Abstract: A printed circuit board is formed with a heat transfer region and at least one via in thermal communication with the region that transfers heat to the at least one region. A chassis is placed in thermal contact with the region so as to receive and dissipate heat from the region. A heat generating component is mounted on the printed circuit board so as to be in thermal communication with the at least one via. Thus, the heat generated by the component is transferred by the via to the region and subsequently dissipated by the chassis via convection.

Abstract: A backpane which receives a plurality of printed circuit boards and the backpane has air holes to allow ventilation.

Abstract: A heat dissipation device includes a heat sink (30), a metal plate (50), and a clip (20). The heat sink has a chassis (36) with thermally conductive material (40) applied thereunder. The metal plate is attached to the material in order to be in thermal contact with the chassis. The metal plate is then directly attached to a CPU (60). The clip is engaged with a socket (70) that supports the CPU, to facilitate the metal plate intimately contacting the CPU. The metal plate prevents the CPU from moving from the socket should the heat dissipation device be accidentally moved or displaced. This reduces any risk of damage to the CPU. In addition, heat generated from the CPU is efficiently removed.

Abstract: A heat sink that dissipates heat from an electronic device. The heat sink comprises a base and one or more fins. The base is copper and is thermally coupled to an integrated circuit that includes a high-powered processor. The fins each include a copper portion and an aluminum portion. The copper portion of the fin is thermally coupled to the base to conduct thermal energy away from the base. The remainder of the fin is formed from aluminum.

Abstract: A snap-in heat sink assembly that has an injection molded one piece frame having a plurality of spring members extending outwardly with protrusions at the free ends thereof. The assembly has a spring located against the frame and an electronic component is located atop of the spring. A heat sink has lateral surfaces with elongated grooves formed along those lateral surfaces. The sink is affixed to the frame by a simple step of inserting the heat sink into the space between the spring members such that the protrusions of the spring members snap into the grooves when the heat sink is in the desired location. By sandwiching the spring between the frame and the electronic component, the spring creates a bias to force the electronic component against the heat sink to assure good conductivity of heat from the electronic component through the heat sink.

Abstract: A switch cabinet (1) comprises a case (2), several modules (3) and a supporting rail (4), the modules (3) being secured on the supporting rail (4). The disclosed switch cabinet (1) is characterised in that it is designed in functional blocks and modules, so that all modules (3) required by a machine and only those modules are mounted in the switch cabinet case (2).

Abstract: A modular spray cooling system 10 for cooling electronic components in enclosures containing electronic components that dissipate heat and therefore require cooling. The modular system is mounted in a sealed enclosure 12 with an inside wall 14. A spray cooling module 26 is detachably mountable within the sealed enclosure 12. The coolant is distributed to a spray manifold card 48 that is provided with nozzles. Localized cooling is accomplished with the use of individual nozzles 17. The spray cooling module 26 atomizes the evaporative coolant through nozzles 22 so that liquid droplets of the coolant are delivered to the electronic components, and cooling of the components occurs upon evaporation.

Abstract: A telecommunications equipment enclosure (10) that more effectively dissipates heat from electronic cards without transferring the heat to adjacent cards and without transferring the heat to air within an enclosed chamber surrounding the cards. The enclosure (10) includes a floor (12) and a plurality of card-receiving sleeves (14) attached to the floor (12). Each of the sleeves (14) defines a separate enclosed cell or holder that is configured for receiving and enclosing a single electronic card. The sleeves (14) are spaced apart to define a plurality of open air channels therebetween for convecting heat away from the sleeves (14) and the cards received therein while preventing heat from transferring from sleeve to sleeve.

Abstract: A power converter enclosure, intended in particular to equip a rail vehicle traction system including power electronic modules comprising one or more power semiconductor components mounted on a substrate, includes a base including a bottom panel with double walls having an inside wall on the side toward the interior of the enclosure in contact with at least one substrate supporting a power component. The bottom panel is extended by at least two lateral panels with double walls whose outside walls are cooled by cooling fins. The two walls of the bottom panel delimit a hollow volume partly filled with a cooling liquid and containing a thermally conductive permeable material providing a thermal bridge between the two walls.

Abstract: A device for dissipating heat produced by circuitry such as the circuitry associated with an optical transponder includes a plurality of heat dissipating regions. Each heat dissipating region includes a heat sink that is thermally coupled with at least one component. Each heat sink is at least partially thermally isolated from other heat sinks to mitigate heat flow from high-power components to heat sensitive components. Further, all of the heat sinks associated with the circuit package are electrically coupled to provide electromagnetic shielding. A thermally insulative and electrically conductive gasket is employed to couple adjacent heat sinks.

Abstract: An assembly for supplying vehicle subsystems associated with an instrument panel. A panel structural architecture includes a forward facing side within which are defined a series of partially recessed and interconnected channels. A junction box is secured or integrally affixed in some fashion to the structural architecture and an electrically communicable network extending from the junction box is likewise secured to surfaces of the panel structural architecture. First selected branches of the network terminate in a plurality of high current connectors extending from first locations. Second selected branches of the network terminate in a plurality of low current connectors extending from further locations. An instrument panel skin is applied over the structural architecture and incorporates electrical subsystems with input connectors matingly engageable with both the high and low current connectors associated with the structural architecture.

Abstract: An electronics enclosure includes a mounting bracket adapted to mount to a support structure, a heat absorption module adapted to mount to the mounting bracket, and a housing to contain electronic equipment. The housing is adapted to mount alternatively to either the mounting bracket or the heat absorption module dependent upon solar loading conditions.

Abstract: Disclosed is a heat sink of a module with a built-in integrated circuit (IC) including a circuit board formed with a plurality of first through holes extending from an upper surface of the circuit board to a lower surface of the circuit board, a metal-attached IC mounted to the lower surface of the circuit board and attached at an upper surface thereof with a metallic member, a first conductive material provided at the upper surface of the circuit board, the first conductive material filling the first through holes so that it is in contact with the metallic member, a module case adapted to receive the circuit board therein while including upper and lower cases made of a metal, and a depressed structure formed at the upper case and adapted to allow the first conductive material on the upper surface of the circuit board to be in contact with the upper case.

Abstract: A retainer device for attaching a heat sink (80) to a CPU (95) includes a retention module (10), a clamp (40), and a crank (70). The retention module has a rectangular base frame (12), and four posts (14, 16, 18, 20) extending upwardly from the base frame. The clamp has two spaced hinge portions (48) pivotably received in two rearmost posts of the retention module. A hook (52) depends from a front of the clamp. The crank has an offset pressing portion (72), two pivot arms (74) extending from opposite ends of the pressing portion, and an operation rod (76) extending perpendicularly from one end of one pivot arm. The pivot arms are pivotably received in two frontmost posts of the retention module. When the operation rod is rotated down toward the heat sink and locked at one rearmost post, the pressing portion resiliently presses the hook of the clamp.

Abstract: A thermally enhanced IC chip package has a dielectric substrate member with conductive circuit patterns on top and bottom surfaces thereof and an opening therethrough. An IC chip having active and inactive sides is received in the opening. The active side of the chip and the top surface of the substrate face to a same direction and electrically connect each other. A thermally and electrically conductive adhesive layer is disposed on the inactive side of the chip and the bottom surface of the substrate in a completely enclosing shape around the opening. A thermally and electrically conductive planar member is attached to the thermally and electrically conductive adhesive layer. A molding material encapsulates the chip, the opening and the top surface of the substrate.

Abstract: Apparatus for holding and securing an electrical module, IC, or other electronic components to a PCB that is easy to use and manipulate. The apparatus utilizes a transitional element to hold the electrical module or IC and then secure itself to the PCB using fasteners or the like. Preferred methods for assembling and using the apparatus are disclosed.

Abstract: A telecommunications equipment enclosure (10) that more effectively dissipates heat from electronic cards without transferring the heat to adjacent cards and without transferring the heat to air within an enclosed chamber surrounding the cards. The enclosure (10) includes a floor (12) and a plurality of card-receiving sleeves (14) attached to the floor (12). Each of the sleeves (14) defines a separate enclosed cell or holder that is configured for receiving and enclosing a single electronic card. The sleeves (14) are spaced apart to define a plurality of open air channels therebetween for convecting heat away from the sleeves (14) and the cards received therein while preventing heat from transferring from sleeve to sleeve.

Abstract: The present application relates to a flexible fan module. The flexible fan module is to utilize the concept of male-female type connection to modulize a fan assembly, thereby not only having a concise mechanism and rapidly dismantling a fan main unit, but also being easily applicable in the number of one or more fan modules to the mechanism of a target device of which heat is desired to be dissipated, such as to the main housing of a personal computer, wherein no other designs of fixing mechanism are needed. The flexible fan module comprises: a fan main unit; a female member for fixing the flexible fan module on the target device; a female connecting member for connecting the female member to the fan main unit; a male member closely fitting into the female member; a handler member, wherein the handler member is connected to the fan main unit by penetrating the male member.

Abstract: The present invention is generally directed grounding an electrical connection to a magnesium cross beam of a motor vehicle. In order to ensure proper grounding, the cross beam is provided with a copper connector. The connector defines a first aperture. An electric circuit is preferably traced on a plastic substrate, where the substrate defines a second aperture. The substrate is placed on top of the cross beam such that the first aperture and the second aperture are aligned with each other. An attaching means such as screws is inserted through the first aperture to the second aperture such that the substrate is attached to the cross beam. In order to prevent the movement of the substrate relative to the cross beam the second aperture is provided with a washer.

Abstract: A heat dissipation assembly includes a heat sink (10), a backplate (30), a plurality of bolts (42) and springs (46), and a PCB (50). The PCB supports a chip (60) thereon and defines a plurality of through holes (52) around the chip. The backplate forms a plurality of posts (36) engaged in the through holes. A plurality of cavities (38) is defined in the post. The heat sink comprises a chassis (12) and defines a plurality of fixing holes (16) through the chassis. The bolts extend through the fixing holes of the heat sink and threadedly engaged in the cavities of the backplate to connect the heat sink to the printed circuit board. The springs are squeezed between the bolts and the chassis of the heat sink, for providing appropriate forces on the heat sink toward the chip.