Patents Examined by Erica S Lin
  • Patent number: 12208624
    Abstract: There is provided a tank including: a casing; a liquid chamber including first and second chambers; a communicating channel configured by first, second, and third communicating channels; a liquid inlet port; a first communicating port; a second communicating port; an atmosphere open port; a liquid outflow port; and a gas-liquid separating membrane provided in the third communicating channel and blocking flowing (distribution, circulation) of liquid in the third communicating channel. A first end of the second communicating channel is communicated with the second chamber, and a second end of the second communicating channel is communicated with an end of the first communicating channel. A first end of the third communicating channel is communicated with the second end of the second communicating channel, and a second end of the third communicating channel is communicated with the atmosphere open port.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: January 28, 2025
    Assignee: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: Masahiro Hayashi, Taichi Shirono, Masako Kawagoe, Yoshinori Osakabe
  • Patent number: 12196622
    Abstract: A temperature measurement device includes a first probe that measures a physical quantity related to a temperature of a substance on the basis of a first reference, a second probe that measures a physical quantity related to a temperature of the substance on the basis of a second reference different from the first reference, and a heat conductive member that covers the first probe and the second probe and transports heat from the substance.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: January 14, 2025
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventors: Daichi Matsunaga, Yujiro Tanaka, Michiko Seyama
  • Patent number: 12196623
    Abstract: One aspect relates to a high-temperature sensor, having a coated substrate. The substrate contains a zirconium oxide or a zirconium oxide ceramic, at least one resistance structure and at least two connection contacts. The connection contacts electrically contact the resistance structure. The substrate is coated with an insulation layer. The insulation layer contains a metal oxide layer, the resistance structure and the free regions of the insulation layer, on which no resistance structure is arranged, are coated at least in regions with a ceramic intermediate layer, and a protective layer and/or a cover is arranged on the ceramic intermediate layer. At least one opening is formed in the insulation layer, which exposes at least sections of a surface of the substrate.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: January 14, 2025
    Assignee: Yageo Nexensos GmbH
    Inventors: Matsvei Zinkevich, Tim Asmus, Stefan Dietmann
  • Patent number: 12188888
    Abstract: The present invention is in relation to a method and its apparatus, by means of which HCl generation formed from hydrolysis reactions or thermal decomposition of chloride salts is continuously monitored. Its application is in oil refining or in any other area where chloride salts are heated to temperatures high enough to cause hydrolysis reactions or thermal decomposition. The invention allows for a much more sophisticated and precise record of the thermal events that occur as a function of temperature. It also allows the behavior of chloride salts subjected to these conditions to be evaluated, both in model systems and in industrial saline solutions, with respect to the respective content, composition, or presence of components in the oil phase, such as carboxylic (naphthenic acids) or nitrogenous (ammonia or amines) acids.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: January 7, 2025
    Assignee: PETROLEO BRASILEIRO S.A.—PETROBRAS
    Inventors: Flavio Cortinas Albuquerque, Claudio Roberto Ribeiro Da Silva, Nathalie Sanghikian, Mauricio Souza De Alencar
  • Patent number: 12187036
    Abstract: A piezoelectric device includes a substrate on which a plurality of recesses are arranged in a first direction, a vibration plate, and a piezoelectric actuator having a first electrode, a second electrode and a third electrode, a fourth electrode, and a piezoelectric layer, in which a plurality of active portions are provided, the second electrode and the third electrode are provided from an edge of a region facing a recess to an outside of the recess, the first electrode is formed between the second electrode and the third electrode, and the fourth electrode configures a common electrode for the plurality of active portions.
    Type: Grant
    Filed: January 18, 2023
    Date of Patent: January 7, 2025
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Motoki Takabe
  • Patent number: 12179486
    Abstract: An actuator includes a deformable thin-film member having an opening, an electromechanical conversion element disposed at a periphery of the opening of the deformable thin-film member, an insulating film covering the electromechanical conversion element, a protective film over a surface of the insulating film, the protective film covering the surface of the insulating film and a surface of an electrode wiring connected to the electromechanical conversion element, and an adhesion improving film disposed between the electrode wiring and the protective film.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: December 31, 2024
    Assignee: RICOH COMPANY, LTD.
    Inventors: Takahiko Kuroda, Kaname Morita, Toshiaki Masuda, Arata Suzuki, Naoko Kitaoka
  • Patent number: 12172453
    Abstract: Apparatuses and methods for automatically applying and solidifying nail polish on nails of a user comprising operating one or more nail polish applying elements configured to crudely apply nail polish on one or more nail surfaces of one or more fingers identified in a treatment space based on analysis of sensory data captured by one or more imaging sensors configured to capture sensory data depicting the treatment space, operating one or more solidifying energy source(s) to solidify the nail polish applied on the nail surface(s) and operating one or more nail polish removal elements to accurately remove nail polish residues applied on skin of the finger(s) surrounding at least partially a boundary of the nail surface(s) while avoiding removing the nail polish applied within the boundary.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: December 24, 2024
    Assignee: Nailomatic Ltd.
    Inventors: Omri Moran, Avichay Mor Yosef, Ron Miller, Omer Dolev, Boris Khodos
  • Patent number: 12168733
    Abstract: An ink set includes a reaction liquid containing coagulant; a first ink containing a color material; and a second ink containing a color material. The ink set is used for recording on a non-absorptive recording medium or a low-absorptive recording medium and for imparting the reaction liquid, the first ink, and the second ink to the recording medium in a superimposed manner in this order.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: December 17, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Ippei Okuda, Tetsuya Aoyama
  • Patent number: 12151509
    Abstract: A wheel hub assembly includes a mounting base and a wheel hub supported for rotation on the mounting base by a plurality of bearings disposed within an annular space between the hub and base. A sealing system is provided that seals all points of intrusion into the space such that liquid contaminants are inhibited or precluded from entering the space and reaching the bearings when the assembly is subjected to an immersion/thermal shock test in which the assembly is heated to an elevated temperature and then immersed on a cold bath of the liquid contaminant. A method of testing the sealing integrity of wheel hub assemblies is also provided.
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: November 26, 2024
    Assignee: Federal-Mogul Motorparts LLC
    Inventors: Larry Sitzes, Richard W. Harvey
  • Patent number: 12138935
    Abstract: When a known lid member was merely applied to a bottle that contains ink, there was room for improvement in terms of the operation of the lid member and the way how to bring attention to the handling thereof. A bottle set is provided that includes: a bottle that includes an ink container that contains ink, and an outflow port through which the ink in the ink container flows out to the outside; and a lid member that is configured to attach to and detach from the bottle, and is configured to cover the outflow port in a state of being attached to the bottle. The lid member includes a colored portion that has optical transparency and is colored with a color corresponding to a type of the ink contained in the ink container in at least a portion of the lid member.
    Type: Grant
    Filed: May 19, 2023
    Date of Patent: November 12, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Takumi Nagashima, Hitoshi Igarashi, Ryoichi Tanaka, Tadahiro Mizutani, Tomoyuki Nakano
  • Patent number: 12131960
    Abstract: To provide a new temperature distribution evaluation method, a temperature distribution evaluation device, and a soaking range evaluation method, as the temperature distribution evaluation method which evaluates a temperature distribution of a heating area 40A provided in a heating device 40, the present invention is a temperature distribution evaluation method which, in the heating area 40A, heats a semiconductor substrate 10 and a transmitting and receiving body 20 for transporting a raw material to and from the semiconductor substrate 10, and evaluates a temperature distribution of the heating area 40A on the basis of a substrate thickness variation amount A of the semiconductor substrate 10. Accordingly, temperature distribution evaluation can be implemented for a high temperature area at 1600-2200° C. or the like at which it is hard to evaluate the temperature distribution due to the limit of a thermocouple material.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: October 29, 2024
    Assignees: KWANSEI GAKUIN EDUCATIONAL FOUNDATION, TOYOTA TSUSHO CORPORATION
    Inventors: Tadaaki Kaneko, Daichi Dojima, Koji Ashida, Tomoya Ihara
  • Patent number: 12123788
    Abstract: The present disclosure relates to the field of biometric parameter measurement, and in particular, to a temperature measurement circuit, a temperature measurement method, a temperature and light intensity measurement circuit, a temperature and light intensity measurement method, a chip, a module, and an electronic device. A temperature signal is obtained based on an output voltage of a differential amplifier circuit when a non-inverting input terminal of the differential amplifier circuit is unload, an output voltage of the differential amplifier circuit when the non-inverting input terminal of the differential amplifier circuit is connected to a calibration resistor, and the output voltage of the differential amplifier circuit when the non-inverting input terminal of the differential amplifier circuit is connected to a thermistor, which improves the accuracy of the temperature measurement.
    Type: Grant
    Filed: October 11, 2021
    Date of Patent: October 22, 2024
    Inventors: Chuanlin Li, Fulin Li, Haixiang Wang
  • Patent number: 12117351
    Abstract: A system includes a first printed circuit board (PCB), a temperature sensor, a switching circuit provided on the first PCB, and a controller. The temperature sensor is configured to measure temperature of at least an area of the first PCB. The controller is configured to trigger the switching circuit to turn off power to the first PCB, based at least in part on the temperature sensor detecting a temperature above a temperature threshold. The system is able to disrupt power much faster than conventional methods of power protection which may have a blind spot to certain areas of the first PCB, since these methods rely on power disruption when a maximum power is sensed.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: October 15, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Hsiao-Tsu Ni, Ying-Che Chang, Chao-Nan Lin
  • Patent number: 12117129
    Abstract: A method for checking the sealing of a sealed tank for storing a liquefied gas at low temperature, the tank having an inner hull and a secondary sealing membrane, a secondary space that is arranged between the inner hull and the secondary sealing membrane, a primary sealing membrane and a primary space that is arranged between the primary sealing membrane and the secondary sealing membrane is disclosed. The method has the following main steps: generating a pressure lower than the pressure of the primary space in the secondary space using a suction device, measuring the temperature of an outer surface of the inner hull, and detecting the location of a sealing defect of the secondary sealing membrane in the form of a cold spot on the outer surface of the inner hull.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: October 15, 2024
    Assignee: GAZTRANSPORT ET TECHNIGAZ
    Inventors: Maxime Champagnac, Pierre Jolivet, Mathieu Petitpas, Mael Bleomelen, Damien Brenac, Laurent Spittael, Vincent Briatte, Julien Glory
  • Patent number: 12111230
    Abstract: Improved inspection techniques are described herein for identifying leaks in a plugged honeycomb body. The improved inspection techniques utilize a pore impediment and a test gas. The pore impediment is injected into the plugged honeycomb body, and the test gas is forced into the plugged honeycomb body. A thermal detector is used to collect thermal data from an inspection region of an outlet end of the plugged honeycomb body, and the thermal data is used to identify defects in the plugged honeycomb body.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: October 8, 2024
    Assignee: Corning Incorporated
    Inventors: Joseph Henry Citriniti, Seungcheol Yang
  • Patent number: 12104937
    Abstract: An ultrasonic flowmeter includes: a flow path body having a flow path through which a fluid to be measured flows; a pair of ultrasonic transducers disposed in the flow path body; a substrate fixed to the flow path body; a sensor plate on which a temperature sensor for detecting a temperature of the fluid to be measured is disposed, the sensor plate being flat; and an arithmetic unit that calculates a flow rate of the fluid to be measured from a propagation time of ultrasonic waves between the pair of ultrasonic transducers and the temperature detected by the temperature sensor. The sensor plate is configured to project from the substrate and to project into a flow path cross-section of the flow path from a sensor hole provided in the flow path body at a time of fixing the substrate to the flow path body.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: October 1, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yuuji Nakabayashi, Masato Satou, Asako Miyoshi, Masataka Matsuda
  • Patent number: 12099026
    Abstract: A thermal conductivity estimation method includes: measuring temperature distribution of a measurement sample surface in a steady state by partially heating the measurement sample under predetermined heating conditions; calculating temperature distribution of a sample model surface by performing a heat-transfer simulation on the sample model of the same shape as the measurement sample for a plurality of combinations of provisional thermal conductivities and heating conditions; making a regression model, whose input is temperature distribution of the measurement sample surface and whose output is a thermal conductivity of the measurement sample, by a machine learning technique using training data in a form of a calculation result of the plurality of combinations and the temperature distribution obtained from the plurality of combinations; and estimating the thermal conductivity of the measurement sample by inputting a measurement result of the temperature distribution of the measurement sample surface into the
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: September 24, 2024
    Assignee: SUMCO CORPORATION
    Inventors: Ryusuke Yokoyama, Toshiyuki Fujiwara, Yusuke Higuchi, Toru Ujihara
  • Patent number: 12082505
    Abstract: In some embodiments, a piezoelectric device is provided. The piezoelectric device includes a semiconductor substrate. A first electrode is disposed over the semiconductor substrate. A piezoelectric structure is disposed on the first electrode. A second electrode is disposed on the piezoelectric structure. A heating element is disposed over the semiconductor substrate. The heating element is configured to heat the piezoelectric structure to a recovery temperature for a period of time, where heating the piezoelectric structure to the recovery temperature for the period of time improves a degraded electrical property of the piezoelectric device.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: September 3, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Alexander Kalnitsky, Chun-Ren Cheng, Chi-Yuan Shih, Kai-Fung Chang, Shih-Fen Huang, Yi-Chuan Teng, Yi Heng Tsai, You-Ru Lin, Yan-Jie Liao
  • Patent number: 12076990
    Abstract: A piezoelectric actuator includes a piezoelectric element substrate including a diaphragm, multiple piezoelectric elements each including: a first electrode on the diaphragm, a piezoelectric layer on the first electrode, and a second electrode on the piezoelectric layer, a metal wiring layer on the second electrode, the metal wiring layer including wiring patterns coupled to the multiple piezoelectric elements, and a subframe bonded to a bonding region of the piezoelectric element substrate via adhesive, wherein the subframe has a recess facing the wiring patterns in the bonding region.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: September 3, 2024
    Assignee: RICOH COMPANY, LTD.
    Inventor: Akira Shimofuku
  • Patent number: 12078551
    Abstract: The present disclosure provides embodiments of semiconductor devices. In one embodiment, the semiconductor device includes a dielectric layer and a fin-shaped structure disposed over the dielectric layer. The fin-shaped structure includes a first p-type doped region, a second p-type doped region, and a third p-type doped region, and a first n-type doped region, a second n-type doped region, and a third n-type doped region interleaving the first p-type doped region, the second p-type doped region, and the third p-type doped region. The first p-type doped region, the third p-type doped region and the third n-type doped region are electrically coupled to a first potential. The second p-type doped region, the first n-type doped region and the second n-type doped region are electrically coupled to a second potential different from the first potential.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: September 3, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Zi-Ang Su, Ming-Shuan Li, Shu-Hua Wu, Chih Chieh Yeh, Chih-Hung Wang, Wen-Hsing Hsieh