudinally and may be coupled to one another by a bridge.

Abstract: A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 ?m or less when a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 ?m or less, and is about 20 ?m or less when a protruding length of the adjacent internal electrodes from the end surface is at least about 0.1 ?m. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.

Abstract: The invention describes apparatus for designing and installing power distribution systems for: residential, commercial and industrial applications, as well as for power distribution within electro-mechanical devices. The invention transforms existing labor-intense installations into practically plug-and-power type modular systems. For a specific project, pre-designed, fabricated and tested kit, including factory assembled and tested: power and control enclosures, power outlets and junction boxes, interface cables, as specified by the invention, will be delivered directly to the installation site. No labor intense operations: wire crimping, outlet/switch wiring, junction box wiring, load wiring. No exposed hot wires or leads at any point outside enclosure. The invention will: significantly lower labor costs, reduce installation time, improve safety, reliability and quality.

Abstract: A method for supplying a plurality of capacitance values to a plurality of heating, ventilation, air-conditioning, and refrigeration (HVAC/R) components is provided. The method includes configuring a first set of terminals of a connection device to couple a first capacitor to the connection device and configuring the connection device to couple the first capacitor to at least one of the plurality of HVAC/R components. The method further includes configuring a second set of terminals of the connection device to couple a second capacitor to the connection device and configuring the connection device to selectively couple the second capacitor to at least one of the plurality of HVAC/R components.

Abstract: A method of manufacturing a cranial shock absorption system. The method is comprised of forming a first layer of elastomer, positioning a thin layer of material on top surface of elastomer such that the top surface is exposed around the entire exterior of the layer of material, allowing the first layer to partially set, positioning a tubular stem or valve on the first layer adjacent to the layer of material, forming a second layer of elastomer, allowing the first layer and second layer of elastomer to fully set around the thin layer of material, removing the thin layer of material from between the first and second layers of elastomer and then introducing a fluid into the chamber through the tubular stem.

Abstract: A method of manufacturing a printed circuit board having a flow preventing dam, including: applying a dry film resist on a base substrate having a solder pad, and then primarily exposing the dry film resist to light; secondarily exposing the primarily exposed dry film resist formed on a peripheral area of the base substrate to light, thus forming a flow preventing dam; removing the unexposed dry film resist to expose the solder pad, thus forming an opening; printing the opening with a solder paste, and then forming a solder bump through a reflow process; and removing the primarily exposed dry film resist.

Abstract: A method of forming a stent includes the steps of forming an elongated composite member or plurality of elongated composite members into a stent pattern having struts interconnected by crowns, the composite member including an outer member and a core member. Openings are formed through the outer member of the composite member. The composite member is processed to remove the core member from at least a plurality of the struts of the stent without adversely affecting the outer member and such that the core member is not removed from at least a plurality of the crowns of the stent, thereby leaving the outer member with a lumen in at least a plurality of the struts and the outer member with the core member in at least a plurality of the crowns. The lumens may then be filled with a biologically or pharmacologically active substance.

Abstract: A method of shot peening in which with respect to a carburized and quenched metal part, only its surface abnormal layer detrimental to the fatigue strength thereof is scraped without scraping of the martensitic structure underlying the surface abnormal layer, namely, in which the fatigue strength can be rendered stable and enhanced without surface cracking. As bombardment shot, use is made of a shot with hardness higher than that (first hardness) of the surface abnormal layer occurring at a surface layer portion of metal part prior to shot peening but lower than that (second hardness) of the martensitic structure.

Abstract: A coupling conductor for a YIG filter or YIG oscillator, which may be produced from a metallic foil by eroding, laser cutting and/or etching of a metallic foil. The coupling conductor includes at least one curved section, which at least partially surrounds a YIG element and at least one conductor section.

Abstract: A component mounting apparatus mounting a component on a substrate includes a driving unit, a frame structure, a first outputting section, and a compensating section. The driving unit includes a head to hold the component and a driving mechanism to move the head. The frame structure is equipped with the driving unit. The first outputting section detects a vibration of the frame structure and outputs first displacement information as displacement information of the frame structure caused by the detected vibration. The compensating section compensates a position of the head that moves by the driving mechanism based on the first displacement information.

Abstract: A method for manufacturing a substrate structure is provided. The method includes the following steps. A substrate is provided. The substrate has a patterned first metal layer, a pattern second metal layer and a through hole. After that, a first dielectric layer and a second dielectric layer are formed at a first surface and a second surface of the substrate, respectively. The second surface is opposite to the first surface. Then, the first dielectric layer and the second dielectric layer are patterned. After that, a first trace layer is formed at a surface of the patterned first dielectric layer. The first trace layer is embedded into the patterned first dielectric layer and is coplanar with the first dielectric layer. Then, a second trace layer is formed on a surface of the second dielectric layer.

Abstract: A space transformer for a semiconductor test probe card and method of fabrication. The method may include depositing a first metal layer as a ground plane on a space transformer substrate having a plurality of first contact test pads defining a first pitch spacing, depositing a first dielectric layer on the ground plane, forming a plurality of second test contacts defining a second pitch spacing different than the first pitch spacing, and forming a plurality of redistribution leads on the first dielectric layer to electrically couple the first contact test pads to the second contact test pads. In some embodiments, the redistribution leads may be built directly on the space transformer substrate. The method may be used in one embodiment to remanufacture an existing space transformer to produce fine pitch test pads having a pitch spacing smaller than the original test pads.

Abstract: A method and apparatus for separating or spreading flanges of pipes is disclosed and includes two bolt hole engaging devices and a force transmission system. The force transmission system selectively couples with a bolt hole engaging device and is capable of exerting a force thereon for selective movement of the flanges relative to one another. The bolt hole engaging device comprises an expandable member that is arranged to be at least partially accommodated within the bolt hole before expansion, and an expander means arranged to expand the expandable member such that at least a portion of an outer surface of the expandable member is expanded to contact the bolt hole. The expander means may include at least one wedge shaped member and an actuator means for causing relative movement between the wedge shaped member and the expandable member.

Abstract: A motion-powered liquid sprayer that can increase the number of rotations of the pump relative to each rotation of the wheel or axle is provided. The sprayer can include a gearing assembly that employs gears to increase the number of pump revolutions as a function of the wheel or axle rotation. The sprayer can also include a gear pump that employs an over-capacity or enhanced gullet together with blow-by spacing to control consistent liquid flow relative to variable motional velocities. Further, the sprayer can include a vertically adjustable nozzle as well as a free reverse rotation wheel hub.

Abstract: The object of the invention is to provide an apparatus for setting a core, a molding machine, and a method for setting a core where the configuration of the apparatus and the machine is simplified and the accuracy of the core-setting is high.

Abstract: A producing method of a wired circuit board includes the steps of preparing the wired circuit board, placing the wired circuit board on a support table, and applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light, table reflected light and foreign-matter reflected light to inspect the conductive pattern and the foreign matter based on a contrast therebetween. In the step of inspecting the conductive pattern and the foreign matter, a reflectance of the table reflected light is in a range of 25 to 55%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%.

Abstract: A method for manufacturing an electronic device and a device manufactured according to this method including an assembly of at least two insulating sheets, at least one electronic element, a first insulating sheet including at least one window in which the electronic element is at least partially lodged. One face of the electronic element flushes with the external surface of said first insulating sheet. The device may further include an internal module located between the two insulating sheets, a layer of filling material, an adhesive protection film extending over a region covering at least the outline of the window, said protection film being situated between the first insulating sheet and the layer of filling material covering the protection film and the internal module, conductive connection areas electrically linked to the internal module through an opening of the protection film and positioned on an internal face opposite to the external face of the electronic element.

Abstract: The present invention is to provide an apparatus for crimping a terminal to an electrical wire, which have respective part numbers, and allows miniaturization of the apparatus. The apparatus includes a base, a drive portion, a plurality of applicators, a plurality of connection/disconnection portions and a control device. The drive portion drives the associated applicator to crimp the terminal to the electrical wire. The connection/disconnection portions each are disposed in one-to-one relation ship against the respective applicators. The each connection/disconnection portion is positionable at a connection and a disconnection position, where a driving force is transmitted to or released from the associated applicator. The control device controls the associated connection/disconnection portion so that the applicator corresponding to the part numbers of the electrical wire and the terminal can achieve crimping with the driving force from the drive portion.

Abstract: A method for manufacturing a Micro-Electro-Mechanical System pressure sensor. The method includes forming a gauge wafer including a diaphragm and a pedestal region. The method includes forming an electrical insulation layer disposed on a second surface of the diaphragm region and forming a plurality of sensing elements patterned on the electrical insulation layer disposed on the second surface in the diaphragm region. The method includes forming a cap wafer with a central recess in an inner surface and a plurality of through-wafer embedded vias made of an electrically conductive material in the cap wafer. The method includes creating a sealed cavity by coupling the inner recessed surface of the cap wafer to the gauge wafer, such that electrical connections from the sensing elements come out to an outer surface of the cap wafer through the vias. The method includes attaching a spacer wafer with a central aperture to the pedestal region with the central aperture aligned to the diaphragm region.

Abstract: A method for manufacturing a heat dissipation structure of a printed circuit board includes: forming a barrier layer on the dimple in the first copper plating layer; forming a nickel plating layer; removing the nickel plating layer and the barrier layer on the dimple; forming a second copper plating layer to make the total height of the first copper plating layer and the second copper plating layer in the second opening higher than that of the first copper plating layer in the first opening; filling the dimple in the second copper plating layer with an etching-resistant material; removing the second copper plating layer; removing the nickel plating layer and the etching-resistant material to make the second copper plating layer in the second opening being at the same height as the first copper plating layer in the first opening; and forming the heat dissipation structure by photolithography.