Abstract: A method of manufacturing forks for lift trucks comprises the steps of: providing a straight metal bar designed to make the fork, heating the bar at a segment thereof where the fork knee is to be formed, bending the bar at the heated segment in order to form the knee by carrying out bending in a closed-die press provided with containment walls that, when bending has been completed, enclose the knee so as to define the surface contours of the latter.
Abstract: A fastening system head for attachment to a movable frame, in particular to a robot, has a carrier to which a fastening tool is attached which is rotatable about an axis of rotation. The fastening tool has a holding device for an element fastenable to a component, and has a fastening drive device to move the holding device along a fastening direction for fastening. The axis of rotation is oriented crosswise to the fastening direction. A feed mechanism is included to feed elements to the fastening tool. At least one additional feed mechanism is provided on the fastening system head, for feeding elements to the fastening tool.
Type:
Grant
Filed:
March 16, 2011
Date of Patent:
September 4, 2012
Assignee:
Newfrey LLC
Inventors:
Alfred Gerhardt, Florian Steinmueller, Sascha Becker
Abstract: A method for laying out a circuit board includes following steps. A substrate board is formed with a plurality of board sides. A ground plane, including a plurality of tiles, is provided. Each ground trace tile is defined by a plurality of ground traces. A signal plane on the substrate board has a plurality of signal traces that comprise of a plurality of straight line segments. Any one ground trace of each tile is arranged at an angle other than zero degrees relative to one determined board side. The straight line segments is applied to be mapped on the ground plane crossing one ground trace of one tile within an angle range determined by the ground traces of the tile and an adjacent diagonal line of the tile. The one ground trace and the straight line segments are applied at an angle movable in a range from 22.5° to 32.5°.
Abstract: An apparatus and method are disclosed that may include a contact pin; and a plurality of loops of conductive wire, coated with insulation material, disposed in proximity to the contact pin, wherein along at least one portion of the conductive wire, at least one edge of the contact pin extends through the insulation material and thereby forms conductive electrical contact with the conductive wire.
Abstract: A method of loading an article, such as a self-expanding stent, into a structures, such as a delivery catheter, including the steps of chilling the article to a predetermined temperature, reducing article size a predetermined amount, inserting fluid into the article, whereby the fluid forms a substantially solid plug with respect to the article, and moving the frozen article. Also provided is an apparatus for loading an article into a structure including: an article size reduction element, a chiller connected to the size reduction element, a cold source communicatively connected to the chiller, and a fluid supply communicatively connected to the size reduction element.
Abstract: The processing system (10) serves for processing a moving workpiece (12) by means of an industrial robot (16) that can be rigidly coupled, intermittently, to the workpiece (12) and/or to a movable workpiece carrier unit (14), the industrial robot (16), when in a decoupled operating position (42), being carried by a carrier device (18) that is movable, independently of a workpiece, by means of a drive unit (20) acting with active drive, and, when in a coupled operating position (44), being floatingly mounted relative to the carrier device (18) by means of a floating bearing system (22).
Abstract: Projections of a bevel gear or a vibrating body are formed by bending a metal-made plate member having a plurality of projections so as to direct them in the same direction and make their projecting direction include a component of out-of-plane direction and subsequently applying a load to the bent plate member to crush the projections so as to reduce the height thereof and increase the plate thickness.
Abstract: A minimum Z height handheld electronic device and methods of assembly is described. The electronic device includes a single seamless housing having a front opening and a cover disposed within the front opening and attached to the seamless housing without a bezel.
Type:
Grant
Filed:
February 25, 2010
Date of Patent:
August 28, 2012
Assignee:
Apple Inc.
Inventors:
Teodor Dabov, Hui Leng Lim, Kyle Yeates, Stephen Brian Lynch
Abstract: In one embodiment, a process, for fabricating a medical lead for stimulation of tissue of a patient, comprises: providing a plurality of wires; increasing an exterior surface area of each wire of the plurality of wires; arranging the plurality of wires angularly around a longitudinal axis; extruding polymer material of the plurality of wires; forming a lead body with a proximal end and a distal end after performing the extruding; and forming a plurality of terminals at a proximal end of the lead body; forming a plurality of segmented electrodes at a distal end of the lead body.
Abstract: In a method for making an inspection fixture, a detachable mold assembly and a hardenable fluid are firstly prepared. Secondly, the hardenable fluid is poured into the mold assembly, and a plurality of molding pins are inserted into the mold assembly. Thirdly, a main body with a plurality of positioning holes corresponding to the molding pins (i.e., the locations thereof) are formed in the mold after the hardenable fluid hardens. Fourthly, the mold assembly is detached, and the part is removed from the mold. Finally, a plurality of positioning pins is mounted into the positioning holes of the molded part, the positioning holes having remained upon removal of the molding pins.
Type:
Grant
Filed:
March 3, 2011
Date of Patent:
August 28, 2012
Assignees:
Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
Abstract: An exemplary electrical device manufacturing method includes the following steps. First, a first electronic module is provided. Second, one or more functions of the electronic module are verified. Third, a support module is provided. Fourth, one or more functions of the support module are verified. Fifth, the first electronic module is attached to the support module so as to form a first integrated module. Sixth, one or more functions of the first integrated module are verified.
Abstract: Provided is a method for manufacturing a thermally-assisted magnetic recording head including a light source unit with a light source and a slider with an optical system. The method comprises steps of: adhering by suction the light source unit with a back holding jig; moving the back holding jig, then aligning a light-emission center of the light source with a light-receiving end surface of the optical system in directions within a slider back surface of the slider; bringing the light source unit into contact with the slider back surface, with a suction surface of the back holding jig tilted from the normal to the slider back surface; applying a load to a load application surface of the unit substrate by a loading means to bring a joining surface of the light source unit into conformity with the slider back surface; and bonding the light source unit and the slider. This method can improve the conformity, thereby achieving adequately strong junction and adequately high accuracy in position.
Abstract: Protective shoe covers have been widely used in health care setting and some industry environment that require clean room condition. To strip off the disposed shoe covers in a hand-free and automated fashion is very desirable to the users, which provide physical convenience, time saving and economic merits. This disclosed invention provides methods and an automatic system for stripping of disposable shoe cover from user's foot/feet that includes the electro-mechanical complex, a micro control unit and its embedded software programs, control algorithm to guide the execution of the stripping functions in automated and hand-free fashion.
Abstract: The invention aims to provide substrate treatment equipment that can automatically collect a substrate in a normal condition without needing manual operation. The equipment includes a substrate holder for holding substrates in a multistage manner and a substrate transfer unit for transferring the substrates into the substrate holder, wherein a substrate holding condition of the substrate holder is sensed by a sensing section. The sensing section has photo-sensors, and sensing waveforms sensed by the photo-sensors are compared with a normal waveform. A control section is provided, which controls a substrate transfer unit such that substrates other than at least a substrate that was determined to be abnormal are transferred by the unit.
Abstract: A method for fabricating a circuit board includes providing a first substrate, forming a circuit on the first substrate, the circuit having a first electrode, a second electrode and at least one nanostructure, and transferring the circuit from the first substrate to a surface of a second substrate made of a polymer.
Type:
Grant
Filed:
September 19, 2008
Date of Patent:
August 21, 2012
Assignee:
SNU R&DB Foundation
Inventors:
Seung Hun Hong, Sung Myung, Ju Wan Kang
Abstract: An object of an aspect of the present invention is to provide a method of producing a circuit board that allows highly accurate preservation of the circuit profile and gives a circuit having a desired depth in preparation of a fine circuit by additive process.
Abstract: A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.
Abstract: A process for producing a circuit module including, carried out in this order, preparing a ceramic carrier substrate having ceramic substrate pads for mounting electronic parts, forming solder paste layers on the ceramic substrate pads, forming precoated solder layers by heating the ceramic carrier substrate having the solder paste layers on the ceramic substrate pads to melt the solder paste layers, and then cooling for solidifying the solder, preliminarily fixing stepped lid having protrusions adjacent to a cavity and dents adjacent to the cavity with the protrusions intervening therebetween to the precoated solder layers of the ceramic carrier substrate and joining the stepped lid to the ceramic carrier substrate with solder by placing the ceramic carrier substrate having the stepped lid preliminarily fixed to the precoated solder layers in a reflow furnace.
Abstract: A flexible, high density decal and the use thereof methods of forming detachable electrical interconnections between a flexible chip carrier and a printed wiring board. The flexible decal has fine-pitch pads on a first surface and pads of a pitch wider than the fine pitch on a second surface, the fine-pitch pads on the first surface designed to electrically connect to a semiconductor device, and the wider-pitch pads on the second surface designed to electrically connect to a printed wiring board or the like. The pads on the first surface are conductively wired to the pads on the second surface through one or more insulating levels in the flexible decal.
Type:
Grant
Filed:
July 16, 2010
Date of Patent:
August 14, 2012
Assignee:
Endicott International Technologies, Inc.
Inventors:
Voya R. Markovich, Ronald V. Smith, How T. Lin, Frank D. Egitto, Rabindra N. Das, William E. Wilson, Rajinder S. Rai
Abstract: Method for manufacturing an electronic module, which electronic module includes a component (6), which is connected electrically to a conductor-pattern layer (14). In the method contact openings (17) are made in the conductor layer (4), the mutual positions of which correspond to the mutual positions of the contact areas (7) of the component (6). After this, the component (6) and the conductor layer (4) are aligned relative to each other, in such a way that the contact areas (7) of the component (6) come to the positions of the contact openings (17), and the component (6) is secured. After this, at least in the contact openings (17) and the contact areas (7) of the component (6) a conductor material is made that connects the component (6) to the conductor layer (4). After the making of the contact the conductor layer (4) is patterned to form a conductor-pattern layer (14).
Type:
Grant
Filed:
June 13, 2005
Date of Patent:
August 14, 2012
Assignee:
Imbera Electronics Oy
Inventors:
Antti Iihola, Timo Jokela, Petteri Palm, Risto Tuominen