Abstract: Systems and methods for determining a status of an action performed by a power tool. For example, the power tool includes a power tool housing, an accessory, and an electronic processor. The housing includes a recess and an input device. The accessory is configured to be received by the recess. The accessory includes an identifier. The electronic processor is connected to the input device. The electronic processor is configured to receive a first signal from the identifier, determine an accessory type based on the first signal, receive a second signal from the input device, initiate an action based on the second signal, determine an outer diameter of the workpiece, calculate a force applied by the power tool, determine a distance traveled by the accessory during the action, and determine a status of the action based on the force applied to the workpiece and the distance.

Abstract: A method for making a bayonet connecting element for a connector, according to which a connecting element body, with a hollow cylindrical general shape is made. The method includes making a through bore by drilling a wall of the body of the connecting element, from the outer surface of the wall. The outer surface of the wall is machined around the bore so as to create a conical contact surface around the bore. A lug is inserted into the bore, from the outer surface of the wall, so that a head of the lug projects from the outer surface of the wall of the connecting element. The lug having a conical contact surface corresponding to the conical contact surface of the bore.

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

Abstract: Electrical cables and processes for making and using same. In some examples, the electrical cable can include one or more insulated electrical conductors and one or more metallic elements cabled together and a metallic layer disposed about the one or more insulated electrical conductors and the one or more metallic elements. The one or more metallic elements can partially fill a space located between the one or more insulated electrical conductors and the metallic layer. The one or more insulated electrical conductors can each include an electrically conductive core, a layer of electrically insulating material disposed about the electrically conductive core, and a layer of metallic strands disposed about the layer of electrically insulating material.

Abstract: A magnet spacer and a motor. The magnet spacer includes: a first engagement portion being configured to extend along a first axis; and a second engagement portion being configured to extend along a second axis and configured to be integrally formed with the first engagement portion; wherein a predetermined angle is formed between the first axis and the second axis; wherein the shape of the first engagement portion is configured to match the shape of a recess in a motor rotor; and wherein the side shape of the second engagement portion is configured to match the side shape of a motor magnet.

Abstract: A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.

Abstract: Micromachined ultrasonic transducer (MUT) arrays capable of multiple resonant modes and techniques for operating them are described, for example to achieve both high frequency and low frequency operation in a same device. In embodiments, various sizes of piezoelectric membranes are fabricated for tuning resonance frequency across the membranes. The variously sized piezoelectric membranes are gradually transitioned across a length of the substrate to mitigate destructive interference between membranes oscillating in different modes and frequencies.

Abstract: A method comprises inserting a press-fit element into a through hole on a substrate board. The method also comprises obtaining a target heat-application plan for the press-fit element. The method also comprises applying heat to the press-fit element. The method also comprises determining that the target heat-application plan has been completed. The method also comprises withdrawing heat from the press-fit element.

Abstract: Embodiments of the invention provide a crimper for use in a tool. The crimper can include a clevis, a nest, and an indenter. The clevis can include a first leg having a first slot and a second leg having a second slot. The first leg and the second leg can extend from a cylindrical body that has a base surface. The indenter can be configured to be moved from a retracted position to an extended position. The indenter can include a body with a work surface and a base on opposing sides of the body. The base of the indenter can be configured to engage the base surface of the cylindrical body when the indenter is in the retracted position.

Abstract: Electronic substrates, contact pads for electronic substrates, and related methods are disclosed. Electronic substrates may include an electrically conductive layer that forms at least one contact pad and at least one metal trace on a non-conductive layer. The contact pads are arranged with greater thicknesses or heights above the non-conductive layer than the metal traces. Dielectric layers are disclosed that cover the metal traces while leaving top surfaces of the contact pads exposed. Top surfaces of the dielectric layers may be arranged to be coplanar with top surfaces of the contact pads to provide electronic substrates having generally planar top faces. Bottom faces of electronic substrates may include mounting pads that are coplanar with additional dielectric layers. Methods are disclosed that include forming dielectric layers to cover contact pads and metal traces, and removing surface portions of the dielectric layers until the contact pads are accessible through the dielectric layers.

Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.

Abstract: The present disclosure relates to a method of manufacturing a membrane-electrode assembly capable of reducing consumption of an electrolyte membrane. Specifically, in the present disclosure, a polymer film replaces a non-reaction portion of a conventional electrolyte membrane, so it is possible to prevent waste of a high-priced electrolyte membrane. Consequently, production of membrane-electrode assemblies is improved.

Abstract: Tape-feeder setting work apparatus (40), which is used when an operator performs a work of setting a component supply tape wound on tape reel (12), in tape feeder (10), includes feeder set base (41) configured to hold the tape feeder in the setting work of the component supply tape, power supply section (47) configured to supply a power to tape feeding device (29) inside the tape feeder, and operation section (51) configured to allow the operator to operate the tape feeding device inside the tape feeder. When a work of setting a tip portion of the component supply tape by pulling out the tip portion from the tape reel set in the tape feeder held by the feeder set base is performed, the operator operates the operation section of the tape-feeder setting work apparatus to operate a tape feeding operation of the tape feeding device inside the tape feeder, and feeds the tip portion of the component supply tape pulled out from the tape reel to a component pickup position of the tape feeder.

Abstract: A crimping tool, for attaching at least one wire to a connector, includes a housing, a first handle coupled to the housing, and a second handle coupled to the housing and movable relative to the first handle. The crimping tool also includes a working head coupled to the housing opposite the first and second handles. The working head includes an upper wall, an end wall, and a gap defined between the upper wall and the end wall. The crimping tool also includes a punch assembly slidable along the working head toward the end wall in response to movement of the second handle toward the first handle. The punch assembly is visible through the gap as the punch assembly slides toward the end wall.

Abstract: Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.

Abstract: A crimping tool and associated method to create a mechanical and electrical connection between two cable elements. A tool body including a first and second attachment points. A first guidance element arranged at a first distance from the first and second attachment points. A second guidance element arranged at a second distance from the first guidance element. The first and second attachment points are arranged on a first side of the first and second guidance elements. A flexible cable with first and second end parts removably attached to the first and second attachment points, respectively. The cable engages the first and second guidance elements. The cable extends between the first and attachment points such that a loop is formed on a second side of the first and second guidance elements. A powering unit configured to increase the first distance so that a diameter of the loop decreases.

Abstract: The present invention relates to methods and systems for deposition of metal conductors using asymmetrical electrolytic plating, in which one surface (e.g., top) of a substrate is coated with an electrical conductor, and an opposite (e.g., bottom, or other) surface of which is not coated. A channel is formed between the two sides of the substrate, passing through the substrate and, in some embodiments, passing through the conductor. Electrolytic plating is performed such that metal is deposited from the edge of the conduct proximal to the channel, along the side walls of the channel, and up to, and in some embodiments on to, the other side of the substrate. Use of etching or plate resist layers are also contemplated.

Abstract: A method of removing a foil shield from a cable includes positioning the cable proximate a heating source, monitoring a characteristic of the cable or the heating source with at least one sensor, heating the foil shield in a designated area to weaken the foil shield, and removing an outer insulation of the cable and the foil shield.

Abstract: A method for manufacturing a multilayer wiring substrate includes forming a resist layer having mask pattern, forming a conductor layer having conductor pattern using the resist layer, removing the resist layer, forming an insulating layer on the conductor layer such that the insulating layer is laminated on the conductor layer, forming a subsequent resist layer having mask pattern such that the subsequent resist layer is formed on the insulating layer, and forming a subsequent conductor layer having conductor pattern using the subsequent resist layer. The forming of the resist layer includes conducting first correction in which formation position of entire mask pattern of the resist layer is corrected with respect to reference position, and conducting second correction in which shape of the mask pattern of the resist layer is corrected with respect to reference shape, and the forming of the subsequent resist layer does not include conducting the second correction.

Abstract: A crimping die including a first die piece having a recess portion and a second die piece having a protrusion portion is provided. An inner wall surface of the recess portion has a bottom wall surface and recess-side lateral end surfaces. An outer surface of the protrusion portion has a top end surface and protrusion-side lateral end surfaces. The bottom wall surface has a recess-side projection portion, a recess-side concave portion, and a recess-side curvature changing portion. The top end surface has a protrusion-side projection portion, a protrusion-side concave portion, and a protrusion-side curvature changing portion. A sign of curvature of the bottom wall surface changes at a boundary portion in the recess-side curvature changing portion with respect to the recess-side concave portion. A sign of curvature of the top end surface changes at a boundary portion in the protrusion-side curvature changing portion with respect to the protrusion-side concave portion.