Abstract: A first wiring board, which is a flexible printed-circuit board, is bonded to a second wiring board. A plurality of protruding member are formed on the surface of the second wiring board. An adhesive is deposited on the surface of the second wiring board such that there is a thinner layer of the adhesive on the protruding member than in other areas. Subsequently, the first wiring board is placed on the second wiring board so that a portion of the first wiring board to be used for the wire-bonding is positioned above at least one of the protruding members. The first wiring board gets bonded to the second wiring board due to the adhesive.

Abstract: An ink jet head circuit board is provided which has heaters to generate thermal energy for ink ejection as they are energized. This circuit board has the heaters formed with high precision to reduce their areas. It also has provisions to protect the electrode wires against corrosion and prevent a progress of corrosion. The substrate is deposited with the thin first electrodes made of a corrosion resistant metal. This is further deposited with the resistor layer. The second electrodes made of aluminum are deposited to overlap the first electrodes to form the heater without causing large dimensional variations among the heaters. With this construction, if a defect should occur in a protective layer on or near the heater, a progress of corrosion can effectively be prevented because the material of the resistor layer is more resistant to encroachment than aluminum and the first electrodes are corrosion resistant.

Abstract: A method for manufacturing an acceleration sensing unit includes: providing an element support substrate in which a plurality of element supporting members is arranged so as to form a plane, each of the element supporting members being coupled to the other element supporting member through a supporting part and having a fixed part and a movable part that is supported by the fixed part through a beam, the beam having a flexibility with which the movable part is displaced along an acceleration detection axis direction when an acceleration is applied to the movable part; providing an stress sensing element substrate in which a plurality of stress sensing elements is arranged so as to form a plane, each of the stress sensing elements being coupled to the other stress sensing element through an element supporting part and having a stress sensing part and fixed ends that are formed so as to have a single body with the stress sensing part at both ends of the stress sensing part; disposing the stress sensing element

Abstract: A first and a second object (1 and 2) are joined with the aid of a joining element (8) including at least in the region of its distal and proximal ends (8.1 and 8.2) a thermoplastic material. Two blind holes (5 and 6) facing each other are provided in the two objects (1 and 2) and the joining element (8) is positioned in the blind holes such that its distal and proximal ends (8.1) are in contact with the bottom faces of the blind holes and such that there is a gap (9) between the two objects (1 and 2). This assembly is then positioned between a support (3) and a sonotrode (4). The sonotrode (4) and the support (3) are forced towards each other, while the sonotrode (4) is vibrated, thereby liquefying at least part of the material having thermoplastic properties, there, where the joining element ends (8.1 and 8.2) are pressed against the bottom faces of the holes (5 and 6) and allowing the liquefied material to infiltrate into pores of the hole surfaces or unevennesses or openings provided in the hole surfaces.

Abstract: A method comprising: a first process of placing a laminated rotor core in a preheating device to preheat the laminated core; a second process of removing the preheated laminated core from the preheating device and disposing the laminated core between upper and lower dies of a resin sealing apparatus; a third process of pressing the laminated core by the upper and lower dies and liquefying resin material in resin reservoir pots by heating; and a fourth process of ejecting the liquefied resin material from the pots into the magnet insertion holes by plungers inserted and moving vertically in the pots and thermally curing the resin material. The method improves efficiency of resin sealing the permanent magnets in the laminated core.

Abstract: Improved cored-wire fabrication replaces multiple roller pairs with one or more dies. In the preferred embodiment, flat stock is pulled through a single cylindrical die including an upper tab to ensure and orient the formation of a gap to receive internal powders. Once the powders are introduced, a cylindrical die is used for closure though again, one or more rollers may be used between the powder feed and the die used for closing. In the preferred embodiment, however, a single gap-forming die is used before the powder feed, and a single closing die is used after the powder feed, replacing numerous rollers and other moving parts, thereby dramatically simplifying the apparatus and method of manufacture.

Abstract: A connection device for an electric component 4 is constituted by two units 2 and 3, height position change means that changes the height position of one end 4a of the electric component 4 relative to the other end 4b is provided for a second unit 3, and the size and weight of a first unit 2 that connects the electric component 4 to a wiring board can be reduced. Therefore, the electric component 4 can be connected, under a low load, to a limited connection region of a wiring board.

Abstract: In a method for making an inspection fixture, a detachable mold assembly (20) and a hardenable fluid are firstly prepared. Secondly, the hardenable fluid is poured into the mold assembly, and a plurality of molding pins (23) are inserted into the mold assembly. Thirdly, a main body (21) with a plurality of positioning holes (2122) corresponding to the molding pins (i.e., the locations thereof) are formed in the mold after the hardenable fluid hardens. Fourthly, the mold assembly is detached, and the part is removed from the mold. Finally, a plurality of positioning pins is mounted into the positioning holes of the molded part, the positioning holes having remained upon removal of the molding pins.

Abstract: A method is disclosed for controlling warpage in an integrated electronic panel assembly including a plurality of die embedded within an encapsulant. The method comprises determining a number of build-up layers required for the integrated panel assembly. Each build-up layer contributes an amount of concavity to the integrated electronic panel assembly. A level of global convex warpage on the integrated panel assembly is then predicted, wherein the global convex warpage is provided by the presence of an embedded ground plane (EGP) alone within the integrated panel assembly and in the absence of any build-up layers. The embedded ground plane includes openings therein for accepting at least one die within a corresponding opening and it contributes a fixed amount of global convex warpage.

Abstract: An assembly apparatus for assembling a ball screw device includes a support block, a nut arranged in a longitudinal direction, a nut reception base that arranges the nut so that its axial direction towards vertical direction of the assembly apparatus and that supports the nut so as to elevate the nut with respect to the support block, a temporary shaft inserted into an inner diameter side of the nut arranged on the nut reception base and rotatably supported by the support block, an inclined face provided at a forward end portion of the temporary shaft, for guiding balls into the nut raceway groove and a pushing mechanism that has elasticity in the radial direction of the temporary shaft and that pushes balls which are fed into the nut raceway groove by a forward end portion protruding from the outer circumferential face of the temporary shaft.

Abstract: An apparatus for correcting the shape of an inner surface of a stator includes a deviation sensor for measuring the shape of the inner surface of the stator fixed inside an inner surface of a housing of a rotating electric machine, a personal computer for calculating a direction of deformation and the amount of deformation of the shape of the stator inner surface based on the measured shape of the stator inner surface as well as a direction of heating and the amount of heat to be input when heating an outer side surface of the housing based on the calculated direction and amount of deformation of the shape of the stator inner surface, and a gas burner for heating the outer side surface of the housing based on the direction of heating and the amount of heat to be input calculated by the personal computer.

Abstract: A method is provided for forming a plurality of regions of magnetic material in a substrate having a first approximately planar surface. The method comprises the steps of fabricating projections in the first surface of the substrate, depositing onto the first surface a magnetic material in such a way that the tops of the projections are covered with magnetic material, and depositing filler material atop the substrate so produced. The filler material may then be planarized, for example by chemical-mechanical polishing. In an alternative embodiment magnetic material is deposited on a substrate and portions of it are removed, leaving islands of material. Filler material is then deposited, which may be planarized.

Abstract: A quartz crystal unit comprises a quartz crystal tuning fork resonator capable of vibrating in a flexural mode of an inverse phase and having at least one groove having at least one stepped portion formed in at least one of opposite main surfaces of each of first and second quartz crystal tuning fork tines. An electrode is disposed on the at least one stepped portion of the at least one groove so that the electrode of the first quartz crystal tuning fork tine has an electrical polarity opposite to an electrical polarity of the electrode of the second quartz crystal tuning fork tine. The quartz crystal unit comprising the quartz crystal tuning fork resonator has a capacitance ratio r1 of a fundamental mode of vibration less than a capacitance ratio r2 of a second overtone mode of vibration.

Abstract: A tool includes a housing and a plunger supported by the housing. The housing has one or more tines configured to unlatch at least one terminated cable assembly from an electrical connector assembly. The plunger is configured to at least partially remove the at least one terminated cable assembly from the electrical connector assembly. The tool can be used as an extraction and insertion tool facilitating the repair of high speed electrical connectors.

Abstract: A method is provided for manufacturing a shaped tubular part from a first tube and second tube. The end of the first tube is inserted into the end of the second tube to provide a region of overlapping tube walls. An induction coil is placed around the outer surface of the first and second tubes at the region of overlapped tube walls. The induction coil is energized to make a plurality of longitudinally spaced apart magnetic pulse welds attaching the tubes together to thereby form a multi-tube one-piece composite tubular assembly. The tubular assembly is then subjected to a forming process such as hydroforming, tube bending or stretch bending to form the final shape of the tubular part.

Abstract: In order to increase the clamping effect in an electrical screw connector used in industrial applications to fix or hold an electrical conductor, the support and contact surfaces for the electrical conductor are textured. According to the invention, the texturing of the support and contact surfaces for the electrical conductor is carried out by various production methods using embossing or stamping tools.

Abstract: An interposer 2 comprising a base 10 formed of a plurality of resin layers 26, 34, 42, 52, 56; a thin-film capacitor 12 buried in the base 10, including a lower electrode 20, a capacitor dielectric film 22 and an upper electrode 24; a first through-electrode 14b formed through the base 10 and electrically connected to the upper electrode 24 of the thin-film capacitor 12; and a second through-electrode 14a formed through the base 10 and electrically connected to the lower electrode 20 of the thin-film capacitor 12, further comprising: an interconnection 48 buried in the base 10 and electrically connected to the respective upper electrodes 24 of a plurality of the thin-film capacitors 12, a plurality of the first through-electrodes 14b being electrically connected to the upper electrodes 24 of said plurality of the thin-film capacitors 12 via the interconnection 48, and said plurality of the first through-electrodes 14b being electrically interconnected by the interconnections 48.

Abstract: A wired circuit board having improved adhesion between the conductive pattern and an insulating layer to prevent a plating solution from remaining between a metal plating layer and the insulating layer. The invention prevents ionic impurities in the plating solution from remaining as residual or ionic contamination, thereby preventing a short circuit from developing when electric current flows through the circuit under a high temperature and high humidity environment. Lower end portions of the terminal portions that are formed on an insulating base layer and lower end portions of side surfaces and metal plating layers that cover the terminal portions are embedded in the insulating base layer in a flexible wired circuit board.

Abstract: A method of manufacturing a wiring board including an insulating layer where a semiconductor chip is embedded includes: forming, on a supporting board, the insulating layer where the semiconductor chip is embedded and a wiring connected to the semiconductor chip; removing the supporting board by etching; and simultaneously forming first and second reinforcing layers so as to sandwich the insulating layer after removing the supporting board.

Abstract: A method of connecting an electric actuator to a printed circuit by metal contacts having an open contact zone. The metal contacts are soldered to the printed circuit using an SMD-type automated method performed at a high speed and at a high temperature, and the electrical connection pins of the actuator can be mechanically connected to the metal contacts without soldering by butting the contact zone of the metal contacts against the connection pins of the actuator once the connection pins have been inserted through the contact zone.