Abstract: An electrical element comprising a housing or casing, a heat generating part such as a high-tension resistor, a non-heat generating part such as a capacitor, and a resin filling the housing. Further, the electrical element also includes connectors for establishing external connections between the above-mentioned capacitor or high-voltage resistor, the connectors being arranged at positions suitable for them to dissipate heat from the high-voltage resistor and radiate heat outside the element.

Abstract: Disclosed is a protector device designed for insertion in connecting blocks. The device includes a ground connector which has a detent on one end for receiving a ground bar from the connecting block. The other end of the connector contacts the ground electrode of a voltage surge protector element when the ground bar is inserted without any forces supplied by the housing.

Abstract: A high performance, low cost multi-chip module package using a heatsink as a substrate with thin film wiring techniques or multilayered wiring techniques for interconnection of the chips on the surface of the module and a solder column grid array or solder ball grid array for interconnection to the next level of packaging (printed circuit board). The columns or balls create a space between the board and module with the chips being in the space and provide the required interconnect density.

Abstract: A scanner casing has a lower housing and an upper housing covering the lower housing. A glue material is adhered on a lower periphery edge of the lower housing. The lower housing is adhered on a scanner. Four threaded fastening portions are disposed on four upper corners of the lower housing. Each of the threaded fastening portions has a threaded hole. Four hollow fastening portions are disposed on four upper corners of the upper housing. Each threaded hole matches each corresponding hollow fastening portion to be fastened by a bolt.

Abstract: A heat dissipating structure for rectifiers of car alternators includes an upper cover, a rectifier assembly disposed under the upper cover, and a heat dissipating plate disposed below the rectifier assembly. The rectifier assembly is comprised of a plurality of rectifying elements and terminals, and a heat conductive assembly for receiving the rectifying elements. One side of the respective rectifying elements are connected to the terminals to constitute a rectifier circuit. The other side of the respective rectifying elements are connected to the heat conductive assembly, which is in turn connected to the heat dissipating plate. The heat conductive assembly is comprised of a heat conductive plate to which the rectifying elements may adhere, and a ceramic heat dissipating substrate disposed between the heat conductive plate and the heat dissipating plate.

Abstract: The present invention is to provide a heat sink used for a portable information processing apparatus, the casing of which has a recess in which an exchangeable arithmetic processor is accommodated. There is provided a heat receiving plate closely coming into contact with the arithmetic processor. The heat receiving plate includes a round hole portion arranged at one end. A heat pipe is inserted into the round hole portion. A fixing member is attached to the heat receiving plate at an outlet portion of the heat pipe arranged in the round hole portion. The heat receiving plate is fixed to the casing through the fixing member so that a hinge mechanism can be formed by the heat receiving plate and the heat pipe which is used as a fulcrum. At least a portion of the heat pipe is thermally connected with a radiating member.

Abstract: A housing structure for retaining and cooling a plurality of printed circuit boards includes an arrangement of parallel electrical connectors, which receive associated connectors mounted to respective ones of the printed circuit boards. Integrated with each printed circuit board is a respective frame-configured thermally conductive heat exchanger, that abuts a first side of the printed circuit board. A second side of the printed circuit board contains circuit components to be cooled. Cooling fluid flowing through the adjacent chambers of the heat exchanger draws heat away from the circuit components. A cooling fluid supply and removal plenum is coupled to adjacent fluid inlet and exhaust ports provided at a top end wall of the heat exchanger.

Abstract: The heat dissipated by the integrated circuit (11) is evacuated into a plate (13) having an extended surface in order to transmit the heat into the integrated circuit package (10) and into the wiring board (12) by means of the input-output terminals (17) of the package.

Abstract: Device for cooling of electronics units (1) carried by a support structure (2) with flat sections (3, 4, 5) and comprising several flat antenna elements (6). The support structure (2) and the flat antenna element (6) extend generally in the vertical direction and present an intermediate cavity (16) having an air inlet opening arranged at a lower region and an outlet opening arranged at an upper region. In this manner, air is forced to flow through said cavity by means of self-circulation.

Abstract: A tower computer includes a housing and an access panel which can be opened to provide access to the interior components of the housing. A cooling fan is mounted on the panel and is electrically coupled to an electrical plug which is also mounted on the panel. That plug is adapted to become automatically connected to a receptacle mounted in the housing, in response to a closing of the panel. The plug automatically becomes disconnected from the receptacle in response to the panel being opened.

Abstract: A lid of an electronic unit box has a plurality of first fixing ribs and a plurality of second fixing ribs on the top wall thereof which are arranged parallel. The first and second fixing ribs have step-shaped cuts in such a manner that the cuts are opposite to each other, so that when the box body is covered with the lid, the cuts of the fixing ribs are abutted against the opposite edges of the electronic unit to fixedly hold the electronic unit.

Abstract: A planar array of electric conductors is stamped from a sheet of conductive material and has tabs for each of the conductors bent outwardly of the plane of the material. The conductors are interconnected by a plurality of webs and are affixed to a dielectric carrier sheet by an adhesive, whereupon the webs are severed and the conductors have electrical isolation. The carrier sheet and conductors are attached to a control panel and electric control devices are attached to the control panel over the conductors. The control devices are provided with terminals that extend in the same direction as the tabs of the conductors, and the control devices are electrically connected to the conductors by double ended push-on preformed connectors.

Abstract: A fastener fastened to a CPU mount to hold down a heat sink on a CPU, including a first clamping plate and a second clamping plate respectively hung on two opposite sides of the CPU mount, a stretcher having a first end fastened to the first clamping plate and a second end inserted through a hole in the second clamping plate, and a lever pivoted to the second end of the stretcher and stopped at the second clamping plate and turned between a vertical position in which the fastener is loosened, and a horizontal position in which the fastener is tightened.

Abstract: Encapsulated thermally enhanced (TE) and electrically and thermally enhanced (ETE) integrated circuit assemblies that include bulky thermally conductive heat sinks are disclosed. The integrated circuit assemblies are configured to prevent the formation of pinholes and IC package warpage without adding bulk or additional structures. The assemblies are repositioned, through an offset in the bonding fingers of the leadframe, so that the rates of mold flow in the two halves of the mold cavity are substantially balanced. The repositioning of the assemblies also substantially balances the amount of mold material in the mold halves, which prevents warpage in a finished IC package.

Abstract: A thermal pellet holds contact-carrying resilient switch blades in bending stress with the contacts closed. Melting of the thermal pellet relieves the bending stress and allows movement of the switch blades to open the contacts.

Abstract: Heat transfer device (30) dissipates and removes heat energy from a heat source and delivers the heat energy to a heat sink. Heat transfer device (30) includes diamond substrate (32) for receiving the heat energy from the heat source. Interconnect point (36) connects to diamond substrate (32). Fiber (34), such as a carbon fiber, connects at interconnect point (36) to receive the heat energy from diamond substrate (32) and conduct the heat energy to the heat sink.

Abstract: A thermal cutoff having a single switch blade that is held in a contacts-closed position under bending stress by a thermal pellet and that moves to a contacts-open position solely by relief of the bending stress upon melting of the thermal pellet.

Abstract: A heat conductive substrate is mounted within a through-opening of a printed circuit board. An integrated circuit then is mounted to one side of the heat conductive substrate, while a heat sink is fixed in thermal contact to the other side of the substrate. There is no direct thermal contact between the IC and the PC board. The substrate is mounted to an undersurface of the PC board and concentrically spaced from the PC board within the opening. An air gap occurs between the substrate and the PC board within the opening to substantially reduce heat conductivity into the PC board.

Abstract: A housing member (100, 100', 100", 100'") used to interface with a coupling of a fluid pressure source and to house a pressure sensing assembly is shown having a metallic tubular sidewall with a cylindrical first portion (102), a non-cylindrical second portion (108, 108') and intermediate third portion (112, 112',112") with a plastic body member (114, 114', 114") disposed, as by insert molding, within the tubular sidewall. The plastic body member has a base wall portion (116) extending across the sidewall at the intermediate, third portion (112) and has an elongated portion (120, 120') with a threaded bore. The second portion of the sidewall extends along a longitudinal axis at least as far as the elongated portion of the plastic body member. In one embodiment a metallic insert (152) forms a continuation of the molded plastic thread and in another embodiment inwardly extending groove (160) of second portion (108') of the tubular sidewall reinforces the molded plastic thread.

Abstract: A system for cooling a circuit board within a chassis having an interior and an interior wall includes a member that extends between the interior wall and a face of the circuit board. To that end, the system further includes an inlet formed in the chassis for receiving air to cool the circuit board, an outlet formed in the chassis for ejecting air from the interior of the chassis, and the member. The member may physically contact the face of the circuit board.