Abstract: An assembly system and method for assembling an aircraft wing box or other structure that may define an interior area accessible through at least one access opening are provided. The method includes inserting a robot having an assembly tool mounted thereto into the interior area through the at least one access opening. The assembly tool may be positioned at a fastener location, and may be clamped to the structure. A hole may be made through the structure, and a fastener may be installed in the hole.

Abstract: Disclosed is a method of manufacturing a multilayered tube, including: preparing an outer tube, an inner tube having an outer diameter of 95˜98% of an inner diameter of the outer tube, and dies with a shaping void having a diameter of 100.20˜100.

Abstract: A microelectronic device mounting substrate includes a bond pad with a side wall and an upper surface. A dielectric first layer is disposed on the mounting substrate and a solder mask second layer is disposed on the dielectric first layer. A uniform recess is disposed through the solder mask second layer and the dielectric first layer that exposes the portion of the bond pad upper surface.

Abstract: In a state where the expanded protruding portion of the heat-exchanging tube, which has been expanded inside a grip portion of a chucking sleeve whose diameter has been reduced by a clamp bushing, is gripped by the grip portion, a tube expanding billet is inserted into a yet-unexpanded part of the heat-exchanging tube to cause tube expansion. When doing so, a guide portion, which is formed on a flare punch and has the same diameter as the maximum outer diameter of the tube expanding billet, is inserted inside the expanded protruding portion of the heat-exchanging tube gripped by the grip portion.

Abstract: A challenge to be met by the present invention is to provide an electronic component mounting machine and an electronic component loading head in which the loading head has two rows of nozzle shafts and that can promote miniaturization of the machine by minimizing the loading head. In a loading head having two rows of nozzles (L1 and L2) including a plurality of nozzle shafts arranged in rows and at a predetermined nozzle arrangement pitch, a ? rotary drive mechanism that rotates the nozzle shafts around their axes is configured so as to include driven pulleys (28) coupled to the respective nozzle shafts; a plurality of idlers (30) interposed between the two rows of nozzles (L1 and L2); and endless drive belts (29A and 29B) that transmit rotation of the ?-axis motors (27A and 27B) to the driven pulleys (28).

Abstract: A technique for anchoring carbon nanotube columns to a substrate can include use of a filler material placed onto the surface of the substrate into area between the columns and surrounding a base portion of each of the columns.

Abstract: An object of an aspect of the present invention is to provide a method of producing a circuit board that allows highly accurate preservation of the circuit profile and gives a circuit having a desired depth in preparation of a fine circuit by additive process.

Abstract: A tool for changing first and second parts of a connector from a pre-assembly relationship into an assembled relationship. The tool is portable and has a frame with an operating mechanism thereon. The operating mechanism has a plunger that is movable to thereby change the relationship of the connector parts. The operating mechanism is operable by a pressurized fluid within a container that is connected to the frame.

Abstract: Provided is a wiring substrate, a semiconductor device package including the wiring substrate, and methods of fabricating the same. The semiconductor device package may include a wiring substrate which may include a base film. The base film may include a mounting region and a non-mounting region. The wiring substrate may further include first wiring patterns on the non-mounting region and extending into the mounting region, second wiring patterns on the first wiring patterns of the non-mounting region, and an insulating layer on the non-mounting region, and a semiconductor device which may include bonding pads. At least one of side surfaces of the second wiring patterns adjacent to the mounting region may be electrically connected to at least one of the bonding pads of the semiconductor device.

Abstract: This disclosure relates to an improved electrochemical sensor that has a simplified electrode assembly. The electrode assembly incorporates electrodes into or onto a single polymeric substrate. The working electrode can be porous, to enable an analyte, such as a toxic gas, to access an electrode-electrolyte interface. Ionic connection between electrodes can be made by an electrolyte on a back side of the electrode assembly, and external electronic circuitry can be connected directly to the electrode assembly. This construction dramatically simplifies the sensor, resulting in reduced costs and potentially improved performance. The construction is compatible with batch fabrication methods.

Abstract: A method of manufacture for an end effector assembly is provided. The method includes providing a pair of jaw members. A step of the method includes forming one or more seal plates positionable on one of the pair of jaw members. Etching a dam along a side of the one or more seal plates is a step of the method, wherein the etched dam inhibits the flow of a plastic on the one or more seal plate such that a height of the plastic with respect to the at least one seal plate during an overmolding process may be controlled. The method includes positioning the one or more seal plates on the one of the pair of jaw members; and overmolding the seal plate to one or more of the pair of jaw members.

Abstract: A method of forming a seal about an electrically conductive core of a cable having an insulative outer cover and a terminal includes the steps of providing a lead of the core extending beyond an axial edge of the insulative outer cover; spraying a conformal coating onto the lead; crimping the terminal onto the cable while the conformal coating is still wet to displace the conformal coating from between the lead and the abutting contact surfaces of the terminal and to cover and seal remaining portions of the lead not in direct contact with the terminal with the conformal coating and curing the conformal coating over the remaining portions of the lead.

Abstract: Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process.

Abstract: A system for joining tubular members comprising: a U-shaped joining member, with a first leg, a bottom of the U in communication with the first leg, and a second leg in communication with the bottom of the U, and wherein the first leg and second legs have a taper such that the cross-sectional surface area of the first leg is at a minimum at generally the far end of the first and second legs, and the cross-sectional surface is at a maximum at generally the beginning end of the first and second legs; an anchor member configured to fit generally in the bottom of the U; a first tubular member configured to fit abutting the anchor member, and between the first and second legs; a wire made of anisotropic material configured to be wound about the first leg, second leg, and a portion of the first tubular member located between the first leg and second leg; a second tubular member configured to structurally attach to the first tubular member, U-shaped joining member, anchor member, and anisotropic material; a pluralit

Abstract: The present invention is an improved method of installing a bathtub liner in a bathtub, with a liquid adhesive. The method steps include removing the bathtub drain and overflow protection device, templating and cutting the bathtub liner to properly fit into the bathtub, cleaning the bathtub, forming a foam rail gasket, setting the bathtub liner into place and forming the bathtub liner drain, removing the set bathtub liner and cleaning the bathtub liner, applying tub and wall adhesive and sealant between the bathtub and the bathtub liner, resetting the liner into place and installing the bathtub drain and stopper, installing any accessories, pouring the liquid adhesive between the liner and the bathtub, flushing away any unnecessary liquid adhesive and catalyzing the liquid adhesive.

Abstract: A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened.

Abstract: A terminal insertion apparatus having a connector housing holding unit, a terminal insertion unit, and a control unit. The connector housing holding unit holds a connector housing movably in horizontal and vertical directions. The terminal insertion unit inserts a terminal attached to an electric wire into a terminal accommodating chamber of the connector housing. After the terminal insertion unit has inserted an end of the terminal into the terminal accommodating chamber, the control unit controls a movable supporting unit of the connector housing holding unit so as to move a holding jig by amounts of movement in horizontal and vertical directions so that the terminal is not caught on an inner surface of the terminal accommodating chamber, and then the terminal is completely inserted in the terminal accommodating chamber.

Abstract: An apparatus for removal of a disk in a disk stack. The apparatus includes a shaft. The shaft has an end portion insertable into a disk remover tool. The shaft has a positioning portion at an end of the shaft opposite the insertable end portion. The positioning portion includes a surface de-tensionizer. The surface de-tensionizer provides disengagement of surface tension between the disk and a disk spacer during a disk removal process performed thereon.

Abstract: A device for releasably fastening a wire foil to a supporting strip in an installation for producing paper. The installation has a wire and wire foils that extend transversely with respect to the movement direction of the wire. The foils are situated at a spacing from one another in the movement direction of the wire and come into contact with the wire. Supporting strips for the wire foils are assigned to the wire foils and likewise extend transversely with respect to the movement direction of the wire. The wire foils or the supporting strips which are assigned to them are configured in their longitudinal direction with an undercut groove, and the supporting strips or the wire foils are configured with a spring which corresponds to the cross section of the undercut groove.

Abstract: A method of producing equal-sized spherical shaped beads of a wide range of materials is described. These beads are produced by forming the parent bead material into a liquid solution and by filling equal volume cells in a sheet with the liquid solution. The sheet cells establish the volumes of each of the cell mixture volumes which are then ejected from the cells by an impinging fluid. Surface tension forces acting on the ejected equal sized solution entities form them into spherical beads. The ejected beads are then subjected to a solidification environment which solidifies the spherical beads. The beads can be solid or porous or hollow and can also have bead coatings of multiple material layers.