Abstract: A multilayer ceramic capacitor includes a capacitor main body including a multilayer body and external electrodes, the multilayer body including dielectric layers and internal electrode layers stacked alternately, each of the external electrodes being provided on an end surface in a length direction of the multilayer body and being connected to the internal electrode layers, and two interposers on one surface in a stacking direction of the capacitor main body and spaced apart from each other in the length direction, the interposers including bonding surfaces bondable to the one surface of the capacitor main body and including inner edge portions which are opposite to each other and each having a length longer than a length in a width direction of the multilayer body.

Abstract: An electronic device comprises a first blocking electrode; a second blocking electrode; and a dielectric material disposed between the first electrode and the second electrode, the dielectric material comprising a compound of Formula 1 Li24-b*y-c*z-a*xM1yM2zM3xO12-???(1) wherein M1 is a cationic element having an oxidation state of b, wherein b is +1, +2, +3, +4, +5, +6, or a combination thereof; M2 is a cationic element having an oxidation state of c, wherein c is +1, +2, +3, +4, +5, +6, or a combination thereof; M3 is a cationic element having an oxidation state of a, wherein a is +1, +3, +4, or a combination thereof; 0?y?3; 0?z?3; 0?x?5; and 0???2. Methods for the manufacture of the electronic device are also disclosed.

Abstract: A multilayer ceramic electronic component may include: a ceramic body including a dielectric layer and first and internal electrodes disposed to be stacked with the dielectric layer interposed therebetween; a first and a second external electrode disposed on the ceramic body. The first and the second external electrodes may include a first and a second base electrode layers disposed in contact with the ceramic body and a first and a second resin electrode layers disposed on the first and the second base electrode layer respectively, a width of the ceramic body in the second direction may be less than 1.0 mm, and 0.4×ta?tb?0.5×ta in which ta is an average thickness of the first base electrode layer and tb is an average thickness of the first resin electrode layer.

Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes: an electronic component body including a body having a dielectric layer and an internal electrode, and an external electrode disposed on the body; and a coating layer disposed on an external surface of the electronic component body, including one or more of silicon (Si) and fluorine (F), and having an average thickness of 5 nm or more and 15 nm or less.

Abstract: A multilayer electronic component includes a body including a plurality of internal electrodes and a dielectric layer disposed between the plurality of internal electrodes; and an external electrode disposed on the body and connected to the plurality of internal electrodes, wherein each of the plurality of internal electrodes includes a plurality of nickel layers, and a heterogeneous material layer provided between the plurality of nickel layers.

Abstract: A multilayer ceramic capacitor package accommodating multilayer ceramic capacitors includes a carrier tape that is elongated and includes recess pockets at equal or substantially equal intervals in a longitudinal direction, a cover tape that is elongated and attached to the carrier tape to cover an opening of each of the pockets, and the multilayer ceramic capacitors respectively accommodated in the pockets. In the multilayer ceramic capacitor package, in adjacent multilayer ceramic capacitors, a difference in densities of surfaces on an opening side of the pockets is about 0% or more and about 4% or less.

Abstract: The present invention is directed to a multilayer ceramic capacitor. The multilayer ceramic capacitor has a first end and a second end that is spaced apart from the first end in a longitudinal direction that is perpendicular to a lateral direction wherein the lateral direction and longitudinal direction are each perpendicular to a Z-direction. The multilayer ceramic capacitor comprises a monolithic body comprising a plurality of dielectric layers and a plurality of electrode layers parallel with the lateral direction.

Abstract: A dielectric material includes a perovskite as a main phase, an A site of the perovskite including at least Ba, a B site of the perovskite including at least Ti, and Eu having +2 valence and +3 valence. A ratio of +2 valence of Eu is 21% or more.

Abstract: An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.

Abstract: A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are stacked, a plurality of external electrodes, an active region including a plurality of internal electrodes, and an additional electrode region including a plurality of additional electrode layers. The plurality of additional electrode layers are connected to an external electrode, among the plurality of external electrodes, different from an external electrode which a most adjacent internal electrode among the plurality of internal electrodes of the active region is connected to, and 1<d/e?5 in which e is a distance between adjacent internal electrodes among the plurality of internal electrodes and d is a distance between an internal electrode, among the plurality of internal electrodes, and an additional electrode layer, among the plurality of additional electrode layers of the additional electrode region, which are most adjacent to each other.

Abstract: A method of fabricating a capacitor that includes: forming a three-dimensional structure over a substrate, the three-dimensional structure having a region with elongated pores extending towards the substrate from a top surface of the three-dimensional structure remote from the substrate or elongated columns extending away from the substrate towards the top surface of the three-dimensional structure remote from the substrate; forming a first electrode layer over a surface of the region of the three-dimensional structure, the first electrode conformal to the surface of the region; forming an intermediate layer over the first electrode layer; and forming a second electrode layer over the intermediate layer, the second electrode layer conformal to the intermediate layer, wherein forming the intermediate layer includes: forming a solid-state electrolyte layer partially conformal to the first electrode layer; and forming a dielectric layer conformal to the first electrode layer.

Abstract: An electrolytic capacitor comprises a case, a capacitor element mounted in the case and an element for controlling gas diffusion between inside and outside the case. The controlling element is embedded in the case.

Abstract: A ceramic electronic device includes an element body and an external electrode. The element body includes a ceramic layer and an internal electrode layer. The external electrode is formed on an end surface of the element body and electrically connected to a part of the internal electrode layer. The ceramic layer includes a perovskite compound represented by ABO3 as a main component. The external electrode includes a baked electrode layer having a first region and a second region. The first region is contacted with the end surface of the element body and located near a joint boundary with the element body. The second region is located outside the first region and constitutes an outer surface of the baked electrode layer. The first region includes a glass frit including at least B, Zn, and Si. The second region includes an oxide having a higher melting point than Cu.

Abstract: A ceramic electronic device includes an element body and an external electrode. The element body includes a ceramic layer and an internal electrode layer. The external electrode is formed on an end surface of the element body and electrically connected to a part of the internal electrode layer. The ceramic layer includes a perovskite compound represented by ABO3 as a main component. The external electrode includes a conductor and a glass frit diffused in the conductor. The glass frit includes B, Si, Ba, and Zn. A boundary layer is present at an end of the ceramic layer in contact with the external electrode on the end surface of the element body and comprises an oxide including Ba, Zn, and Si.

Abstract: A multilayer capacitor, includes: a body including a dielectric layer and first and second internal electrode, and a first external electrode and a second external electrode, each disposed an exterior of the body, the first external electrode being connected to the first internal electrode and the second external electrode being connected to the second internal electrode, wherein the first external electrode and the second external electrode include an electrode layer disposed on the body, and including a first intermetallic compound and glass; and a conductive resin layer disposed on the electrode layer, and including a plurality of metal particles and a resin.

Abstract: Relatively low noise capacitors are provided for surface mounted applications. Electro-mechanical vibrations generate audible noise, which are otherwise relatively reduced through modifications to MLCC device structures, and/or their mounting interfaces on substrates such as printed circuit boards (PCBs). Different embodiments variously make use of flexible termination compliance so that surface mounting has reduced amplitude vibrations transmitted to the PCB. In other instances, side terminal and transposer embodiments effectively reduce the size of the mounting pads relative to the case of the capacitor, or a molded enclosure provides standoff, termination compliance and clamping of vibrations.

Abstract: A capacitor element and a method for manufacturing the same are provided. The method for manufacturing the capacitor element includes steps of: providing a metal foil having an oxide layer formed on an outer surface of the metal foil; forming a surrounding barrier layer surroundingly on the oxide layer with the surrounding barrier layer surroundingly formed on an outer surface of the oxide layer; forming a priming layer onto the oxide layer; immersing the priming layer into a chemical synthesis solution for undergoing a chemical synthesis reaction; drying the priming layer so as to form a repaired layer on the priming layer; forming a conductive polymer layer on the repaired layer; and forming a conductive paste layer on the conductive polymer layer with the conductive paste layer including a silver paste layer.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and internal electrodes; first electrode layers disposed on the ceramic body and connected to the internal electrodes, respectively; and second electrode layers disposed on the first electrode layers, respectively, and respectively including a conductive metal including silver and palladium, carbon materials, and glass particles, wherein an area ratio of the carbon materials in a cross section of at least a portion of each of the second electrode layers is 1 to 5%.

Abstract: A capacitor component includes a body including internal electrode layers and a dielectric layer disposed between the internal electrode layers adjacent to each other and an external electrode disposed on one surface of the body, wherein the internal electrode layer and the dielectric layer separately include molybdenum (Mo), the dielectric layer has a central portion in a thickness direction and an outer portion disposed between the central portion and the internal electrode layer, and the content of molybdenum contained in the central portion of the dielectric layer is less than the content of molybdenum (Mo) contained in the outer portion of the dielectric layer.

Abstract: A poly(vinylphosphonic acid) (PVPA)-(NH4)2MoO4), gel polymer electrolyte can be prepared by incorporating redox-mediated Mo, or similar metal, into a PVPA, or similar polymer, matrix. Gel polymer electrolytes including PVPA/MoX, x representing the percent fraction Mo in PVPA, can be used to make supercapacitors including active carbon electrodes. The electrolytes can be in gel form, bendable and stretchable in a device. Devices including this gel electrolyte can have a specific capacitance (Cs) of 1276 F/g, i.e., a more than 50-fold increase relative to a PVPA system without Mo. A PVPA/Mo10 supercapacitor can have an energy density of 180.2 Wh/kg at power density of 500 W/kg, and devices with this hydrogel structure may maintain 85+% of their initial capacitance performance after 2300 charge-discharge cycles.