Abstract: A hexagonal single crystal wafer is produced from a hexagonal single crystal ingot. The wafer producing method includes a separation start point forming step of setting the focal point of a laser beam to the inside of the ingot at a predetermined depth from the upper surface of the ingot, which depth corresponds to the thickness of the wafer to be produced, and next applying the laser beam to the upper surface of the ingot while relatively moving the focal point and the ingot to thereby form a modified layer parallel to the upper surface of the ingot and cracks extending from the modified layer, thus forming a separation start point. A plate-shaped member having a thickness corresponding to the thickness of the wafer is separated from the ingot at the separation start point after performing the separation start point forming step, thus producing the wafer from the ingot.

Abstract: A method and system for performing work from a suspension work platform incorporating a work tool attached to an articulating arm system.

Abstract: A waterjet cutting head assembly is provided which includes an orifice unit to generate a high-pressure waterjet, a nozzle body and a nozzle component coupled to the nozzle body with the orifice unit positioned therebetween. The nozzle component may include a waterjet passage, at least one jet alteration passage and at least one environment control passage. The jet alteration passage may intersect with the waterjet passage to enable selective alteration of the waterjet during operation via the introduction of a secondary fluid or application of a vacuum. The environment control passage may include one or more downstream portions aligned relative to the fluid jet passage so that gas passed through the environment control passage during operation is directed to impinge on an exposed surface of a workpiece at or adjacent to a location where the waterjet is cutting the workpiece. Other high-pressure waterjet cutting systems, components and related methods are also provided.

Abstract: The present invention includes methods and apparatus for controlling the abrasion of a tire surface. Particular embodiments provide an abrading tool for abrading a surface of a tire, the tool comprising means for rotating an abrading wheel, an abrading wheel rotatably attached to the means for rotating, and a depth guide secured to the means for rotating, wherein the depth guide includes a pair of freely rotatable, spaced apart guide wheels. Further embodiments include a depth guide configured for use with an abrading tool which includes a abrading wheel and a means for rotating the abrading wheel, the depth guide comprising a mounting member securable to the means for rotating and a pair of freely rotatable, spaced apart guide wheels rotatably attached to the mounting member. Particular embodiments further include a method for preparing a portion of a tire for repair.

Abstract: In a wafer processing method by which, by using, as a reference surface, a flat surface obtained by applying a curable material to the whole of one surface of a wafer obtained by slicing a semiconductor single-crystal ingot by using a wire saw apparatus, surface grinding is performed on the other surface of the wafer and surface grinding is performed on the one surface of the wafer by using the other surface of the wafer subjected to surface grinding as a reference surface, both surfaces of the wafer are planarized at the same time immediately after the wafer is obtained by slicing.

Abstract: An amount of warp of a wafer is not only reduced, but the amount of warp of the wafer is also accurately controlled to a desired amount. The present invention relates to a method for slicing a semiconductor single crystal ingot, by which a cylindrical semiconductor single crystal ingot is bonded to and held by a holder in a state where the ingot is rotated at a predetermined rotation angle around a crystal axis of the ingot different from a center axis of a cylinder of this ingot and the ingot is sliced by a cutting apparatus in this state. The predetermined rotation angle at the time of bonding and holding the ingot with the use of the holder in such a manner that an amount of warp of a wafer sliced out by the cutting apparatus becomes a predetermined amount.

Abstract: A sander is provided and includes a housing, a power supply, a motor, a switch, and a switch actuation mechanism. The housing extends from a proximal end to a distal end and includes a first convex upper surface having a surface area A1. The power supply is coupled to the distal end of the housing. The motor is disposed within the housing and is powered by the power supply to drive an output member. The switch is in electrical communication with the power supply and is operable to selectively power the motor. The switch actuation mechanism is pivotably coupled to the proximal end of the housing and operable to actuate the switch. The switch actuation mechanism includes a second convex upper surface having a surface area A2.

Abstract: A processing apparatus includes a rotary table that causes a workpiece to rotate around a rotary axis, a roller-shaped member that rotates on an axis orthogonal to the rotary axis of the rotary table, a vertical driving section that is driven in a direction of the rotary axis of the rotary table so as to bring the roller-shaped member and the workpiece into contact with each other, an ultraviolet ray irradiation source that irradiates a portion between the roller-shaped member and the workpiece with an ultraviolet ray, a polishing material that is supplied to the portion between the roller-shaped member and the workpiece, and a light scattering medium that is supplied to the portion between the roller-shaped member and the workpiece and scatters an ultraviolet ray from the ultraviolet ray irradiation source.

Abstract: A double-disc straight groove cylindrical-component surface grinding disc, includes a first grinding disc and a second grinding disc, rotating relative to each other; the the first grinding disc's working face is planar; the second grinding disc's surface, opposite the first grinding disc, includes a set of radial straight grooves, with groove faces of the straight grooves are the working face of the second grinding disc; the cross-sectional outline of the working face of the second grinding disc is arcuate or V-shaped or is a V-shape having an arc; during grinding, a workpiece spins inside the straight grooves, while under the effect of an advancing apparatus, the workpiece slides in translational motion along the straight grooves. The described grinding disc device has high-volume production capabilities, and the shape accuracy and size consistency of the cylindrical roller's cylindrical surface and the efficiency in machining are improved, and machining cost is reduced.

Abstract: A double-disc straight groove cylindrical-component surface grinding disc, includes a first grinding disc and a second grinding disc, rotating relative to each other; the the first grinding disc's working face is planar; the second grinding disc's surface, opposite the first grinding disc, includes a set of radial straight grooves, with groove faces of the straight grooves are the working face of the second grinding disc; the cross-sectional outline of the working face of the second grinding disc is arcuate or V-shaped or is a V-shape having an arc; during grinding, a workpiece spins inside the straight grooves, while under the effect of an advancing apparatus, the workpiece slides in translational motion along the straight grooves. The described grinding disc device has high-volume production capabilities, and the shape accuracy and size consistency of the cylindrical roller's cylindrical surface and the efficiency in machining are improved, and machining cost is reduced.

Abstract: A multi-rod hand-held sharpener. In some embodiments, the sharpener has a handle with opposing first and second ends, an outer grip surface, and a guide surface adjacent the first end extending at a selected angle with respect to a central axis. A first abrasive rod is adapted to extend from the first end of the handle in a selected direction parallel to the central axis and having a first outer abrasive surface with a first abrasiveness level, the first outer abrasive surface extending at a first non-orthogonal angle with respect to the guide surface. A second abrasive rod is adapted to extend from the first end of the handle in the selected direction and having a second outer abrasive surface with a different, second abrasiveness level. The second outer abrasive surface extends at a different, second non-orthogonal angle with respect to the guide surface.

Abstract: A method and apparatus for deburring a metallic surface is disclosed. The method and apparatus utilizes a handheld orbital sander that is compact so that machine marks disposed in tight places can be reached. Additionally, a conformable sanding pad is utilized to allow the sanding pad to conform to the unique contours of the metallic surface to eliminate the machining marks.

Abstract: A multi-stage hand-held sharpener. In some embodiments, the sharpener has a handle adapted to be gripped by a hand of a user, the handle extending along a longitudinal axis between opposing first and second ends. A primary sharpening stage is provided in the handle between the first and second ends, the primary sharpening stage having a first abrasive surface extending at a first angle to facilitate a primary sharpening operation by a user upon the tool. An abrasive rod extends from the first end of the handle in a direction parallel to the longitudinal axis. The handle includes a substantially flat guide surface linearly extending from the first end toward the abrasive rod at a second angle, the abrasive rod and the guide surface forming a second sharpening stage adapted to facilitate a secondary sharpening operation by the user upon the tool.

Abstract: The disclosure relates to a tool for honing a tubular component of a wellsite. The honing tool includes a base operatively connectable to a wellsite component, a honing head supported by the base, honing stones supported about the honing head, and a driver. The honing stones are engageable with an outer surface of the tubular component. The driver rotationally drives the honing head whereby the honing stones hone an outer periphery of the tubular component.

Abstract: A polishing method which can remove foreign matters from an entire back surface of a substrate at a high removal rate is provided. The polishing method includes placing a polishing tool in sliding contact with an outer circumferential region of a back surface of a substrate while holding a center-side region of the back surface of the substrate, and placing a polishing tool in sliding contact with the center-side region of the back surface of the substrate while holding a bevel portion of the substrate to polish the back surface in its entirety.

Abstract: A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.

Abstract: An orifice for a high-pressure waterjet cutter includes a first surface defining an inlet plane, a second surface defining an outlet plane, and an inner bore aligned along a flow axis and extending from the first surface to the second surface. The orifice also includes a first layer of polycrystalline diamond extending from the first surface to a plane between the inlet plane and the outlet plane, and a second, separate layer of polycrystalline diamond extending from the plane to the second surface. The first layer and the second layer are coupled to one another to define a single component. The second layer has material properties different than the first layer.

Abstract: Technique to provide an abrasive regeneration method which, from a used abrasive, can recover an abrasive by an efficient method and can thereafter obtain a high-purity regenerated abrasive by a simple method. This abrasive regeneration method uses an abrasive comprising at least one type of abrasive selected from diamond, boron nitride, silicon carbide, alumina, alumina zirconia, zirconium oxide and cerium oxide. The abrasive regeneration involves a slurry recovery step (A) for recovering an abrasive slurry discharged from a polishing machine, a separation and concentration step (B) for adding an alkaline earth metal salt as an inorganic salt to the recovered abrasive slurry to aggregate the abrasive, and separating and concentrating the abrasive from a mother liquor, an abrasive recovery step (C) for recovering the separated and concentrated abrasive, and a second concentration step (D) for filter-treating the concentrated abrasive.

Abstract: A method for distributing a coolant to a grinding site of a grinding wheel, including rotating the grinding wheel, injecting the coolant in an inlet of the grinding wheel disposed proximate to an axis of rotation of the grinding wheel, moving the coolant fluid from the inlet along a plurality of internal grooves of the grinding wheel outwardly towards a plurality of outlets, and expelling the coolant outwardly from the plurality of outlets at an angle of at most 15 degrees with respect to a tangent to a circumference of the grinding wheel at the outlet.

Abstract: A device for cutting a block of stone that includes a support bar including a monolithic metallic plate, and a number of fluid ports attached to the plate. The device also includes a wear bar that is secured to the monolithic metallic plate and a lower longitudinal slot, and a cutting belt positioned in the lower longitudinal slot of the wear bar and including a downward-facing cutting surface to cut the block of stone. A method of cutting the stone block is also disclosed.