Patents Examined by Gerald P. Tolin
  • Patent number: 5790379
    Abstract: A natural heat dissipation device for a microprocessor. The microprocessor is conventionally mounted to a printed circuit board. The printed circuit board contains a recess that is cut-out directly below the microprocessor. Heat sink material is attached to the microprocessor through the recess. The heat sink material attached to the bottom of the microprocessor may be used alone or in conjunction with a an attached metal tray or case under the printed circuit board.
    Type: Grant
    Filed: November 5, 1997
    Date of Patent: August 4, 1998
    Assignee: Samsung Electronics America, Inc.
    Inventor: Ki B. Kang
  • Patent number: 5786985
    Abstract: A semiconductor device is adapted to be mounted on a circuit substrate in an approximate vertical position. The semiconductor device includes a semiconductor chip, a stage having a first surface and a second surface opposite to the first surface, where the semiconductor chip is mounted on the first surface, a resin package encapsulating the semiconductor chip, where the resin package has upper and lower surfaces and side surfaces, a plurality of leads respectively having one end electrically connected to the semiconductor chip and another end extending downwardly from the lower surface of the resin package, and an upper extension, provided on the stage, extending upwardly from the upper surface of the resin package.
    Type: Grant
    Filed: November 15, 1996
    Date of Patent: July 28, 1998
    Assignee: Fujitsu Limited
    Inventors: Norio Taniguchi, Junichi Kasai, Kazuto Tsuji, Michio Sono, Masanori Yoshimoto, Katsuhiro Hayashida, Mitsutaka Sato, Hiroshi Yoshimura, Tadashi Uno, Kosuke Otokita, Tetsuya Fujisawa
  • Patent number: 5786982
    Abstract: An electric load center having a basepan having a surface with two spaced apart integrally formed wall members extending upward from the surface forming a barrier between the bus bars of the load center.
    Type: Grant
    Filed: March 27, 1996
    Date of Patent: July 28, 1998
    Assignee: Siemens Energy & Automation, Inc.
    Inventors: William E. Rose, Christopher Bozzone
  • Patent number: 5784255
    Abstract: A heat sink mounted on an electronic component causes a thermal plume effect so that air adjacent to the electronic component moves through one or more channels in the heat sink in a direction substantially transverse to and away from the electronic component. The heat sink includes a base attachable to the electronic component, a support member mounted on and substantially transverse to the base, and a heat exchanger mounted on the support member and spaced away from the base. The heat exchanger has at least one entry hole adjacent to the base, at least one exit hole at a distance from the entry hole, and one or more channels adjacent to the support member and in flow communication with the entry hole and the exit hole.
    Type: Grant
    Filed: December 4, 1995
    Date of Patent: July 21, 1998
    Assignee: Integrated Device Technology, Inc.
    Inventor: Christopher P. Wyland
  • Patent number: 5784256
    Abstract: A portable electronic apparatus comprising a housing having a bottom, a metal frame provided in the housing, a circuit board supported by the frame, and an IC chip secured to the circuit board. The circuit board has a first surface extending substantially parallel to the bottom of the housing and a second surface opposing the first surface. The IC chip is adhered to the first surface of the circuit board and generating heat while operating. The apparatus further comprises a metal cover arranged on the first surface of the circuit board and covering the IC chip, and a metal shield plate covering the first surface of the circuit board and the metal cover. The frame has a heat-receiving part which contacts the second surface of the circuit board and which is located near the IC chip. A first thermally conductive elastic sheet is interposed between the cover and the IC chip, and a second thermally conductive elastic sheet is interposed between the cover and the shield plate.
    Type: Grant
    Filed: December 3, 1996
    Date of Patent: July 21, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiroshi Nakamura, Yuji Nakajima
  • Patent number: 5780798
    Abstract: A sensing unit to be positioned between the matress of a bed and the bed frame for monitoring an occupant of the bed, the sensor consisting of thinly spaced upper and lower steel plates between which is located a point sensor such as a Hall effect transducer or a reed switch. The upper plate flexes in response to the weight of an occupant above. The sensing unit is to be attached to a control unit which generates an audible and visible alarm signal when the occupant leaves the bed. In a different embodiment, sensors are located in the bed frame to monitor the occupant of the bed.
    Type: Grant
    Filed: August 15, 1996
    Date of Patent: July 14, 1998
    Inventor: John Alan Hall-Jackson
  • Patent number: 5781410
    Abstract: A telecommunications equipment enclosure, designed to be placed outdoors at a remote location, houses equipment to provide a large number of voice channels, an AC power supply, an AC/DC distribution panel, protector panels, a back-up battery plant, multiplexers, a fiber distribution panel, and a separate cable splice area. Other equipment may also be housed in the enclosure if needed. The enclosure is configurable to customers' requirements, and is extremely small and densely packed relative to its channel capacity.
    Type: Grant
    Filed: January 17, 1996
    Date of Patent: July 14, 1998
    Assignee: NEC America, Inc.
    Inventors: Mark Sherman Keown, Casey Martin Bardue, John Reed Hannig, William R. Olsen
  • Patent number: 5777847
    Abstract: A multichip module comprises a substrate mounting a plurality of circuit chips, a cover plate positioned over the circuit chips, and at least one pillar member for fixing the cover plate to the substrate to support it. The substrate has a plurality of circuit chips fixed in a predetermined pattern of locations on a side thereof. At least one pillar member fixes the cover plate to the substrate such that the cover plate is positioned over the circuit chips. Since the pillar member is fixed to the substrate at a small area to support the cover plate, the substrate can be prevented from deforming due to a temperature change. In order to secure the covering member, the pillar member is preferably fixed by means of an adhesive, a fit, or screwing.
    Type: Grant
    Filed: March 6, 1997
    Date of Patent: July 7, 1998
    Assignee: NEC Corporation
    Inventors: Kenichi Tokuno, Akihiro Dohya
  • Patent number: 5777842
    Abstract: A transformer station includes a plurality of power transmission lines receiving electric power, a bus bar connected to the power transmission lines, a transformer connected to the bus bar to transform voltage of the electric power supplied from the bus bar, and breakers between one of the power transmission lines and the bus bar and between the transformer and the bus bar. The breakers are aligned along an imaginary line extending substantially parallel to the bus bar.
    Type: Grant
    Filed: April 24, 1996
    Date of Patent: July 7, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Masanori Tsukushi, Youichi Ohshita, Ken'ichi Natsui, Yuzuru Kamata, Makoto Yano, Noriyuki Yaginuma, Katsuhiko Shiraishi
  • Patent number: 5774328
    Abstract: An electronic energy meter register enclosure which, in one embodiment, includes ribs and snaps configured to engage and snugly hold a printed circuit board in place is described. Openings in a meter frame align with openings in the enclosure, and threaded bolts securely engage the enclosure to the meter frame. The enclosure also includes, in the one embodiment, a snap which snaps on the rear bearing of the meter for facilitating holding the register enclosure in place. The enclosure further includes a shroud, and sidewalls of the shroud are configured to be closely positioned proximate the sides of the meter frame to reduce amount of ambient light allowed in the cavity of the shroud. The combination of the meter disc, the meter mechanical register, the meter frame and the shroud almost completely shields the electrical components of the register circuit board from harmful UV exposure that would create degradation and excessive heat build-up.
    Type: Grant
    Filed: April 15, 1996
    Date of Patent: June 30, 1998
    Assignee: General Electric Company
    Inventors: William O. Rector, Patrick J. Horan, David Dopp
  • Patent number: 5768104
    Abstract: A method and apparatus for cooling high power integrated circuits mounted on a printed circuit board. The invention includes producing a cold plate adapted to receive the printed circuit board thereon. A series of thermal shims are produced in incremental varying thicknesses from a thermally conductive material. A gap between each integrated circuit and the cold plate is determined that would result when the plate and board are assembled. One of the thermal shims is selected for each gap, the thickness of each selected shim being dependent upon the gap for which it is selected. The shim is placed between the cold plate and the integrated circuit so that when the module is assembled, the gap is eliminated and a thermal conductive path between the cold plate and each circuit is created.
    Type: Grant
    Filed: February 22, 1996
    Date of Patent: June 16, 1998
    Assignee: Cray Research, Inc.
    Inventors: Richard B. Salmonson, Daniel John Dravis
  • Patent number: 5764483
    Abstract: Heat generated at heat generating components is efficiently transported to a wall of a metal box serving as a heat dissipation section to cool the heat generating components even in an apparatus, in which box the heat generating components together with other components are mounted. The heat generating components and the heat dissipation section are connected to each other through a thermal transport device having a flexible structure. The heat generating components and the box are readily connected to each other irrespective of the arrangement of components, and heat is efficiently transported by driving the liquid. In the heat dissipation section, because the heat generating components and the wall of the metal box are thermally connected to each other, a high heat dissipation capacity is obtained as heat is diffused extensively into the wall due to a high thermal conductivity of the metal box.
    Type: Grant
    Filed: October 15, 1996
    Date of Patent: June 9, 1998
    Assignee: Hitachi, Ltd.
    Inventors: Shigeo Ohashi, Toshio Hatada, Shinji Tanaka
  • Patent number: 5763840
    Abstract: A membrane switch including a plurality of upper dot-pads and a plurality of lower dot-pads is provided to enhance the operational sensitivity while avoiding unexpexted actuation of membrane switch is provided. The plurality of upper dot-pads are provided during the print process of the top switch-pad and distributed to surround the top switch-pad. A plurality of lower dot-pads corresponding the plurality of upper dot-pads are provided during the print process of the bottom switch-pad and distributed to surround the bottom switch-pad. Each of the plurality of upper dot-pads has a lower-edge and each of the plurality of lower dot-pads has an upper-edge. As the top membrane is free of an external force, the lower-edge of top switch-pad is spaced from the upper-edge of bottom switch-pad by a first dimension greater than a second dimension by which the lower-edge of each upper dot-pad is spaced from the upper-edge of each lower dot-pad.
    Type: Grant
    Filed: May 13, 1996
    Date of Patent: June 9, 1998
    Assignee: Acer Pheripherals, Inc.
    Inventor: Pin-Chien Liao
  • Patent number: 5761037
    Abstract: In accordance with a preferred embodiment of the present invention, an orientation independent evaporator includes a wicking member which also operates as a manifold which possesses a number of surface accessible channels preferably via grooves cut in either side of a slab of wicking material at right angles to one another. The evaporator is, because of the structure of this wicking member, able to be operated in any orientation with respect to a gravitational field. The invention provides an improved evaporator for use in thermosyphons, and in particular, provides an improved mechanism for cooling electronic components.
    Type: Grant
    Filed: February 12, 1996
    Date of Patent: June 2, 1998
    Assignee: International Business Machines Corporation
    Inventors: Timothy Merrill Anderson, Gregory Martin Chrysler, Richard Chao-Fan Chu
  • Patent number: 5761041
    Abstract: A leaf type spring is used to hold a heat sink in contact with a chip or other heat-emitting component. Such a component may be mounted on a PCB or other element. A bolster plate is positioned below the PCB and two pins extend up from the bolster plate, through the PCB and through the base of a heat sink. A preferred heat sink has plural fins extending up from the base. In one form of the invention the pins extend above the level of the outer ends of the pins. A spring extends diagonally across the ends of the fins. Slots in the ends of the spring engage necks formed near the ends of the pins. In another form of the invention the fins are milled or otherwise formed with a groove extending diagonally across the heat sink and the spring fits into the slot. The pins extend only a short distance above the base of the heat sink and are necked to receive the slotted ends of the spring. In both forms of the invention intimate contact of the base with the heat emitting component improves heat transfer.
    Type: Grant
    Filed: June 25, 1996
    Date of Patent: June 2, 1998
    Assignee: Sun Microsystems, Inc.
    Inventors: Ali Hassanzadeh, Hassan Sihpolo
  • Patent number: 5754401
    Abstract: A heatsink is pressure compliantly mounted against a substrate-mounted packaged electronic device such that the heatsink is not readily dislodged from the device package. A layer of pressure-compliant elastomeric foam material is sandwiched between the upper surface of the heatsink and an overlying shroud, which biases the heatsink downward toward the packaged device, which may be a BGA-packaged device. The lower heatsink surface is attached to the upper device package surface with double-sided thermal tape, and the shroud is attached to the substrate and compressively but compliantly urges each heatsink into more intimate thermal contact with an underlying device. The pressure-compliant material compensates for dimensional vertical tolerances associated with the substrate-mounted devices and heatsinks, while dampening vibrations and minimizing stress and torque that could otherwise damage the devices and/or the integrity of their electrical connections to the substrate.
    Type: Grant
    Filed: February 16, 1996
    Date of Patent: May 19, 1998
    Assignee: Sun Microsystems, Inc.
    Inventors: Mohsen Saneinejad, David K. J. Kim, Mark H. Waters
  • Patent number: 5754398
    Abstract: A circuit-carrying automotive component and a method of manufacturing the same are provided. In a preferred embodiment of the invention, the component includes a substrate made from a polymer that is molten at a predetermined elevated temperature. The component further includes a circuit board which defines an aperture therethrough adapted to receive the molten polymer at the elevated temperature and a fastener formed from the molten polymer through the aperture. The fastener is integral with the substrate and mechanically secures the circuit board to the substrate. The circuit board is made from a material that is resistant to fusing with the molten polymer at the elevated temperature.
    Type: Grant
    Filed: May 28, 1996
    Date of Patent: May 19, 1998
    Assignee: Ford Motor Company, Inc.
    Inventors: Andrew Z. Glovatsky, Alice Zitzmann
  • Patent number: 5751552
    Abstract: A hybrid multi-chip module includes semiconductor chips (27, 31) bonded to a base plate (24). The base plate includes a substrate (11) having two surfaces (12, 13) and a conductive material (16) molded on the two surfaces (12, 13). A coefficient of thermal expansion (CTE) mismatch between the substrate (11) and the conductive material (16) at the first surface (12) is balanced by a similar, but opposite, CTE mismatch between the substrate (11) and the conductive material (16) at the second surface (13). The CTE mismatch balance across the base plate (24) produces a base plate (24) having a substantially planar form at high temperatures.
    Type: Grant
    Filed: May 6, 1997
    Date of Patent: May 12, 1998
    Assignee: Motorola, Inc.
    Inventors: Christopher M. Scanlan, Carl J. Raleigh
  • Patent number: 5751542
    Abstract: A wall socket is adapted to be flush-mounted in a wall terminal box. The base of the wall socket comprises a base portion, which is flush-mounted in the wall terminal box and supports connector terminals for an alternating voltage available in the wall terminal box, as well as a surface-mounted base portion, which is located outside, and is laterally offset in relation to the opening of the wall terminal box and which supports at least one low-voltage socket (31) for a direct voltage. A surface-mounted cover (40) encloses not only the opening of the wall terminal box (10) but also the surface-mounted and laterally-offset base portion, and further is formed with one or more openings giving access to the low-voltage socket. A transformer and rectifier element arranged in the wall terminal box has an alternating voltage side for connection to the alternating voltage, as well as a direct-voltage side for emitting step-down transformed and rectified voltage to the low-voltage socket (31).
    Type: Grant
    Filed: November 25, 1996
    Date of Patent: May 12, 1998
    Assignee: Vattenfall AB
    Inventor: Jorgen Holhammar
  • Patent number: 5751208
    Abstract: A system for establishing and terminating the flow of electrical current through a circuit which includes a fuse puller which engages and retains a standard plug-in fuse element. The system also includes a housing which supports the fuse puller and associated fuse in a first, raised position which separates the fuse from its corresponding contact terminals, and a second, lowered position in which the fuse contacts the terminals.
    Type: Grant
    Filed: August 15, 1996
    Date of Patent: May 12, 1998
    Assignee: Alcoa Fujikura Ltd.
    Inventor: Ivan V. Martinez