Abstract: A method and system for performing work from a suspension work platform incorporating a work tool attached to an articulating arm system.

Abstract: The centrifugal projector (1) of the present invention has: a side plate (11), a plurality of blades (3) attached to the side plate (11), a control cage (41-45) disposed on a radial inner side of the side plate for releasing the projection material between blades from an opening portion (41a-45e), a distributor (22), disposed on a radial inner side of the control cage, for mixing and supplying the projection material to the control cage, and a rotary shaft (14) for rotating the side plate, blades and distributor; wherein the blades are formed to be pitched so that a radial outer side (3c) thereof is positioned to a rear in the rotational direction (R1) compared to a radial inner side (3b) thereof; the control cage (41-45) has a plurality of opening windows (41a-45e), or a single opening window in which a portion or all of a plurality of opening windows are respectively overlapped and integrated into a single piece.

Abstract: A method of treating an articular surface of a metal orthopedic implant includes polishing the surface, blasting the surface with a blast media after the first polishing step and polishing the blasted surface of the metal orthopedic implant after the blasting step. The blasting step roughens the surface to create a surface skew Rsk/Ssk defined by peaks and valleys. The second polishing step reduces the surface skew to a negative skew Rsk/Ssk and produces an average roughness Ra/Sa that is acceptable. Lubrication at the interface of the treated articular surface and the corresponding bearing articular surface is improved, thereby improving wear resistance. Both polishing steps may be performed by drag finishing the surface through an abrasive media.

Abstract: A method is disclosed for maintaining a hard surface, the method comprising treating the surface with a flexible pad (1), in the presence of abrasive particles, bonded to the pad, on a contact surface between the pad (1) and the hard surface. The abrasive particles comprise diamond particles, and the treating is performed in the absence of an effective amount of crystallization agent on the contact surface. A tool for use in the method is also provided, as well as a floor surfacing machine comprising such a tool and a method for manufacturing such a tool.

Abstract: A polishing system and method for polishing a channel formed within a component is disclosed. The polishing system may include a tooling element operable to be positioned within a recess formed partially through a component. The tooling element may include an outer surface having a geometry corresponding to a geometry of the recess formed in the component. The tooling element forms a channel between the recess of the component and the tooling element when positioned in the recess. The system may also include a first member in fluid communication with a first opening of the channel, and a second member in fluid communication with a second opening of the channel. The second opening may be in fluid communication with the first opening via the channel. Additionally, the first and second member may be configured to continuously vary a pressure within the channel to move an abrasive slurry within the channel.

Abstract: Implementations of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates, including an apparatus for in-situ temperature control during polishing, and methods of using the same. More specifically, implementations of the present disclosure relate to in-situ temperature control with a condensed gas during a chemical-mechanical polishing (CMP) process. In one implementation, the method comprises polishing one or more substrates against a polishing surface in the presence of a polishing fluid during a polishing process to remove a portion of a material formed on the one or more substrates. A temperature of the polishing surface is monitored during the polishing process. Carbon dioxide snow is delivered to the polishing surface in response to the monitored temperature to maintain the temperature of the polishing surface at a target value during the polishing process.

Abstract: A wafer polishing apparatus capable of maintaining a drive ring in a flat state and a wafer polishing method are provided. In the wafer polishing apparatus and method according to an embodiment, when the head assembly moves to the initial descending position by the wafer elevation unit, the shape of the drive ring inside the head assembly may be measured by using the sensor, and thus the polishing process may be performed in the state where the descending position of the head assembly is automatically adjusted by using the head auxiliary elevation unit to maintain the drive ring in the flat state. Therefore, since the wafer polishing process is performed in the state the balance of the wafer mounting part is automatically adjusted by using the drive ring, the polishing quality of the wafer may be uniformly maintained, and also the polishing performance may be improved.

Abstract: The present invention provides an apparatus for resurfacing a rotating elastomer substrate. The apparatus utilizes a motorized grinding wheel, said motorized grinding wheel rotating in a direction counter to the rotating elastomer substrate and having an axis of rotation parallel to the axis of rotation of the rotating elastomer substrate, wherein the perpendicular distance between the motorized grinding wheel and the rotating elastomer substrate is adjustable so as to control the amount of elastomer substrate that is removed; and a mount for said motorized grinding wheel, wherein said mount is located proximal to the rotating elastomer substrate that comprises a part of a production line and wherein the mount is capable of traversing parallel to the rotating elastomer substrate.

Abstract: A segment for an abrasive article is disclosed. The segment can include a segment body that can have a first face that can extend along a length of the segment body on a first side of the segment body and a second face that can extend along the length of the segment body on a second side of the segment body opposite the first side. A gullet wall can extend from the first face to the second face. The gullet wall can extend along a gullet. The segment can also include a recessed region that can extend into one or both of the first and second faces. The recessed region can include a gullet portion extending at least partially along the gullet wall.

Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

Abstract: There is described a grinding wheel (1), particularly for grinding operations carried out on sheets of glass (2), ceramic material or similar materials, comprising a disc-shaped support with abrasive material arranged on the circumferential profile of the support, and an opposing central hole (3) for attachment to a drive shaft (4) of the grinding wheel. The disc-shaped support comprises a pair of opposed disc-shaped grinding wheel bodies (5, 6) coupled in a facing position so as to define together the abrasive grinding surface (5c, 6c) along the circumferential profile, and each of the disc-shaped bodies (5, 6) has a predetermined resilience such that the disc-shaped bodies (5, 6) can be flexed away from each other in the zone of contact with the component being ground, for the purpose of consequently applying pressure to the component in the grinding operation.

Abstract: A two part retaining ring is described. A rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion.

Abstract: Provided is a shot-blasting apparatus which is capable of efficiently perform dust collection and ventilation of an inside of a projection chamber, even using a dust collector having a small-size and low-cost suction device.

Abstract: The purpose of the present invention is to provide a shot processing device and a projector such that the projection amount of a projection material can be minimized.

Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

Abstract: A polishing apparatus capable of enabling a user to know a frequency and a trend of a retry operation of retrying a substrate release operation is disclosed. The polishing apparatus includes: a substrate holder configured to press a substrate against a polishing pad; a fluid ejection system configured to eject a fluid into a gap between the substrate and a flexible membrane for releasing the substrate from a substrate holding surface; an operation controller configured to instruct the fluid ejection system to perform a retry operation of ejecting the fluid again in a case where the release of the wafer has failed; and a monitoring device configured to store a historical information of the retry operation.

Abstract: Method of taping an optical lens member (10) to be manufactured. An optical lens member providing step (S1) is performed during which an optical lens member (10) is provided, the optical lens member has a first optical surface (11) associated with a first reference system and a second optical surface (12) to be manufactured, the first and second optical surfaces being connected by a external periphery surface (14), the first reference system being identified by at least one referencing element (111) on the first optical surface and/or the external periphery surface of the optical lens member, a taping step (S2) during which an adhesive tape (17) is provided on the first surface of the lens member so as to cover at least part of the first surface and leaving the referencing element uncovered.

Abstract: The purpose of the present invention is to provide a shot peening apparatus for which size increase is limited by projecting a shot material evenly on a workpiece using a single projector. The present invention provides a shot peening apparatus equipped with a workpiece-conveying mechanism for conveying a workpiece and a projector for projecting a shot material at the workpiece. The workpiece-conveying mechanism is equipped with: a pair of rollers, which extend in the workpiece conveyance direction, on which the workpieces are loaded, and which are rotated centered on the longitudinal axis line; an endless chain; and conveyance members for pressing and conveying workpieces in the conveyance direction.

Abstract: Control valves for waterjet systems, control-valve actuators, waterjet systems, methods for operating waterjet systems, and associated devices, systems, and methods are disclosed. A control valve configured in accordance with a particular embodiment includes a first seat having a tapered inner surface, a second seat having a contact surface, and an elongated pin having a shaft portion and an end portion. The pin is movable relative to the first and second seats between a shutoff position and one or more throttling positions. When the pin is at the shutoff position, the end portion of the pin is in contact with the contact surface. When the pin is at the throttling position, the end portion of the pin is spaced apart from the contact surface and the tapered inner surface and the shaft portion of the pin at least partially define a throttling gap.

Abstract: A masonry veneer machine is disclosed having adjustable fingers for applying the proper amount of pressure to the brick against a guide. The adjustable fingers are disposed on the lateral side of the saw blade, whereas, the guide is disposed on an arbor side of the saw blade. This provides for quick adjustments to the fingers and guide when changing over from cutting bricks of a first size to bricks of a second size which are significantly different from each other.