Patents Examined by Gregory D. Thompson
  • Patent number: 8125779
    Abstract: A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. Each set of modules is independently cooled. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exhausts from a back of the apparatus. A horizontal set of modules is cooled with horizontal front-to-back air flow. When the horizontal set of modules is at the front of the apparatus, a plenum extending exterior to the vertical set of modules allows exhausting horizontally flowing air to the rear of the apparatus. When the horizontal set of modules is at the rear of the apparatus, a plenum extending exterior to the vertical set of modules allows moving air from the front of the apparatus to a chamber holding the horizontal modules.
    Type: Grant
    Filed: September 23, 2010
    Date of Patent: February 28, 2012
    Assignee: Juniper Networks, Inc.
    Inventors: Gunes Aybay, Sindhu Pradeep, Jean-Marc Frailong, David J. Lima
  • Patent number: 8120912
    Abstract: A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. Each set of modules is independently cooled. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exhausts from a back of the apparatus. A horizontal set of modules is cooled with horizontal front-to-back air flow. When the horizontal set of modules is at the front of the apparatus, a plenum extending exterior to the vertical set of modules allows exhausting horizontally flowing air to the rear of the apparatus. When the horizontal set of modules is at the rear of the apparatus, a plenum extending exterior to the vertical set of modules allows moving air from the front of the apparatus to a chamber holding the horizontal modules.
    Type: Grant
    Filed: September 23, 2010
    Date of Patent: February 21, 2012
    Assignee: Juniper Networks, Inc.
    Inventors: Gunes Aybay, Sindhu Pradeep, Jean-Marc Frailong, David J. Lima
  • Patent number: 8094452
    Abstract: A facility is described that includes one or more enclosures defining an interior space, a plurality of power taps, a plurality of coolant supply taps, and a plurality of coolant return taps. A flow capacity of the supply taps and a flow capacity of the return taps can be approximately equal over a local area of the interior space. The plurality of power taps, the plurality of supply taps, and the plurality of return taps can be divided into a plurality of zones, with taps of each zone are configured to be controllably coupled to a power source or a coolant source independently of the taps of other zones. The taps can be positioned along paths, and paths of the power taps can be spaced from associated proximate paths of supply and return taps by a substantially uniform distance along a substantial length of the first path.
    Type: Grant
    Filed: June 23, 2008
    Date of Patent: January 10, 2012
    Assignee: Exaflop LLC
    Inventors: Andrew B. Carlson, William Hamburgen, Jimmy Clidaras, Donald L. Beaty
  • Patent number: 8064224
    Abstract: A microelectronic package comprises a substrate (110), a silicon patch (120) embedded in the substrate, a first interconnect structure (131) at a first location of the silicon patch and a second interconnect structure (132) at a second location of the silicon patch, and an electrically conductive line (150) in the silicon patch connecting the first interconnect structure and the second interconnect structure to each other.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: November 22, 2011
    Assignee: Intel Corporation
    Inventors: Ravi Mahajan, Sandeep Sane
  • Patent number: 8064200
    Abstract: Heat dissipating electronic components and circuitry in a communication chassis are cooled by moving air at least through a midplane, between two groups of channels that are laterally oriented relative to one another. In an illustrative embodiment, channels of one group are oriented vertically while channels of another group are oriented horizontally. Each channel, regardless of whether it is vertical or horizontal, is defined by space in the chassis between adjacent circuit boards. Circuit boards on one side of the midplane are electrically connected to circuit boards on the other side of the midplane by orthogonal connectors on the midplane. The midplane additionally has openings that enable movement of air between vertically-oriented channels and horizontally-oriented channels. Circuit boards of the two orientations are cooled by increasing air pressure in vertically-oriented channels or by decreasing air pressure in horizontally-oriented channels or both, depending on the embodiment.
    Type: Grant
    Filed: September 14, 2008
    Date of Patent: November 22, 2011
    Assignee: Cyan Optics, Inc.
    Inventors: Stephen J. West, Scott Pradels, Stephen S. Greer
  • Patent number: 8004826
    Abstract: The invention relates to an electrical switchgear comprising at least one panel, especially for low voltage, a device compartment especially for receiving inserts, switching devices, control devices, and similar, a busbar compartment in which the busbars are accommodated in a horizontal direction, a multi-terminal busbar compartment in which the multi-terminal busbars extend vertically, and at least one wire compartment. The wire compartment for control wires and signal wires is located on one side of the panel while the wire compartment for power wires is placed on the other side of the panel.
    Type: Grant
    Filed: March 25, 2006
    Date of Patent: August 23, 2011
    Assignee: ABB Patent GmbH
    Inventors: Hans-Peter Merkel, Gunnar Zank
  • Patent number: 8004837
    Abstract: It is possible to provide a small-size and light-weight control device having a structure which prevents detaching of a board even when an external shock is applied without using a screwed connection. The control device is formed by a case (1) including at least one board (2, 3), a radiator (5), and a protection cover (4). The case (1) includes at least one latch portion (7, 8) in an upper part or a lower part of a board support frame (16).
    Type: Grant
    Filed: September 28, 2007
    Date of Patent: August 23, 2011
    Assignee: Kabushiki Kaisha Yaskawa Denki
    Inventor: Akira Soma
  • Patent number: 7990713
    Abstract: A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a centrifugal fan located adjacent to the fin unit, a heat-conducting board attached to the electronic component and a heat pipe thermally connecting the fin unit and the electronic component. An engaging portion protrudes upwardly from a top face of the heat-conducting board. The heat pipe has an evaporating section extending through the engaging portion and being fixed to the top face of the heat-conducting board, and a condensing section attached to the fin unit.
    Type: Grant
    Filed: July 10, 2009
    Date of Patent: August 2, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Xin-Lei Liu, Jin-Biao Liu, Hong-Cheng Yang, Chun-Chi Chen
  • Patent number: 7990687
    Abstract: A gas-insulated switchgear includes an electric conductor that is housed in a vessel that is sealed and filled with insulating gas, a current transformer that is housed in the vessel, which includes a coil wound around the electric conductor, an electric-field relaxing shield that is arranged in the vessel at a radially inward position relative to an inner side of the coil, and a dielectric insulating member that is arranged on an end portion of the electric-field relaxing shield.
    Type: Grant
    Filed: October 7, 2009
    Date of Patent: August 2, 2011
    Assignee: Mitsubishi Electric Corporation
    Inventors: Manabu Yoshimura, Takao Tsurimoto, Osamu Kisanuki, Yoshinori Shimizu
  • Patent number: 7990707
    Abstract: An electronic device includes a fan including a frame, and an enclosure. The frame includes a plurality of mounting holes respectively positioned in a plurality of diagonal corners of the frame. The enclosure includes a plurality of sidewalls and a plurality of fixing members to fix the fan in the enclosure. Each of the plurality of fixing members projects from an inner surface of one of the plurality of sidewalls and is integrally formed with the sidewall. Each of the plurality of fixing members includes a clasping portion, and a cushioning portion between the clasping portion and the sidewall and having an angled shape. The plurality of cushioning portions are corresponding to the plurality of mounting holes and positioned between the fan and the sidewall.
    Type: Grant
    Filed: November 4, 2009
    Date of Patent: August 2, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Tzu-Hsiu Hung
  • Patent number: 7990710
    Abstract: A data center inside a shipping container having a lower plenum and an upper plenum in its interior. Heated air in the upper plenum exits therefrom into a plurality of heat exchangers adjacent thereto. Air cooled by the heat exchangers travels toward and enters the lower plenum. The data center includes a plurality of carriages each having an equipment receiving portion located between an open bottom portion in open communication with the lower plenum, and an open top portion in open communication with the upper plenum. Fans inside each of the carriages draw cooled air up from the lower plenum into the open bottom portion of the carriage, blow the cooled air up through the equipment receiving portion thereby cooling any computing equipment received therein, and vent the cooled air through the open top portion into the upper plenum.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: August 2, 2011
    Assignee: VS Acquisition Co. LLC
    Inventors: Stephen V. R. Hellriegel, Mario L. Jaena, Brian D. Koblenz, David Louis Anderson, David Driggers, Hampton Walker Haddock, Jr.
  • Patent number: 7986529
    Abstract: An apparatus includes a base plate, a circuit board mounted on the base plate, and a supporting bracket adapted to support a heat dissipating device. A securing post protrudes from the base plate and defines a securing groove. The supporting bracket is disposed above the circuit board. Two elastic securing claws extend from the supporting bracket. The securing post is wrapped by the two elastic securing claws, and the securing claws engage the securing groove of the securing post.
    Type: Grant
    Filed: June 11, 2009
    Date of Patent: July 26, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Sheng-Hung Lee, Li-Ping Chen
  • Patent number: 7983039
    Abstract: A reversible airflow fan tray assembly is provided for an electronic device. The fan tray assembly includes a face plate to be removably mounted to the electronic device and a fan tray cassette to be removably mounted to the face plate in multiple orientations. The fan tray cassette includes a fan unit to provide airflow through the electronic device, and an interconnection board to provide an electrical connection between the fan unit and the electronic device, where the interconnection board mates with a connector on the electronic device when the fan tray cassette is in any of the multiple orientations. The interconnection board provides an airflow direction indication to the electronic device for a current orientation of the multiple orientations.
    Type: Grant
    Filed: June 25, 2009
    Date of Patent: July 19, 2011
    Assignee: Juniper Networks, Inc.
    Inventors: Tri Luong Nguyen, Hogan Lew
  • Patent number: 7978460
    Abstract: A terminal box for a use with a generator set is provided. The terminal box may have a customer connection, a first housing piece configured to be mounted proximate a generator of the generator set, and at least one cable housed within the first housing piece to electrically connect the generator with the customer connection. The terminal box may also have a second housing piece mounted to the first housing piece distal the generator, and at least one control component housed within the second housing piece to regulate a characteristic of electrical power produced by the generator.
    Type: Grant
    Filed: October 24, 2008
    Date of Patent: July 12, 2011
    Assignee: Caterpillar Inc.
    Inventor: James E. Dykes
  • Patent number: 7978474
    Abstract: Embodiments of a computer system are described. This computer system includes a power source that is coupled to a heat pipe, where the power source includes an integrated circuit. This heat pipe may contain a liquid coolant that has a density greater than a first pre-determined value at room temperature. A pump is coupled to the heat pipe is configured to circulate the liquid coolant through the heat pipe. Furthermore, a heat exchanger coupled to the heat pipe is configured to transfer heat from the heat pipe to an environment external to the computer system.
    Type: Grant
    Filed: May 22, 2007
    Date of Patent: July 12, 2011
    Assignee: Apple Inc.
    Inventor: Ihab A. Ali
  • Patent number: 7978471
    Abstract: An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.
    Type: Grant
    Filed: February 19, 2009
    Date of Patent: July 12, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Keisuke Horiuchi, Toshiya Satoh, Hideki Miyazaki
  • Patent number: 7965505
    Abstract: An airflow guiding cover includes a first airflow guiding portion, a second airflow guiding portion connected to an end of the first airflow guiding portion, and a third airflow guiding portion connected to an opposite end of the first airflow guiding portion. The first airflow guiding portion is collapsible and extendable along a first direction and flexible along a second direction perpendicular to the first direction, to enable the airflow guiding cover to fit for different system layout.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: June 21, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Wen-Tang Peng, Xin-Hu Gong
  • Patent number: 7965512
    Abstract: A heat-dissipation module and an electronic device including a first heat source and the heat-dissipation module are provided. The heat-dissipation module includes a first heat pipe, a second heat pipe, a first set of heat fins, a second set of heat fins and a fan. One end of the first heat pipe and one end of the second heat pipe are respectively in contact with the first heat source. The first set of heat fins and the second set of heat fins are, respectively, in contact with the other end of the first heat pipe and the other end of the second heat pipe. Heat generated by the first heat source is transferred to the two sets of heat fins through the first and the second heat pipes. The fan is used for providing an air-flow blowing toward the two sets of heat fins to dissipate heat.
    Type: Grant
    Filed: May 15, 2009
    Date of Patent: June 21, 2011
    Assignee: Quanta Computer Inc.
    Inventors: Lung-Chi Huang, Kuang-Hua Lin, Feng-Lin Hsu
  • Patent number: 7961465
    Abstract: A system for cooling processor assembly is disclosed which comprises printed circuit boards (PCB) with a plurality of heat emitting electronic components, and a housing for each PCB with a heat sink covering at least partly the heat emitting electronic components. The housing comprises a base portion to which are transferred heat emitted by the electronic components. Furthermore, the system for cooling processor comprises a cooling plate on which are fixed in series the different PCBs by directly positioning the base portion of the housings onto the cooling plate. The housings for each PCB system include at their base portions clamps to be inserted into corresponding guiding holes of the cooling plate when a PCB together with its housing is positioned onto the cooling plate at a specific therefor dedicated place defined by the guiding holes.
    Type: Grant
    Filed: July 14, 2009
    Date of Patent: June 14, 2011
    Assignee: International Business Machines Corporation
    Inventors: Gottfried A. Goldrian, Manfred Ries
  • Patent number: 7957145
    Abstract: An electric power converter for a vehicle, including a semiconductor element from which a motor drive current is output, a drive circuit that drives the semiconductor element, a control circuit that controls the drive circuit, a capacitor that smooths a DC current to be input to the semiconductor element, a container housing the semiconductor element, the drive circuit, the control circuit and the capacitor, a refrigerant retained in a state of vapor-liquid two-phase equilibrium within the container, and a heat exchanger unit that condenses the refrigerant in a vapor phase to be a liquid phase and exchanges heat with outside, wherein the semiconductor element, the drive circuit, the control circuit and the capacitor are disposed in a positional arrangement that will leave the semiconductor element, the drive circuit, the control circuit and the capacitor immersed in the refrigerant as the electric power converter is installed in the vehicle, and the heat exchanger unit is disposed at a side of a wall of the c
    Type: Grant
    Filed: August 17, 2010
    Date of Patent: June 7, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Osamu Suzuki, Sunao Funakoshi, Keisuke Horiuchi, Atsuo Nishihara, Yosuke Yasuda