Patents Examined by Guillermo J Egoavil
  • Patent number: 11939461
    Abstract: A non-ohmic composition including a base elastomer and a plurality of non-ohmic particles, wherein, in a case of comparing volume resistivities ? for the non-ohmic composition within a range of E?Eth for the non-ohmic composition not elongated, the E being an electric field strength applied to the non-ohmic composition, the ? being the volume resistivity of the non-ohmic composition, and the Eth being a threshold electric field strength at a point where an absolute value of a variation in a slope of log ? with respect to log E is maximum, the volume resistivity ? for the non-ohmic composition uniaxially elongated by 50% is 50 times or less the volume resistivity ? for the non-ohmic composition not elongated.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: March 26, 2024
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Shuhei Yasuda, Takanori Yamazaki, Shinya Nishikawa
  • Patent number: 11943865
    Abstract: A transparent conductive film (TCF) and methods for creating the TCF. The TCF includes a substrate having a surface, a metal mesh layer over at least a portion of the surface of the substrate, and a conductive layer over the metal mesh layer. The conductive layer includes carbon nanotubes and a binder.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: March 26, 2024
    Assignee: Chasm Advanced Materials, Inc.
    Inventors: Richard P. Heroux, Timothy Alan Turner, David Joseph Arthur, Sean Patrick Arthur
  • Patent number: 11942658
    Abstract: A battery system for an electric vehicle includes a fixed cover, and a removable cover arranged over battery modules and a high voltage distribution system. The battery system includes a busbar arranged at least partially over a region of the battery modules and under the removable cover. The busbar includes a fixed section and a movable section, or a hinge, such that the busbar can be repositioned out of the way. The support tray includes a link between the fixed and movable sections. Floating fasteners, allowing at least one of radial float and axial float are used to secure the link to the support tray, thereby avoiding safety hazards and reducing the potential for short circuits in high voltage distribution systems or conductors thereof. The floating fasteners include a head, a neck, an engagement section, and a washer, which prevent removal from a component once installed.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: March 26, 2024
    Assignee: Rivian IP Holdings, LLC
    Inventors: Ehsan Baseri, Kyle Butterfield, Luke Rayment Morrow, Akshay Kishor Murkute, Jonathan Verghese
  • Patent number: 11942241
    Abstract: An improved electric cable is disclosed herein. The resistance of the electric cable of the present disclosure is surprisingly decreased despite a reduction in the cross-sectional area of the conductor when at least one metal slug is positioned at an end of the cable. Conductor wires, which may or may not be individually insulated, may extend around a metal slug or through an aperture of the slug. In combination with at least one metal slug, the cross-sectional area of individual wires or the amount of wires within a stranded wire cable may be substantially reduced without seeing an expected proportionate increase in electrical resistance, and surprisingly, a decrease in resistance may be observed.
    Type: Grant
    Filed: May 20, 2021
    Date of Patent: March 26, 2024
    Inventor: Lubomir Dostal
  • Patent number: 11937364
    Abstract: A highly heat-dissipating flexible printed circuit board (GFPCB) efficiently emits heat transferred from a heat source such as an LED to the flexible printed circuit board. The highly heat-dissipating flexible printed circuit board comprises: a flexible board layer which is formed in a flexibly bendable thin-film form by bonding a polyimide (PI) film to the lower side of a copper (Cu) film using an adhesive and has a heat element installed on the upper side thereof; and a heat dissipation layer which is formed in a thin-film form by coating any one of graphitic carbon and a graphite powder binder on the upper side of an aluminum (Al) film and is bonded to the lower side of the flexible board layer using a pressure sensitive adhesive (PSA) to receive heat generated and transferred from the heat element and emit the heat to the outside.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: March 19, 2024
    Assignees: SOLUETA
    Inventor: Seong Hwan Jung
  • Patent number: 11929354
    Abstract: A power semiconductor module includes a half-bridge circuit having a first power semiconductor element and a second power semiconductor element that are connected in series with each other. The power semiconductor module also includes first to third external terminals, a first wiring member that connects a high-potential-side main electrode of the first power semiconductor element to the first external terminal, a second wiring member that connects a low-potential-side main electrode of the second power semiconductor element to the second external terminal, a third wiring member that connects an output of the half-bridge circuit to a third external terminal, and at least one of a first corrosion sensor disposed in an installation environment of the first wiring member, a second corrosion sensor disposed in an installation environment of the second wiring member, or a third corrosion sensor disposed in an installation environment of the third wiring member.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: March 12, 2024
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Masanari Fujii
  • Patent number: 11923128
    Abstract: An electronic component includes an insulating layer, a low voltage conductor pattern formed inside the insulating layer, a high voltage conductor pattern formed inside the insulating layer such as to face the low voltage conductor pattern in an up/down direction, and a withstand voltage enhancement structure of conductive property formed inside the insulating layer and along the high voltage conductor pattern such as to protrude further outside than the low voltage conductor pattern in plan view.
    Type: Grant
    Filed: December 6, 2022
    Date of Patent: March 5, 2024
    Assignee: ROHM CO., LTD.
    Inventors: Taketoshi Tanaka, Kosei Osada, Masahiko Arimura
  • Patent number: 11909192
    Abstract: An electronic module is provided with a housing with an inlet to conduct alternating current (AC) power and an outlet to conduct direct current (DC) power to charge a vehicle battery, the housing defining a cavity. A circuit board assembly is supported within the cavity to convert the AC power to DC power. At least two power distribution wires are connected between the circuit board assembly and the outlet. A base is supported by the housing and extends between the at least two power distribution wires and the circuit board assembly to shield the DC power from electromagnetic interference generated by the circuit board assembly. A plurality of walls extend transversely from the base and are spaced apart from each other to define at least two channels, each channel is sized to receive one of the at least two power distribution wires.
    Type: Grant
    Filed: June 8, 2021
    Date of Patent: February 20, 2024
    Assignee: LEAR CORPORATION
    Inventors: Parminder Brar, Michael Scott Duco, Rutunj Rai, Jared Pieknik
  • Patent number: 11901130
    Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Soo Park, Myung Jun Park, Hyun Hee Gu, Bum Soo Kim, Yeon Song Kang, Duk Hyun Chun, Chung Eun Lee
  • Patent number: 11888303
    Abstract: A busbar connection system comprises a plate member formed of a first material having a higher tensile strength than second and third materials of first and second busbars, respectively, and defining first and second apertures and first and second stud members securely inserted through the first and second apertures of the plate member, respectively, the first and second stud members being configured to be securely inserted through first and second apertures, respectively, in each of the first and second busbars, wherein the first and second stud members mitigate rotational movement between the first and second busbars when connected.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: January 30, 2024
    Assignee: APTIV TECHNOLOGIES LIMITED
    Inventors: Andrew Bohan, Jonathan D. Weidner, Keith B. Adkins, Nicholas A. Durse, Adam Wolfgang
  • Patent number: 11885068
    Abstract: The present invention discloses an encapsulated duct cable with identification tags and a manufacturing method thereof. The logging encapsulated duct cable comprises an encapsulation layer. The cross section of the encapsulation layer is polygonal or arc-shaped. At least one cable protective tube and at least one oil-liquid tube are arranged in the encapsulation layer. A cable is arranged in the cable protective tube. Identification tags with different color identifiers are respectively arranged on one side of the cable protective tube and one side of the oil-liquid tube in one to one correspondence. The manufacturing method of the logging encapsulated duct cable mainly comprises three steps of machining the cable protective tube and paving the cable pavement, machining the oil-liquid tube, and machining the encapsulation layer. The present invention has double functions of conveying the oil and the liquid and transmitting the data.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: January 30, 2024
    Inventors: Jianliang Duan, Jian Dong
  • Patent number: 11889639
    Abstract: A circuit board cover having a housing having a first surface, a perimeter edge, a housing cavity partially defined by the first surface and the perimeter edge, a skirt extending from the perimeter edge away from the first surface in a first direction to partially define the housing cavity, and a plurality of ports disposed on the first surface. The housing cavity can be operable to house a printed circuit board. Each of the plurality of ports can include (i) a sidewall extending away from the first surface in a second direction opposite to the first direction, (ii) a port cavity partially defined by the sidewall, and (iii) one or more terminals disposed at least partially within the port cavity.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: January 30, 2024
    Assignee: Peterson Manufacturing Company
    Inventors: David S. Armacost, Cory D. Adams
  • Patent number: 11881348
    Abstract: An isolated switch-mode power supply includes at least one input, at least one output, and a power circuit coupled between the at least one input and the at least one output for converting an input voltage or current to an output voltage or current. The power circuit includes a transformer having one or more primary windings, one or more secondary windings, an electrical insulator, and a core magnetically coupling the one or more primary windings and the one or more secondary windings. Upper portions of the primary and secondary windings are covered with the electrical insulator. Other example switchmode power supplies, transformers, magnetic chokes and methods are also disclosed.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: January 23, 2024
    Assignee: Astec International Limited
    Inventor: Alfredo Belmonte Grueso
  • Patent number: 11875913
    Abstract: The present invention relates to an electrical conductor (1) having an electrically conductive material (2) comprising graphene and/or carbon nanotubes and a joint (3, 4), wherein a metal coating (6) is provided on the electrically conductive material (2) of the electrical conductor (1) at the joint (3, 4) for integrally joining the electrical conductor (1) to a metal conductor element, the metal coating (6) being in direct contact with the electrically conductive material (2), characterized in that the metal coating (6) of the joint (3, 4) comprises a metal that forms carbides in a boundary layer of the coating (6) by reaction of the metal of the coating (6) with the carbon of the electrically conductive material (2).
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: January 16, 2024
    Assignee: Robert Bosch GmbH
    Inventors: Martin Koehne, Felix Stewing, Raimund Bohl
  • Patent number: 11871510
    Abstract: A conductive pattern has been disclosed. The conductive pattern includes a pair of conductive traces. Each of the conductive traces comprises a linear portion and a terminal portion. The terminal portions are arranged adjacent to each other and comprises a pair of circular arc profile with a pair of complementary notches facing toward each other.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: January 9, 2024
    Assignee: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD.
    Inventors: Hou-Yuan Chou, Yi-Chih Wu, Feng-Hua Deng, Ming-Fang Chen
  • Patent number: 11856700
    Abstract: A capacitor module horizontally mounted on a PCB and including a case including a first side surface, an opposing second side, a first electrode pad and a second electrode pad disposed at the first side surface, and a third electrode pad disposed at the second side surface, and an electrolytic capacitor including a dielectric extending in a first horizontal direction, a first electrode contacting the first electrode pad and a second electrode contacting the second electrode pad, wherein the first electrode pad is spaced apart from second electrode pad in a second horizontal direction.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: December 26, 2023
    Inventors: Chunghyun Ryu, Byungok Kang, Su-Yong An, Jongwoo Jang, Insub Kwak, Teck Su Oh, Geurim Jung, Sang-Ho Park, Sung-Ki Lee
  • Patent number: 11848117
    Abstract: Highly uniform and thin silver nanowires are described having average diameters below 20 nm and a small standard deviation of the diameters. The silver nanowires have a high aspect ratio. The silver nanowires can be characterized by a small number of nanowires having a diameter greater than 18 nm as well as with a blue shifted narrow absorption spectrum in a dilute solution. Methods are described to allow for the synthesis of the narrow uniform silver nanowires. Transparent conductive films formed from the thin, uniform silver nanowires can have very low levels of haze and low values of ?L*, the diffusive luminosity, such that the transparent conductive films can provide little alteration of the appearance of a black background.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: December 19, 2023
    Assignee: C3 Nano, Inc.
    Inventors: Yongxing Hu, Ying-Syi Li, Xiqiang Yang, Jing Shun Ang, Ajay Virkar
  • Patent number: 11848143
    Abstract: An electronic device and a method for manufacturing an electronic device are provided. The electronic device includes an inductor. The inductor includes a plurality of line portions and a plurality of plate portions connected to the plurality of line portions. The line portions and the plate portions form a coil concentric to a horizontal axis.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: December 19, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yunghsun Chen, Huang-Hsien Chang, Shao Hsuan Chuang
  • Patent number: 11837859
    Abstract: The present disclosure provides improved electrical box and conduit support plates that allow for central mounting of an electrical box to a support plate and mounting of electrical conduits for suspended installations in various orientations. The support plate includes a body having a plurality of built-in offsets, a plurality of built-in hanger tabs, and a plurality of clip mounting apertures that may be arranged as pairs. Each built-in offset preferably has two side walls extending from the body and a mounting arm between the side walls. Each mounting arm includes a plurality of clamp mounting apertures used to attach a conduit clamp to the mounting arm. Each of the plurality of built-in hanger tabs are preferably bendable relative to the body. Box and conduit support kits that includes a body and a plurality of hanger clips are also provided.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: December 5, 2023
    Assignee: Hubbell Incorporated
    Inventors: Victor Beristany, Steven James Johnson
  • Patent number: 11837380
    Abstract: Provided are: a superconducting wire rod in which the non-uniform deformation of the shape of an MgB2 core material has been controlled; a superconducting coil; a magnetic generator; and a method for producing a superconducting wire rod. A superconducting wire rod (100A) according to the present invention comprises: a center material (106) of which at least the outer circumferential surface is formed of a metal that does not react with Mg; a plurality of single-core wires (103) disposed around the center material (106), each of the single-core wires having an MgB2 superconductor core material (101) coated with a first coating material (102) made of a metal that does not react with Mg; and an outer shell material (105) disposed outside the plurality of single-core wires (103), wherein at least the inner circumferential surface of the outer shell material (105) is formed of a metal that does not react with Mg.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: December 5, 2023
    Assignee: HITACHI, LTD.
    Inventors: Takaaki Suzuki, Hideki Tanaka, Motomune Kodama