Abstract: Techniques for depowdering in additive fabrication are provided. According to some aspects, techniques are provided that separate powder from additively fabricated parts through liquid immersion of the parts. Motion of the liquid, such as liquid currents, may dislodge or otherwise move powder away from additively fabricated parts to which it is adhered or otherwise proximate to. The liquid may also provide a vehicle to carry away powder from the additively fabricated parts. Removed powder may be filtered or otherwise separated from the liquid to allow recirculation of the liquid to the parts and/or to enable re-use of the powder in subsequent additive fabrication processes. Techniques for depowdering through liquid immersion may be automated, thereby mitigating challenges associated with manual depowdering operations.

Abstract: A method of cleaning a surface includes steps of: urging brushes of a cleaning device against the surface; providing solvent to the surface via a solvent supply that passes through a housing of the cleaning device; rotating a drive gear about a drive-gear rotational axis to drive driven gears about corresponding driven-gear rotational axes inside the housing to rotate the brushes; and evacuating material from the surface via a vacuum tube, passing through the housing.

Abstract: A shoe sole cleaning device is disclosed. The shoe sole cleaning device comprises a housing; a shoe receiving arrangement provided on the housing to receive one or more shoes therein; and a cleaning mechanism comprising a plurality of water jets arranged in the shoe receiving arrangement. The plurality of water jets are adapted to provide water sprays towards bottom of soles of the one or more shoes received in the shoe receiving arrangement for cleaning thereof.

Abstract: The use of an organic compound as cleavable additive, preferably as cleavable surfactant, in the modification and/or treatment of at least one surface of a semiconductor substrate is described. Moreover, it is described a method of making a semiconductor substrate, comprising contacting at least one surface thereof with an organic compound, or with a composition comprising it, to treat or modify said surface, cleaving said organic compound into a set of fragments and removing said set of fragments from the contacted surface. More in particular, a method of cleaning or rinsing a semiconductor substrate or an intermediate semiconductor substrate is described. In addition, a compound is described which is suitable for the uses and methods pointed out above and which preferably is a cleavable surfactant.

Abstract: A method of treating an apparatus to remove surface deposits therefrom is performed by selecting a colloidal particle dispersion having inorganic nanoparticles with an average particle size of from 500 nm or less that exhibit properties of Brownian motion that facilitate penetration of solid deposits on surfaces of an apparatus that is subject to surface deposits from contact with fluids. The surfaces of the apparatus are contacted with a treatment composition comprising the colloidal particle dispersion. The composition is allowed to act upon the materials adhering to the surfaces of the apparatus to loosen and breakup the materials adhering to the surfaces of the apparatus. The loosened and broken materials are removed from the surfaces of the apparatus.

Abstract: A method for improving a corrosion protection of a hollow shaft may include introducing a lance into the hollow shaft, and cleaning and expelling a liquid from an inside of the hollow shaft via spraying a gas from the lance. The method may also include applying a corrosion protection medium onto an inner lateral surface of the hollow shaft at least in certain regions, and closing off the hollow shaft.

Abstract: A cleaning system for cleaning a circular panel or any other circular surface is provided. The system has a base mechanically fastened to the circular panel. An axis stub pivotally connected to the base and attached to a pivot member provides rotation for a blade set. The blade set includes a first blade and a second blade configured to rotate independently about the pivot member in either a clockwise or a counter clockwise direction, wherein the second blade is configured to sit above the first bade, each blade having at least one row of sprinkler holes positioned on each side of the blade running lengthwise. The at least one row of sprinkler holes are configured to eject a fluid to either clean, cool, or thaw the circular panel. The first blade includes a roller having cleaning implements configured to clean the circular panel as the first blade rotates about the pivot member.

Abstract: Various embodiments include methods and chemistries to etch metal-oxide films. In one embodiment, a method of etching tin oxide (SnO2) films includes using thionyl chloride (SOCl2) chemistry to produce an etch rate of the SnO2 films of up to 10-times higher as compared with Cl2 chemistry for similar flow-rates and process conditions, and gettering oxygen species from the SnO2 films by using the SOCl2, thereby forming volatile SO2 and volatile SnCl4 to provide human safety and machine safety and operations. Other methods, chemistries, and techniques are disclosed.

Abstract: A method of cleaning a jet pump assembly of a nuclear reactor may comprise evacuating an interior of the jet pump assembly that is filled with a first liquid by injecting a gas to purge the first liquid from the interior to provide an evacuated surface. In addition, the method may comprise directing a jet of a second liquid onto the evacuated surface.

Abstract: A washing device and system is herein disclosed. The washing device includes a washing tub, a shaking system, a plate bracket, a first plate, a second plate, and a controller. The shaking system is mounted at a lower end of the washing tub. The plate bracket is mounted on the shaking system. The first plate defines a first set of holes and is movably mounted to a first side of the plate bracket. The second plate defines a second set of holes and is movably mounted to a second side of the plate bracket. The controller is operable to selectively activate and control the shaking system. In use, the first plate and the second plate support a smoking device therebetween, with cleaning fluid being agitated via the shaking system to clean the smoking device.

Abstract: A high flow differential cleaning system uses a source of pressurized compressed dry gas to pressurize a holding tank. A component to be cleaned is securely loaded and oriented against a blast plate designed specifically for the desired pressure, flow, and volume. A fast-actuated valve system opens to direct high volumes of pressurized gas from a holding tank through and around the component(s) held within the cleaning chamber for the removal of remnant powder and foreign particles from interior cavities as well as exterior component surfaces.

Abstract: A method of cleaning a complex powder transfer system including providing a powder transfer system having a washing fluid source, a spray device valve in fluid communication with the washing fluid source, a backflush valve in fluid communication with the washing fluid source, a receiving device having an upper chamber, a lower chamber, and a membrane filter disposed between the upper and lower chambers. The method includes opening the backflush valve to initiate a backflush cycle, running the backflush cycle to wash the upper chamber with a fluid, and closing the backflush valve after the backflush cycle completes. The method includes opening the spray device valve to initiate a spray device cycle, running the spray device cycle to wash the lower chamber with fluid, and closing the spray device valve after the spray device cycle completes. The method includes opening a pressure valve to provide PCA to the receiving container.

Abstract: A wafer cleaning apparatus includes a polishing unit used in chemical mechanical polishing (CMP) of a wafer and a cleaning dispensing unit arranged to direct cleaning fluids toward a far edge of the wafer after the CMP of the wafer. A wafer cleaning method includes CMP of a wafer by a polishing unit and directing cleaning fluids toward a far edge of the wafer after the CMP of the wafer by a cleaning dispensing unit. Another method can include CMP, applying deionized water, and applying pH adjuster having a pH range from about 2 to about 13.

Abstract: A method and an apparatus for cleaning a channel, especially a transmission and/or cooling channel, in any type of device, machine, installation, and/or tool, particularly in any type of heat exchanger and/or a molding core, cavity and/or insert is proposed, wherein a channel is cleaned through dynamic, bi-directional pulsation of cleaning medium inside the to-be-cleaned channel, the method being realized by a cleaning apparatus equipped with a diaphragm pump module, plugged either only in the feed side of the transmission line or in the feed side and in the return side, which, after connecting the diaphragm pump module to the external energy source and shutting off the flow control system from the reservoir and the feed pump, allows for putting cleaning medium into a state of two-way dynamic pulsating motion.

Abstract: Apparatuses, systems, and methods are disclosed for a cleaning/drying system. An apparatus includes an elongate member that includes a first portion extending linearly along a first axis from a proximal end to a distal end, a second portion extending linearly along a second axis from a proximal end to a distal end, and a joint member configured to couple the proximal end of the first portion and the proximal end of the second portion to one another. The joint member is configured to angle the second portion relative to the first portion such that the first and second axes intersect. The apparatus includes a towel that is selectively coupled to the second portion. The towel is configured for absorbing liquids from a surface in response to the towel being moved across the surface using the elongate member.

Abstract: A method for cleaning a breathing apparatus comprising a respiratory mask, by such precleaning activity as: providing the breathing apparatus in an externally contaminated state, providing a holder for the respiratory mask having at least one curved sealing face and stretching the respiratory mask onto the holder such that a sealing lip of the respiratory mask lies on the curved sealing face and closes off an interior of the respiratory mask, and the holder with the respiratory mask may be introduced into a precleaning chamber, exposing an outer side of the respiratory mask in the precleaning chamber to at least one precleaning fluid. And, after the precleaning, the respiratory mask may be released from the holder, introducing the respiratory mask into a primary cleaning chamber and exposing the respiratory mask, including an inner side of the respiratory mask that faces the interior, to a primary cleaning fluid.

Abstract: The present invention provides cleaning solutions for removing ink, coating, varnish, adhesive, etc. residue from printing equipment. The cleaning solutions of the present invention comprise one or more solvents, preferably selected from acetoacetates, alcohols, glycol ethers, glycol esters, terpenes, and water, and are preferably free of surfactants. The cleaning solutions of the invention have a relative evaporation time (RET) of less than 60 seconds, and a ratio of the RET to the radius of the sphere of solubility of the resin in the ink to be removed of less than 6.

Abstract: A substrate cleaning device that includes a rotation holder and a cleaner. The rotation holder includes a rotator provided to be rotatable about a rotation axis, and a holder provided at the rotator to be capable of holding a substrate. The cleaner includes a cleaning tool provided to be capable of removing foreign matter on a back surface of the substrate by polishing, a mover that moves the cleaning tool while pressing the cleaning tool against the back surface of the substrate held by the holder, and a cleaning brush that further cleans the back surface of the substrate, which has been cleaned or is being cleaned by the cleaning tool.

Abstract: The present invention relates to a wiping mop (10) with a housing (20), wherein an anchoring mechanism (11) for a handle (12) for guiding the wiping mop (10) is attached to the upper side of the housing. A wiping band (30) which is closed in itself is guided partially around and partially through the housing (20). On entry into the housing (20) the wiping band (30) runs through a mechanical dirt separator as well as a first (80) and a second (70) tank to be filled with wiping liquids in each case, whereby the wiping band (30) is cleaned of dirt particles taken up during use and is moistened for further wiping. Before leaving the second tank (80) the wiping band (30) is wrung out by cheeks of an outlet slot which are displaceable manually relative to one another.

Abstract: A pig cleaning and transportation system is disclosed. Exemplary implementations include a platform with a plurality of apertures; a plurality of securing mechanisms, each mechanism within each aperture and configured to hold a pig and allow it to rotate around its longitudinal axis; a base underneath the platform; and a cleaning element connected to the base and positioned on each longitudinal side of the platform in pressure contact with the pigs on the plurality of securing mechanisms, each cleaning element including at least one cleaning material surface.