Patents Examined by Erin Saad
  • Patent number: 10196745
    Abstract: A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has a gold/tin solder preform attached to a sealing surface of the lid.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: February 5, 2019
    Assignee: General Electric Company
    Inventors: Christopher Kapusta, Marco Francesco Aimi
  • Patent number: 9884384
    Abstract: A solder dross recovery module has gears and a waste collection chamber positioned within a solder pot. The gears are configured to draw in solder dross from a surface of molten solder stored in the solder pot. The gears apply pressure to the solder dross so as to separate solder from the solder dross. The recovered solder is returned to the molten solder in the solder pot. A resulting waste material is collected in the waste collection chamber.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: February 6, 2018
    Assignee: Flextronics AP, LLC
    Inventors: Dason Cheung, Murad Kurwa
  • Patent number: 9873171
    Abstract: A method for holding a sintering filler material during a brazing/sintering operation for repairing a damaged area of a component wherein the component is in either a bonding face down position, bonding face vertical position or bonding face up position. The method includes providing a wire mesh and attaching the wire mesh to the component in a location corresponding to the damaged area. Further, the method includes forming a gap between the wire mesh and the component. Moreover, the sintering filler material may be inside the wire mesh or both inside and outside the wire mesh in order to secure the sintering filler material to the damaged area.
    Type: Grant
    Filed: November 11, 2016
    Date of Patent: January 23, 2018
    Assignee: Siemens Energy, Inc.
    Inventors: Hang Li, Mark A. Garcia, Somesh J. Ghunakikar, William J. Lowe
  • Patent number: 9875985
    Abstract: A method and apparatus for flip chip bonding using conductive and inductive heating to heat a plurality of solder bumps located between a chip carrier and a chip.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: January 23, 2018
    Assignee: International Business Machines Corporation
    Inventors: Jae-woong Nah, Sébastien S. Quesnel, Katsuyuki Sakuma
  • Patent number: 9865563
    Abstract: A wire tensioner has a wire passage through which a wire is inserted. The wire passage include: an inlet through which a compressed gas enters; a first outlet through which the compressed gas is discharged and is provided on an upper side of the inlet; a first flow contraction portion provided on the upper side of the inlet, and for contracting an area of the wire passage; a second flow contraction portion provided on a lower side of the inlet, and for contracting the area of the wire passage; a third flow contraction portion provided on a side of a bonding tool of the second flow contraction portion, and for making the flow of the compressed gas to the side of the bonding tool contracted; and a second outlet through which the compressed gas is discharged and is provided on the lower side of the second flow contraction portion.
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: January 9, 2018
    Assignee: SHINKAWA LTD.
    Inventor: Yoshitaka Takagi
  • Patent number: 9855623
    Abstract: A method for connecting a tubular cable lug produced from a non-ferrous metal to a strand produced from aluminum, includes steps of providing a tubular cable lug having a tubular portion and a connecting portion, providing an ultrasonic welding device having a sonotrode that has a pressure surface and having an anvil that has a mating pressure surface, securing the connecting portion to the anvil by clamping such that the tubular portion faces the mating pressure surface of the anvil, inserting one end of the strand into the tubular portion of the tubular cable lug, bringing the pressure surface into contact with the tubular portion, pressing the pressure surface against the tubular portion such that the tubular portion is forced against the mating pressure surface, and generating an ultrasound vibration oriented approximately perpendicular to a tube axis of the tubular portion by means of the sonotrode.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: January 2, 2018
    Assignee: TELSONIC HOLDING AG
    Inventor: Claus Regenberg
  • Patent number: 9859625
    Abstract: A method of forming a solder joint between a coaxial cable and a coaxial connector includes the steps of: positioning a solder element between an end of an outer conductor of the coaxial cable and a connector body of the connector; lowering the connector body onto a mounting structure; melting the solder element to form a solder joint between the outer conductor and the connector body, the solder joint including a lower surface formed by contact with the mounting structure; and applying suction to the melting solder element to reduce the formation of bubbles within the solder joint.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: January 2, 2018
    Assignee: CommScope Technologies LLC
    Inventor: Jeffery D. Paynter
  • Patent number: 9860995
    Abstract: A solder supply system that judges whether a solder cup is set on a solder supply device. In a case in which it is judged that the solder cup is set on the solder supply device, reading a barcode by a barcode reader is allowed. In contrast, in a case in which it is judged that the solder cup is not set on the solder supply device, reading a barcode by the barcode reader is restricted. That is, reading a barcode by the barcode reader before the solder cup is set inside an outer tube is restricted, while reading a barcode by the barcode reader is allowed when the solder container is set inside the outer tube.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: January 2, 2018
    Assignee: FUJI MACHINE MFG. CO., LTD.
    Inventors: Mitsuaki Kato, Yoji Fujita
  • Patent number: 9849535
    Abstract: Provided is a jet nozzle that varies a width of a flow of jetted molten solder. The jet nozzle contains a nozzle main body having a channel section at its part and a molten solder flow width varying member that varies a width of the upper opening end of the nozzle main body by a slide of the molten solder flow width varying member within the channel section of the nozzle main body to vary a width of the molten solder flow jetted from the upper opening end of the nozzle main body. The molten solder flow width varying member includes a molten solder flow width varying plate that varies the width of the molten solder flow, a rectangular rectifying piece that extends along a slide direction of the molten solder flow width varying member, and a sliding shaft that slides the rectifying piece.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: December 26, 2017
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Noboru Hashimoto, Takahiro Kasama
  • Patent number: 9853408
    Abstract: A solder pre-form for soldering a coaxial cable to a connector body is provided with a plurality of flux grooves on a cable side and a connector side. The solder pre-form may also have a plurality of holes between the cable and connector sides. In a method of use, flux is applied to the flux grooves and the solder pre-form applied to encircle the outer conductor which is then inserted into the connector body and the solder pre-form melted to complete the solder interconnection. Where holes are present, flux may be applied to the connector side, passing through the holes also to the cable side.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: December 26, 2017
    Assignee: CommScope Technologies LLC
    Inventor: Kendrick Van Swearingen
  • Patent number: 9844836
    Abstract: A continuous hot bonding method for producing a bi-material strip with a strong bond therebetween is provided. The method comprises sanding a first strip formed of steel; and applying a layer of first particles, typically formed of copper, to the sanded first strip. The method next includes heating the first strip and the layer of the first particles, followed by pressing a second strip formed of an aluminum alloy onto the heated layer of the first particles. The aluminum alloy of the second strip includes tin particles, and the heat causes the second particles to liquefy and dissolve into the melted first particles. The first particles and the second particles bond together to form bond enhancing metal particles, which typically comprise bronze.
    Type: Grant
    Filed: July 22, 2015
    Date of Patent: December 19, 2017
    Assignee: Federal-Mogul LLC
    Inventor: David Michael Saxton
  • Patent number: 9841609
    Abstract: An assembly method of a SMA assembly, includes disposing a lens holder unit on a SMA unit, the lens holder unit being provided with a first spring, a lens holder and a coil that are mounted on the first spring, with the first spring pressed against a mounting surface of the SMA unit; and bonding the first spring of the lens holder unit with the mounting surface of the SMA unit. The assembly process is simplified, the coating and soldering space become big to facilitate the bonding process, and the joining force between the SMA unit and the lens holder unit is enhanced.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: December 12, 2017
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventors: Sidney Shen Kuang Chou, Yiu Sing Ho, Kam Fung Yip, Jian Feng He
  • Patent number: 9827634
    Abstract: A method includes receiving, during a vibration welding process, a set of sensory signals from a collection of sensors positioned with respect to a work piece during formation of a weld on or within the work piece. The method also includes receiving control signals from a welding controller during the process, with the control signals causing the welding horn to vibrate at a calibrated frequency, and processing the received sensory and control signals using a host machine. Additionally, the method includes displaying a predicted weld quality status on a surface of the work piece using a status projector. The method may include identifying and display a quality status of a suspect weld. The laser projector may project a laser beam directly onto or immediately adjacent to the suspect welds, e.g., as a red, green, blue laser or a gas laser having a switched color filter.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: November 28, 2017
    Assignee: GM Global Technology Operations LLC
    Inventors: John Patrick Spicer, Jeffrey A. Abell, Michael Anthony Wincek, Debejyo Chakraborty, Jennifer Bracey, Hui Wang, Peter W. Tavora, Jeffrey S. Davis, Daniel C. Hutchinson, Ronald L. Reardon, Shawn Utz
  • Patent number: 9821396
    Abstract: The present disclosure provides a plow blade edge device for mounting to a moldboard of a plow comprising at least one adapter blade including a bottom edge having selectively carbide insert(s) along at least a portion of the bottom edge. The disclosure further provides for a method of brazing the carbide insert(s) in a cavity along at least a portion of the bottom edge. The device further includes at least one wear block selectively reversible to present the adapter blade at a first angle or a second angle. The at least one wear block can include a bottom edge having a carbide insert along at least a portion of the bottom edge.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: November 21, 2017
    Assignee: Winter Equipment Company
    Inventor: Kent Winter
  • Patent number: 9816850
    Abstract: A welding method includes inserting a weldable object at least partially into a through-bore formed in a generally tubular body, the tubular body having an interior flow passageway and an outer surface, and the through-bore having a borehole wall; transmitting inert gas between the weldable object and the borehole wall, the gas being transmitted through the through-bore; and welding the weldable object to the tubular body while the inert gas is being transmitted.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: November 14, 2017
    Assignee: Daniel Measurement and Control, Inc.
    Inventors: Charles Robert Allen, Chae H. Ha
  • Patent number: 9815151
    Abstract: Apparatus for assisting in weld assembling a box column from a tack-welded pre-assembly of planar plate components. The apparatus features (1) an elongate frame defining a rotational-assembly axis, and (2) plural pre-assembly-receiving, rotational support structures mounted at spaced locations on the frame—each support structure including (a) an openable/closable yoke possessing a collar-reception zone, (b) an openable/closable collar rotatably receivable within this reception zone, and possessing a central throughpassage having a cross-sectional configuration which is larger than that of a box-column which is to be assembled, and (c) a pair of removably-collar-attachable, throughpassage clamping shoes for forming cooperatively, within the collar throughpassage, a window for complementarily, receiving extension therethrough of a box-column pre-assembly's cross section.
    Type: Grant
    Filed: February 10, 2015
    Date of Patent: November 14, 2017
    Assignee: ConXtech, Inc.
    Inventor: Robert J. Simmons
  • Patent number: 9815134
    Abstract: The present invention relates to an impeller manufacturing method in which a thermal cycle is performed on an assembly body with a brazing material formed of a Ni-containing Au alloy being placed at a bond portion of at least two impeller constituent members. The thermal cycle includes a temperature increasing process with a temperature increasing rate of 20° C./hr. to 100° C./hr., the process including a first intermediate retention and a second intermediate retention each keeping the temperature, the first intermediate retention performed in a temperature range of 500° C. to 850° C. and the second intermediate retention performed in a temperature range of 850° C. to 950° C. (but not including 850° C.). In the thermal cycle, the temperature is increased in a temperature range exceeding 950° C. after the second intermediate retention at a rate lower than that before the second intermediate retention.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: November 14, 2017
    Assignee: MITSUBISHI HEAVY INDUSTRIES COMPRESSOR CORPORATION
    Inventors: Kazutoshi Yokoo, Daisuke Tanaka, Daisuke Kawada, Koshiro Niihara, Hiroki Takagi, Yujiro Watanabe, Hiroshi Nakajima
  • Patent number: 9815133
    Abstract: A method includes applying solder pastes separately to first and second portions of the first member; bringing the solder paste applied to the first portion of the first member and a first portion of the second member into contact with each other, and bringing the solder paste applied to the second portion of the first member and a second portion of the second member into contact with other; and causing the solder paste brought into contact with the first portion of the second member and the solder paste brought into contact with the second portion of the second member to melt. In the melting, molten solder formed by melting the solder paste brought into contact with the first portion of the second member and molten solder formed by melting the solder paste brought into contact with the second portion of the second member are joined to each other.
    Type: Grant
    Filed: August 3, 2015
    Date of Patent: November 14, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Ichiro Kataoka, Hiroshi Kondo, Tadashi Kosaka, Koji Tsuduki, Hisatane Komori, Shin Hasegawa
  • Patent number: 9808875
    Abstract: Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: November 7, 2017
    Assignee: Intel Corporation
    Inventors: Deepak V. Kulkarni, Carl L. Deppisch, Leonel R. Arana, Gregory S. Constable, Sriram Srinivasan
  • Patent number: 9810348
    Abstract: Within examples, a method of manufacturing a double-walled titanium conduit is described. Example methods include stitch welding multiple concentric sheets to form a stitch layer, providing the stitch layer between an inner wall and an outer wall of the double-walled titanium conduit, circumferentially seam welding the inner wall and the outer wall to the stitch layer to create a welded assembly, die forming the welded assembly at temperature and pressure to form inner structures between the multiple concentric sheets according to stitch welding lines and to enable a diffusion bond process among the inner wall, the stitch layer, and the outer wall, and removing the double-walled titanium conduit from the die.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: November 7, 2017
    Assignee: The Boeing Company
    Inventor: Charles W. Rust