Abstract: A method of producing a molded assembly for at least partially encapsulating a touch panel structure. The method includes providing a touch panel structure which has a front side, a reverse side and an edge extending therebetween. A circuit is attached to the panel structure and includes at least one device. The panel is positioned in a cavity of a plastic injection mold which includes a hollow shutoff positioned relative to the device on the touch panel. When the mold is closed, a rim portion of the hollow shutoff is positioned against the reverse side of the panel spaced away from the device so as to at least partially shield the portion of the panel containing the device from the injection molding environment. The present invention also envisions a product produced by this method.

Abstract: Apparatus for interconnecting an integrated circuit device, such as an infrared device, having a plurality of leads to a multilayer printed wiring board having a plurality of interconnects. The apparatus comprises a flexprint circuit having a plurality of interconnects that are configured to mate with the plurality of interconnects on the printed wiring board. The flexprint circuit has wrinkles formed along its surface that form a spring, and a plurality of printed circuit leads that are coupled between the leads of the integrated circuit device and the interconnects. Fastening members is provided for forcibly interconnecting the respective pluralities of interconnects. Respective ends of the flexprint circuit may be folded so that the interconnects contact the interconnects disposed on the printed wiring board.

Abstract: A cooling subsystem and method for a chassis of a computer system. The cooling subsystem comprises: (1) first and second cooling fans having first and second motors associated therewith for driving the first and second cooling fans, respectively and (2) a common plenum substantially shrouding and providing a pathway for air communication between the first and second cooling fans, the first and second fans cooperating to provide an optimum rate of air flow from without the chassis to within the chassis to provide air exchange within the chassis, the air flow within the chassis being in a predetermined direction to provide directed cooling of a specified device within the chassis, the common plenum allowing the first and second fans to continue to cooperate to provide a minimum air flow to provide a minimum air exchange within the chassis, the air flow remaining in the predetermined direction to continue the directed cooling of the specified device when a selected one of the first and second motors fails.

Abstract: A thermally enhanced ball grid array package for electronic components, with an electronic and a plurality of ceramic component carriers bonded to a metal heat sink, enhances thermal performance, reduces solder ball fatigue and reduces stresses between the ceramic component carriers and the heat sink. Bonding the ceramic component carriers to the heat sink reduces expansion induced stresses of the solder balls on the carriers. Plural ceramic component carriers, smaller than a single carrier would have to be for the same package, reduce stresses at the interfaces between the ceramic component carriers and the heat sink.

Abstract: The present invention provides a method for fabricating an integrated circuit package, as well the resulting integrated circuit package, which retains a heatsink in close communication with a mold cavity. This precludes any encapsulant from flowing between the heatsink and the inner surface of a mold cavity. As a consequence, the bottom of the heatsink is not encapsulated and is thus exposed. This is accomplished by including posts, attached to the leadframe assembly, which have the function of exerting a downward force on a leadframe assembly and, in turn, on the heatsink. Tie bars, which are non-functional parts of a leadframe assembly, can be utilized as posts by bending the posts into an upright position.

Abstract: A cabinet for housing electronic equipment connectable to machines or power tools for performing operations, wherein connections are made with cables provided with single or multi contact connector plugs (19) received by single or multi contact jacks (17). The cabinet comprises a central casing (10), a door (13) and a partition wall (15) defining a connector chamber (16) inside the central casing (10) behind the door (13) and housing the jacks (17), such that the connector plugs (19) and jacks (17) are protected from environmental influence such as dust and/or splashing water or other fluids. The cables (18) extend into the casing (10) through openings (20) at the lower edge of the door (13). A lock (31, 32) on the door (13) enables protection against intentional as well as unintentional disconnection of the cables (18).

Abstract: A contact-sensitive display screen panel of a craft unit is protected by a pivotable lid. The lid is rotatably supported by lid pivot attachments that enable the lid to be pivoted between closed and open positions, and to be stably locked as a support member in its fully extended attitude. Lid pin elements extend from opposite ends of a lid pin support element and engage left side and right side hinge assemblies. Each lid pin element has a tab element translatable along the underside of the lid. Each lid pin element is biased by a compression spring into engagement with a capturing slot in an interior bore of a post of a hinge arm element of a respective one of hinge assemblies. To rotate the lid from its open position, to its fully extended position, the craftsperson translate the tab elements against the biasing of compression springs, so that the lid pin element becomes unlocked from a slot in the interior bore of the hinge arm element of a respective hinge assembly.

Abstract: A switch for interrupting an electrical circuit in response to a mechanical interaction, such as an overpressure or underpressure condition. The switch includes an actuation arm electrically connected to a common terminal. The actuation arm is moveable between a first position and a second position in response to the mechanical condition. The switch further includes an M-blade operatively connected to the actuation arm. The M-blade levers from a first configuration to a second configuration when the actuation arm moves from the first position to the second position. The M-blade completes the electrical circuit in the first configuration and interrupts the electrical circuit in the second configuration. The switch further includes a reset actuator disposed to engage the M-blade in response to a reset actuation. The M-blade levers from the second configuration to the first configuration when the reset actuator engages the M-blade and the actuation arm is not in the second position.

Abstract: An electronic device with an EMI shield surrounding an electronic component on a substrate. A heat sink extends through an opening in the shield from heat conductive contact with the component to a position outside the shield. The heat sink operates also in an EMI shield capacity. The shield is stressed to hold the heat sink positively in heat conducting contact with the components. The shield preferably has cutting teeth which cut into the heat sink as the latter is passed into the aperture. With the inserted part of the heat sink being cylindrical, rotation of the heat sink causes the teeth to move up the inserted part to stress the shield and urge the heat sink against the component.

Abstract: The present invention relates to electronic packaging for PC Cards, and more particularly to attaching the PC Card covers to the printed circuit board and frame. The purpose of the present invention is to provide a PC card assembly comprising of a printed circuit board coupled to the frame and attached to a bottom cover and a top cover by tabs in the bottom cover. The present invention also provides a method of assembling the PC Cards such that the tabs in the bottom cover are inserted into the through openings in the frame. These inserted tabs are then bonded to the top cover, creating a very rigid assembly and providing a very fast manufacturing process throughput.

Abstract: In a hybrid integrated circuit module in which circuit components, including semiconductor devices and chip components, are integrated and which is bonded onto a heat-sinking substrate, a substrate for mounting chip components is made of a low thermal conductivity material and is bonded onto the heat-sinking substrate; a base plate for mounting semiconductor devices is made of a high thermal conductivity material and is bonded onto the heat-sinking substrate; a hollow cover covers a space above the base plate to make an enclosure between the base plate and the cover; a sealing means hermetically seals the enclosure; and a plurality of interconnection leads is formed through the cover to electrically connect a circuit on the base plate and a circuit on the substrate and for testing operating signals in the semiconductor devices.

Abstract: A conductive paste for producing an external electrode of a ceramic chip part and a multilayer ceramic capacitor having an external electrode produced by using the conductive paste, the conductive paste comprising powder of a conductive material, a glass frit, and an organic vehicle, the glass frit containing PbO, B.sub.2 O.sub.3, and SiO.sub.2 as major components and further containing from 1 to 20 wt % of at least one of TiO.sub.2 and Al.sub.2 O.sub.3.

Abstract: A cooling system for cooling electrical components in a personal computer is provided. The cooling system provides filtered air under a positive air pressure to such components in the computer, as the electrical power supply and microprocessor, as well as other components in the computer. The filtered air cools the components and prevents dust from collecting on the components. In a second embodiment, the cooling system includes a tower style case for supporting the personal computer. The case houses an air filter and induction fans, for providing copious cooling air flow through ducts in the computer. Air vents are placed in optimal areas in the computer, such as near the microprocessor and power supply, to provide increased air circulation for the components in these areas. A switch panel is additionally provided that enables energizing peripheral devices when desired.

Abstract: A heat dissipating arrangement in a portable computer uses a copper slug disposed between a heat-generating central processing unit (CPU) chip and the underside of a metallic keyboard baseplate. The slug also extends through a copper-plated hole in a printed circuit (PC) board, and is either soldered to the copper plating or press-fit into the hole to enhance heat transfer between the slug and the PC board. Small through-holes extend through the PC board and the copper plating next to the opening. These through-holes connect the copper plating to several layers of etch within the PC board, so that these layers act like fins on a heat sink to increase heat transfer away from the CPU.

Abstract: An integrated circuit package which has internal bonding pads that are located on bonding shelves and coupled to internal conductive power/ground planes by conductive strips that extend along the edges of the shelves. The edge strips eliminate the need for conventional vias to couple the bonding pads to the planes and thus reduce the cost and size of the package and improve package electrical performance (less inductive, less resistance path). The bonding pads are coupled to an integrated circuit that is mounted to a heat slug attached to a top surface of the package. The heat slug can function as both a ground path and a thermal sink for the integrated circuit. The package may have capacitors coupled to the internal routing of the package to reduce the electrical noise of the signals provided to the integrated circuit. Additionally, the package may have multiple power planes dedicated to different voltage levels.

Abstract: A variable capacitor and method of varying capacitance in which two pressurally engaged plates having electrically conductive patterns on facing surfaces are separated by a low friction polytetrafluoroethylene (Teflon.TM.) dielectric disk so that the plates may be rotated relative to one another to vary capacitance. Each of the facing surfaces of the plates include two spaced semicircular patterns, one that is electrically connected to the capacitor and one that is not, for maintaining the separation of the plates from the disk. The dielectric disk may be ten to twenty times thicker than the semicircular patterns.

Abstract: A circuit card having module strain relief and heat sink support is provided. The circuit card comprises a printed circuit board having a front and a back, a module mounted to the front of the printed circuit board, and a stiffening structure mounted to the back of the printed circuit card directly opposite from the module to provide rigidity to the printed circuit board. The module has a plurality of electrical leads making electrical connection with the printed circuit board and anchoring the module to the printed circuit board. The stiffening structure is coextensive with the plurality of electrical leads along the printed circuit board, and is of sufficient thickness and strength to resist flexure of an area of the printed circuit board in contact with the stiffening structure in response to shock and vibration applied to the module.

Abstract: The invention relates to an apparatus which enables, via an elementary manipulation, protection against access to and destruction of data contained in a computer system or deactivation of such protection. The protected computer system may include a housing of a central processing unit (CPU) with its memories, the housing being separate from data access devices. The CPU and memories are connected to the data access devices by connectors which are external to the housing. The housing is defined by an enclosure (18) provided with at least one door or the like. Advantageously a plurality of housings may be defined in the enclosure, each of which housings can benefit from the inventive apparatus. Closing of the door causes a multipolar switch (28) to open, which switch is electrically connected between:links connected to the data access devices located outside the housing;connectors of/from the housing which connectors are to be protected.

Abstract: A pressure sensitive switch has upper, middle and lower laminar elongated members, the middle member having an opening therethrough defining a cavity between the upper and lower members. A first array of substantially parallel, spaced-apart electrically conductive bands is fixed to a lower surface of the upper member and traverses the cavity. A second array of substantially parallel, spaced-apart electrically conductive bands is fixed to an upper surface of the lower member and traverses the cavity and the upper member bands, selected lower member bands being discretely connected to an electrical input lead and other lower member bands being discretely connected to an electrical output lead.

Abstract: A portable electronic apparatus comprising a box-shaped housing made of synthetic resin and a circuit unit incorporated in the housing. The circuit unit has a circuit board having circuit parts which generate noise while operating, a frame supporting the circuit board, and a shield formed of a metal plate and surrounding the circuit board and the frame. The frame is a molding made of synthetic resin or a cast product made of metal such as magnesium.