Abstract: A wheel end high-temperature warning system for a vehicle having a wheel-end assembly mounted to an axle is described. The system may include a first temperature sensor including a sensor head configured for mounting within a spindle section of the wheel end assembly, the sensor head in a heat exchange relationship with a bearings of the wheel-end assembly. The system may further include a transmitter disposed on the axle to which the wheel-end assembly is mounted, the transmitter being configured to receive a first sensor signal from the first temperature sensor indicative of a wheel-end temperature and transmit the signal to a receiver. A vehicle data acquisition module may be coupled to the receiver, the data acquisition system being programmed to receive the first sensor signal and process the signal to determine a measured temperature of the spindle.

Abstract: A concrete formulation system for repairing a cultural relic building and a use method thereof. The method includes obtaining a first index value, a second index value, and a third index value of a cultural relic building concrete sample and comparing the index values in a database of the concrete formulation system to obtain raw material components and contents of an original preparation formula of cultural relic concrete. The method further includes preparing a repairing concrete sample, measuring the index values, of the repairing concrete sample and comparing the index values of the cultural relic building concrete sample, and if the result is that the difference between the first index values is not greater than 20%, the difference between the second index values is not greater than 60%, and the difference between the third index values is not greater than 60%, using the repairing concrete sample for cultural relic repair.

Abstract: A device for testing service life in a simulated environment is disclosed, including: a testing box body, a plug testing device, a test control system, and a temperature control assembly. The plug testing device includes an upper clamp assembly and a lower clamp assembly for clamping a to-be-tested piece. The test control system includes a control module, a data acquisition module connected with the plug testing device and the temperature control assembly to acquire data, and a display panel for inputting a control instruction and displaying data. The control module can control the plug testing device to perform a reciprocating plug action at a preset temperature according to the control instruction.

Abstract: An angle measurement device is provided positioning electronic components on a cylindrical workpiece. The device includes upper and lower housings which are pivotally coupled together, and spaced apart magnetic elements mounted to an upper surface of the upper housing, and a biasing member coupled to the housings. The biasing member is configured to bias the housings into a closed position.

Abstract: According to the present invention there is provided a first particle sensor, a second particle sensor and a device for characterisation of one or more particles in a fluid sample comprising a first particle sensor and/or at least one second particle sensor. A method for characterising one or more particles in a fluid sample is also disclosed.

Abstract: A correction method for a microseism interpretation fracturing fracture parameter result. The method includes classifying the communication modes of a block sampling fractured wells to be corrected according to the matching degree of micro seismic monitoring result and sand adding amount; correcting the volume coefficient of each said classified fractured well single well, and the volume correction coefficient Bv of each said fractured well is: B v = [ L 5 / 4 ? H ] T [ L 5 / 4 ? H ] W , wherein, [L5/4H]W is a calculation value of a micro seismic monitoring interpretation result; [L5/4H]T is a theoretical calculation value obtained by using field construction parameters; C, calculating the classification volume correction coefficient of each class of fractured wells according to the calculated single well volume correction coefficient of each said fractured well.

Abstract: The degree of freedom of an abnormality detection target location in a solid-state imaging device in which a plurality of substrates are joined is improved. A semiconductor device includes a connection line and a detection circuit. A plurality of semiconductor substrates are joined in the semiconductor device. Then, in the semiconductor device, the connection line is wired across the plurality of semiconductor substrates. The detection circuit detects the presence or absence of an abnormality in a joint surface of the plurality of semiconductor substrates based on an energization state of the connection line when enable has been set by a predetermined control signal.

Abstract: A system includes a circuit configured to detect a voltage corresponding to an electrical measurement of a nanopore. The system also includes a component configured to compare the voltage to another voltage. Based at least in part on the comparison, a one bit indicator is determined. The one bit indicator indicates whether the voltage indicates a change in a state of the nanopore. In the event it is determined that the voltage indicates the change in the state of the nanopore, a multiple bit signal is provided for output.

Abstract: An integrated circuit (IC) includes: a first functional analog pin or pad; a first analog test bus coupled to the first functional analog pin or pad; first and second analog circuits coupled to the first analog test bus; and a test controller configured to: when the IC is in a functional operating mode, connect an input or output of the first analog circuit to the first analog test bus so that the input or output of the first analog circuit is accessible by the first functional analog pin or pad, and keep disconnected an input or output of the second analog circuit from the first analog test bus, and when the IC is in a test mode, selectively connect the input or output of the first and second analog circuits to the first analog test bus to test the first and second analog circuits using the first analog test bus.

Abstract: A system may include a resistive-inductive-capacitive sensor, a measurement circuit communicatively coupled to the resistive-inductive-capacitive sensor, and a filter communicatively coupled to the measurement circuit. The measurement circuit may be configured to measure phase information associated with the resistive-inductive-capacitive sensor and based on the phase information, determine a displacement of a mechanical member relative to the resistive-inductive-capacitive sensor. The filter may be configured to isolate changes to the displacement which are significantly slower than an expected change to the displacement in response to a human interaction with the mechanical member.

Abstract: The present disclosure discloses a display panel. The display panel includes a lighting test unit. The lighting test unit includes: signal input terminal sets, each including signal input terminals; shorting bar sets, each including shorting bars; and data signal line sets, each including data signal lines, where the signal input terminals are electrically connected to the shorting bars, the data signal lines are electrically connected to the shorting bars, and each shorting bar is connected end to end.

Abstract: A device that provides high impedance contact pads for an electrostatic charge sensor. The contact pads are shared between the electrostatic charge sensor and drivers. The contact pads are set to a high impedance state by reducing current leakage through the drivers. Compared to electrostatic charge sensor with low impedance contact pads, the electrostatic charge sensor disclosed herein has high sensitivity, and is able to detect weak electrostatic fields.

Abstract: A system for distinguishing target metal objects from each other in close proximity to each other. The method includes transmitting a first sinusoid signal via a first transmit coil to a first receive coil in close proximity to the first transmit coil; transmitting a second sinusoidal signal at a second frequency and amplitude different from the first frequency and amplitude to a second receive coil arranged in close proximity to the second transmit coil and in close proximity to the first receive coil such that received signals in the first and second receive coils include first and second frequency signals from the other of the first and second transmit coils. The received signals are separated via frequency domain multiplexing. The signals are compared to detect a presence of the target having a signal magnitude different from the first received signal and the received second signal and a known reference point.

Abstract: An electronic device inspection apparatus of the present application comprises an inspection table for positioning and holding an electrode disposed on a semiconductor device, a contact element that is formed of a shape memory alloy in a long and thin plate shape and has a base part fixed to the inspection table and a variable part formed in a shape of a spiral at a first temperature and being developed from the spiral at a second temperature; and a measurement circuitry for measuring the semiconductor device by conducting a current to flow into the electrode via the contact element. The axis of the spiral of the variable part is parallel to the electrode face of the positioned electrode and a contact region is formed along a longitudinal direction between the variable part and the positioned electrode at the second temperature.

Abstract: An in-situ shear test device for holes in rock-soil mass include an axial loading system, a cutting power system, a rotation system, an upper cutterhead control system, a shear test system, and a lower cutterhead control system, which belongs to the field of geotechnical engineering and geological engineering technology. The device can accurately obtain the in-situ shear strength parameters in the hole of rock and soil, improve the engineering design level, and ensure the safety and stability of the project. The device adopts an in-situ shear test device in the hole of rock and soil mass with the above structure, which can solve the problems of difficulty in in-situ shear test for the holes in deep rock-soil mass, lack of test device, difficulty in radial test, difficulty in loading while shearing, and difficulty in multi-point in-situ test.

Abstract: A microfluidic patch for separating specific species in biological fluids, comprising a flow layer comprising: a first porous portion to receive and carry a starting biological fluid containing related species; a multilayer membrane downstream the first porous portion and comprising a plurality of graphene-based sheets spaced among each other to define a plurality of parallel channels transversally interconnected and chemically functionalized to provide from the starting biological fluid an outgoing flow of specific species to be detected; and a second porous portion placed downstream the multilayer membrane to receive and carry the outgoing flow to be detected; the patch comprises a first upstream electrode and a first downstream electrode placed respectively upstream and downstream the multilayer membrane to foster the flow through the multilayer membrane from the first to the second porous portion.

Abstract: A test device for testing an object under test is provided. The test device includes a plurality of probe assemblies, a lower substrate, an upper substrate, a plurality of spacers, and a plurality of shielding structures. The lower substrate is used for being coupled to first contact ends of the plurality of probe assemblies. The upper substrate has a plurality of through holes. Second contact ends of the plurality of probe assemblies protrude from the upper substrate through these through holes, so as to be electrically connected to the object under test. The plurality of shielding structures is disposed between the lower substrate and the upper substrate. The plurality of shielding structures is resilient. The upper substrate, the lower substrate and the shielding structure define a plurality of accommodating regions, and each accommodating region is used for accommodating at least one of the probe assemblies.

Abstract: A batteryless, chipless, sensor is disclosed which includes a substrate, at least two conductive strips disposed on the substrate, a passivation layer encasing the substrate and the at least two conductive strips, wherein the conductive strips are adapted to respond to an interrogation signal from a reader having a first polarization, with a response signal at a second polarization different than the first polarization.

Abstract: A semiconductor failure analysis device includes an analysis part that analyzes a failure place in a semiconductor device; a marking part that irradiates the semiconductor device with laser light; a device arrangement part in which a wafer chuck, which holds the semiconductor device and on which an alignment target is provided, moves relative to the analysis part and the marking part; and a control part that outputs commands. The control part moves the wafer chuck to a position at which the analysis part is capable of taking an image of the alignment target, then outputs an alignment command that causes the marking part to be aligned with the analysis part with the alignment target as a reference, and irradiates the semiconductor device with laser light in a state in which a positional relationship between the marking part and the analysis part is maintained.

Abstract: The present disclosure provides a crack detection unit (CDU), a semiconductor die, and a method of detecting a crack of a semiconductor die. The CDU comprises a switching circuit, a crack sensor, and a logic circuit. The switching circuit is configured to enable the crack sensor. The crack sensor is configured to be electrically connected to the switching circuit, the ground, and an operating voltage. The logic circuit is configured to be electrically connected to the switching circuit and the crack sensor, wherein the CDU is enabled based on an input of the logic circuit. The output of the logic circuit indicates whether the crack sensor contains a crack.