Abstract: A printed circuit board (PCB) assembly with a first PCB connected to a second PCB with a flexible interconnect and a vapor chamber for positioning between the first PCB and the second PCB. The flexible interconnect allows the PCB assembly to be in an open configuration or a closed configuration. In the closed configuration, the vapor chamber is between the two PCBs. The flexible interconnect supplies a portion of the electric power from the first PCB to the second PCB and a power connector supplies a second portion of the electric power. Grounding springs allow localized grounding of the PCB assembly. The flexible interconnect, the power connector and the grounding springs provide structural support for the second PCB. The vapor chamber may be longer than the PCBs to draw heat away from components and the flexible interconnect may be used as an airflow guide for improving airflow over components.

Abstract: A multilayer electronic component that includes a plurality of stacked dielectric layers, each of the plurality of stacked dielectric layers having a plurality of crystal grains, at least some of the plurality of crystal grains having a trap portion therein, and at least one element selected from the group consisting of Ni, Cu, Pt, Sn, Pd and Ag is present locally in the trap portion; and a plurality of internal electrode layers arranged between adjacent dielectric layers of the plurality of stacked dielectric layers.

Abstract: A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.

Abstract: A multilayer ceramic capacitor includes a ceramic base body including ceramic layers and internal electrode layers, which are stacked on each other, and a pair of external electrodes provided on the end surfaces of the ceramic base body and electrically connected to the internal electrode layers. Each of the external electrodes includes an underlying electrode layer and a resin external electrode layer stacked on the underlying electrode layer. The resin external electrode layer includes a thermosetting resin, a metal powder, and an alkyl-based silane coupling agent.

Abstract: An electronic device includes: a main body to which a rotating shaft is rotatably connected; a driving motor, provided on the main body, connected to the rotating shaft and configured to drive the rotating shaft to rotate; a flexible display screen, having a first side edge connected to the rotating shaft and capable of completely rolling the flexible display screen onto the rotating shaft or expanding the rolled-up flexible display screen, under a reciprocating rotation of the rotating shaft; and a sucking apparatus provided on the main body and configured to suck the electronic device onto a surface of a carrier.

Abstract: A coil component includes a body having one surface and the other surface and a plurality of wall surfaces, first and second insulating substrates spaced apart from each other, first and second recesses disposed in both end surfaces of the body and extending to one surface of the body, first and second coil portions disposed on the first and second insulating substrates, one ends and the other ends of the first and second coil portions being exposed to the first and second recesses, first and second external electrodes disposed along an inner surface of the first recess and one surface of the body and connected to one ends of the first and second coil portions, and third and fourth external electrodes disposed along an inner surface of the second recess and one surface of the body and connected to the other ends of the first and second coil portions.

Abstract: An isolated switch-mode power supply includes at least one input, at least one output, and a power circuit coupled between the at least one input and the at least one output for converting an input voltage or current to an output voltage or current. The power circuit includes a transformer having one or more primary windings, one or more secondary windings, an electrical insulator, and a core magnetically coupling the one or more primary windings and the one or more secondary windings. Upper portions of the primary and secondary windings are covered with the electrical insulator. Other example switchmode power supplies, transformers, magnetic chokes and methods are also disclosed.

Abstract: A power apparatus includes a first power bus bar provided at a first power part, a second power bus bar provided at a second power part coupled to the first power part while communicating internally with the first power part, the second power bus bar being fastened to the first power bus bar, a first interlock bus bar provided at the first power part while being connected to an interlock terminal of a controller disposed within the first power part, a second interlock bus bar provided at the second power part while being fastened to the first interlock bus bar, and a safety cover fastened to a fastening portion between the first interlock bus bar and the second interlock bus bar while covering a fastening portion between the first power bus bar and the second power bus bar.

Abstract: A multilayer ceramic capacitor includes a capacitive element including a ceramic layer, a first internal electrode layer, and a second internal electrode layer, the capacitive element including a first and second principal surfaces, first and second side surfaces, and first and second end surfaces. The first and second internal electrode layers respectively extend to the first and second end surfaces, at least a portion of each of the first and second end surfaces are covered with a conductor layer, a portion of the conductor layer is covered with an insulating portion, at least a portion of the conductor layer and at least a portion of the insulating portion are covered with the underlayer external electrode layer when viewed from the first end surface and the second end surface, and at least a portion of the underlayer external electrode layer is covered with a plating layer.

Abstract: A multilayer electronic component that includes a plurality of stacked dielectric layers, each of the plurality of stacked dielectric layers having a plurality of crystal grains, at least some of the plurality of crystal grains having a trap portion therein, and at least one element selected from the group consisting of Ni, Cu, Pt, Sn, Pd and Ag is present locally in the trap portion; and a plurality of internal electrode layers arranged between adjacent dielectric layers of the plurality of stacked dielectric layers.

Abstract: The present invention provides a dielectric composition having high relative permittivity and insulation resistance at high temperature. The dielectric composition includes a main component expressed by a compositional formula (Sr1-x, Cax)m(Ti1-yHfy)O3-?N?, in which 0<x?0.15, 0<y?0.15, 0.90?m?1.15, and 0<??0.05 are satisfied.

Abstract: An electronic component includes an insulating layer, a low voltage conductor pattern formed inside the insulating layer, a high voltage conductor pattern formed inside the insulating layer such as to face the low voltage conductor pattern in an up/down direction, and a withstand voltage enhancement structure of conductive property formed inside the insulating layer and along the high voltage conductor pattern such as to protrude further outside than the low voltage conductor pattern in plan view.

Abstract: An electronic device includes a fork structure having a pair of arms disposed in spaced relation and defining an open-ended channel therebetween. A surface of channel defines a seat opposite the open end. The channel has a width W1 at its narrowest section. A rigid wire of an electrical component is disposed in the channel generally adjacent to the seat. The wire has a width W2 that is greater than the width W1 so surfaces of the channel at the narrowest section defined by width W1 interfere with the wire, preventing the wire from moving towards the open end of the channel. The pair of arms are constructed and arranged to be moved toward each other so as to crimp the wire to the fork structure.

Abstract: An infrared stealth cloth includes a cloth substrate and an infrared light absorber located on the cloth substrate. The infrared light absorber includes a first drawn carbon nanotube film, a second drawn carbon nanotube film, and a third drawn carbon nanotube film stacked on each other. The first drawn carbon nanotube film includes a plurality of first carbon nanotubes substantially extending along a first direction. The second drawn carbon nanotube film includes a plurality of second carbon nanotubes substantially extending along a second direction. The third drawn carbon nanotube film includes a plurality of third carbon nanotubes substantially extending along a third direction. The first direction and the second direction form an angle of about 42 degrees to about 48 degrees, and the first direction and the third direction form an angle of about 84 degrees to about 96 degrees.

Abstract: A multi-layer ceramic capacitor includes: a first region including a polycrystal including, as a main component, crystal grains free from intragranular pores; a second region that includes a polycrystal including, as a main component, crystal grains including intragranular pores and includes a higher content of silicon than a content of silicon in the first region; a capacitance forming unit including ceramic layers laminated along a first direction, and internal electrodes disposed between the ceramic layers; and a protective portion including a cover that covers the capacitance forming unit and constitutes a main surface facing in the first direction, a side margin constituting a side surface facing in a second direction orthogonal to the first direction, and a ridge constituting a connection portion, the connection portion connecting the main surface and the side surface to each other. The ceramic layers include the first region. The ridge includes the second region.

Abstract: Provided is a semiconductor device capable of suppressing increase in size of a package and adjusting an amount of negative feedback. A power module as a semiconductor device includes an IGBT which is a switching element and a free wheel diode (FWD) parallelly connected to the switching element. The IGBT has, on a surface thereof, an emitter electrode and a gate electrode of the IGBT and a conductive pattern insulated from the emitter electrode and the gate electrode. The FWD has, on a surface thereof, an anode electrode of the FWD and a conductive pattern insulated from the anode electrode.

Abstract: The present disclosure relates to a device for reading from and/or writing to a removable storage card. The device can comprise a housing including a wall defining a housing opening sized to receive a removable storage card. The device can also comprise a thermal management system attached to at least a part of the wall of the housing. Additionally, the device can comprise a biasing mechanism interoperable with the housing and configured to bias a card surface of the removable storage card into thermal communication with the thermal management system in response to insertion of the removable storage card into the housing opening. In some aspects, the biasing mechanism includes one or more elastic members configured to apply a biasing force to the removable storage card in response to the insertion of the removable storage card into the housing opening.

Abstract: A multilayer electronic component that includes a plurality of stacked dielectric layers, each of the plurality of stacked dielectric layers having a plurality of crystal grains, at least some of the plurality of crystal grains having a trap portion therein, and at least one element selected from the group consisting of Ni, Cu, Pt, Sn, Pd and Ag is present locally in the trap portion; and a plurality of internal electrode layers arranged between adjacent dielectric layers of the plurality of stacked dielectric layers.

Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.

Abstract: An electronic component has capacitor chips where terminal electrodes are formed on both end surfaces, individual metal terminals connected to the terminal electrodes, an insulation case accommodating the capacitor chips, and a connecting portion interconnecting a plurality of the insulation cases.