Patents Examined by Guillermo J Egoavil
  • Patent number: 11177584
    Abstract: A female welding lead connector including a safety cover hingedly connected to a main body of the female welding lead connector. The safety cover preferably includes a fastener for fastening the cover to a closed position, shielding a female welding lead receptacle inside the main body of the female welding lead connector.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: November 16, 2021
    Assignee: Alpha/Omega Energy Solutions, LLC
    Inventors: Bradley Lance Pearman, Kenny Lavelle Miller
  • Patent number: 11171469
    Abstract: The invention relates to a housing having at least one current passage that is impervious to high pressure acting from the exterior, e.g. of at least 1000 bar, e.g. up to 8000 bar. The housing has a first housing part and a second housing part that by spaced-apart bearing surfaces that are facing one another, between which at least one insulator is arranged, with the at least one insulator imperviously encompass an inner volume. The housing is opened easily by spacing apart the first housing part from the second one. Generally, the housing parts are electrically insulated from one another by the insulator.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: November 9, 2021
    Assignee: DEUTSCHES INSTITUT FÜR LEBENSMITTELTECHNIK E.V.
    Inventor: Bernhard Hukelmann
  • Patent number: 11158457
    Abstract: A dielectric ceramic composition includes, as a main component, a perovskite compound containing Sr and Zr and may contain Ca and/or Ti, further contains Li and Si, and may contain Mn. When a total content of Zr and Ti is 100 parts by mol, a total content (100×m) of parts by mol of Sr and Ca is 0.8?m?1.3, a content a of parts by mol of Mn is 0?a?10, a content b of parts by mol of Li is 5?b?15, a content c of parts by mol of Si is 20?c?40, a molar ratio x of Ca/(Sr+Ca) is 0?x?0.8, and a molar ratio y of Ti/(Zr+Ti) is 0?y?0.5.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: October 26, 2021
    Assignee: MURATA MANUFACTURING COMPANY, LTD.
    Inventors: Yasuko Ooe, Tatsuya Izumi, Tomotaka Hirata
  • Patent number: 11152720
    Abstract: A terminal-equipped wire in which a terminal fitting and a wire obtained by covering an outer periphery of a conductor with an insulating covering are electrically connected to each other at an electric connection, the terminal-equipped wire including a resin covering that is made of a resin material, and covers the electric connection, wherein: the resin covering includes, in a region that covers at least part of the terminal fitting, a first covering layer that is in contact with a surface of the terminal fitting and a second covering layer that covers at least part of the first covering layer, and the first covering layer has a recess, and the recess is covered by the second covering layer.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: October 19, 2021
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Takuya Yamashita, Tetsuya Nakamura, Yoshiaki Yamano, Takaaki Ito, Junichi Ono
  • Patent number: 11153962
    Abstract: A header for a semiconductor device, includes a main body section having an upper surface, and a cavity formed in the upper surface, a heat dissipation section provided on the upper surface of the main body section, and a wiring board provided inside the cavity. The wiring board includes a substrate having a first principal surface, and a second principal surface provided on an opposite side from the first principal surface, a first conductor pattern provided on the first principal surface, and having a mounting section on which a semiconductor element is mounted, and a second conductor pattern provided on the second principal surface, and bonded to an inner wall surface of the cavity and the heat dissipation section. A portion of the first conductor pattern extends beyond the heat dissipation section when viewed in a thickness direction of the wiring board.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: October 19, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Yasuyuki Kimura, Takumi Ikeda
  • Patent number: 11145437
    Abstract: A shielded flat cable includes a plurality of flat conductors arranged in parallel, a pair of resin insulating layers sandwiching the flat conductors from both sides of a parallel surface of the flat conductors, and covering portions other than end portions of the flat conductors in a length direction, a pair of shield layers in contact with an outer surface of at least one resin insulating layer of the pair of resin insulating layers, and a pair of first resin films with an adhesive covering an outer surface of the pair of resin insulating layers or the shield layer. A dielectric loss tangent of the resin insulating layer, of the pair of resin insulating layers, in contact with the shield layer is 0.001 or less at 10 GHz, and the adhesive or the pair of first resin films is made of a flame retardant material.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: October 12, 2021
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Chiaki Kojima, Yutaka Fukuda, Tatsuo Matsuda
  • Patent number: 11140781
    Abstract: An electronic device includes chip components, a terminal connection body, conductive terminals, and a support member. Each of the chip components has a pair of end surfaces on which terminal electrodes are formed. The terminal connection body connects the terminal electrodes on one side of the chip components arranged next to each other in a parallel direction to the end surfaces. Each of the conductive terminals includes a connection part and a mount part. The connection part is connected with the terminal electrode of either of the chip components located on both ends of the chip components connected in series via the terminal connection body. The mount part faces the connection part and is connected with a mount board. The support member is disposed between the connection parts and the mount parts. The chip components are arranged so that the end surfaces face the mount board.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: October 5, 2021
    Assignee: TDK CORPORATION
    Inventors: Kosuke Yazawa, Norihisa Ando, Shinya Ito, Akihiro Masuda
  • Patent number: 11139591
    Abstract: A conductive member includes (i) a conductive pipe and (ii) a conductor that is inserted into the pipe and is brought into electro-conductive contact with an inner surface of the pipe. The pipe is provided with a stopper section that abuts against and stops the conductor and thereby regulates an insertion amount of the conductor. The conductor includes an insulation coating surrounding a conductor section, the conductor section is exposed at an end portion, and an end of the insulation coating forms a step with respect to the conductor section and creates a stopped section that abuts against and is stopped by the stopper section.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: October 5, 2021
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Hirokazu Nakai
  • Patent number: 11134575
    Abstract: A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: September 28, 2021
    Inventor: Timothy Hughes
  • Patent number: 11120945
    Abstract: A multilayer ceramic capacitor includes a laminated body and first and second external electrodes respectively on both end surfaces of the laminated body. When regions where first internal electrodes or second internal electrodes are not present are regarded as side margin portions in a cross section of the laminated body as viewed from the laminating direction, the side margin portions include multiple side margin layers, and the content of Si in the side margin layer closest to the internal electrode is lower than that in the side margin layer other than the side margin layer closest to the internal electrode.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: September 14, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hideaki Tanaka, Daiki Fukunaga, Koji Moriyama
  • Patent number: 11116109
    Abstract: A thermal connector comprising an electrically insulating beam having a first end face at a first end and a second end face at a second end is provided. The second end face may be opposite the first end face in an X direction. The beam may have a width in a Y direction perpendicular to the X direction. The beam may also have a top face and a bottom face offset from the top face in a Z direction. The thermal connector may include a first terminal attached to the bottom face and adjacent the first end and a second terminal attached to the top face and adjacent the first end. The connector may have an overall thickness in the Z direction, which includes the first and second terminals and is greater than 1.27 mm and less than 3.81 mm.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: September 7, 2021
    Assignee: AVX Corporation
    Inventor: Scott B. Durgin
  • Patent number: 11114239
    Abstract: A device includes a leadframe and an electronic component. The leadframe includes a first leadframe element having a first surface and a second leadframe element adjacent to the first leadframe element, the first and second leadframe elements being separate from one another, the second leadframe element having a second surface. A first flange extends from a first outer edge of the first leadframe element and extends away from the first surface of the first leadframe element. A second flange extends from a second outer edge of the second leadframe element and extends away from the second surface of the second leadframe element. The electronic component is coupled to the first and second surfaces of the first and second leadframe elements such that the first and second flanges are located at opposing first and second sidewalls of the electronic component.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: September 7, 2021
    Assignee: NXP B.V.
    Inventors: Chayathorn Saklang, Wiwat Tanwongwan, Amornthep Saiyajitara, Chanon Suwankasab
  • Patent number: 11104563
    Abstract: A flexible and electrically conductive platform liner is provided for lining an aerial work platform. The platform liner is composed of a flexible and electrically conductive material, such that it is foldable for transport and storage. The platform liner is configured to be placed into the aerial work platform and electrically bonded to an energized power line during operation, such that the platform liner is held at a similar electrical potential to the energized power line.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: August 31, 2021
    Assignee: Altec Industries, Inc.
    Inventor: Joseph Scott Deters
  • Patent number: 11101576
    Abstract: A connection assembly is provided and includes a first conductor, a second conductor and a friction stir welded connection connecting the first conductor and the second conductor, with the second conductor having a bundle of conductor wires. The friction stir welded connection is provided by a friction stir welding tool having a pin connecting a front side of the second conductor pressed onto the first conductor along a connecting direction between the first conductor and the second conductor.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: August 24, 2021
    Assignees: TE Connectivity Germany GmbH, Technical University of Ilmenau
    Inventors: Uwe Hauck, Helge Schmidt, Andre Martin Dressel, Rudi Blumenschein, Jean Pierre Bergmann, Anna Regensburg
  • Patent number: 11081277
    Abstract: An electronic component includes a multilayer body including inner electrodes and dielectric layers alternately stacked, and an outer electrode electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite to each other in a stacking direction, first and second side surfaces opposite to each other in a width direction, and first and second end surfaces opposite to each other in a length direction. The outer electrode includes first outer electrodes disposed on the first and second end surfaces, and at least one second outer electrode disposed on at least one of the first and second side surfaces. The at least one second outer electrode is directly connected to the inner electrodes at positions spaced away from the at least one of the first or second side surface toward the inside of the multilayer body.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: August 3, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Satoshi Muramatsu, Masatoshi Yanagihara, Akitaka Doi
  • Patent number: 11069481
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: July 20, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Min Bang, Bum Su Kim, Hyun Hee Gu, Hee Sang Kang
  • Patent number: 11062848
    Abstract: A multilayer ceramic electronic component includes a rectangular parallelepiped laminate body. An external electrode is provided at both end surfaces of the laminate body. The external electrode includes a base electrode layer, a conductive resin layer on the base electrode layer, and a plating layer on the conductive resin layer. The conductive resin layer includes a first layer on the base electrode layer, a second layer on the first layer, and a third layer on the second layer. With respect to porosity which is an area ratio of pores obtained from a binary image within a predetermined field of view, the first layer and the third layer have a porosity of equal to or less than about 5% and the second layer has a porosity equal to or more than about 6%. Thicknesses of the first, second, and third layers satisfy predetermined conditions.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: July 13, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Atsushi Nakamoto
  • Patent number: 11062851
    Abstract: Disclosed herein is a thin film capacitor embedded substrate that includes a substrate and a plurality of thin film capacitors including at least first and second thin film capacitors embedded in the substrate. The first and second thin film capacitors are connected in parallel and have mutually different self-resonant frequencies.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: July 13, 2021
    Assignee: TDK CORPORATION
    Inventors: Toshio Asahi, Hitoshi Saita
  • Patent number: 11052839
    Abstract: A binding structure of wire routing materials are formed by: elongated wire routing materials; a binding member for binding the wire routing materials; and an engaging member including a movable body portion including an engaging portion for assembly into a vehicle body, and a bound portion to be bound and held together with the wire routing materials by the binding member. The bound portion includes a main portion facing the wire routing materials, and a leg portion extending from the main portion and being in contact with the wire routing materials. The movable body portion includes a sliding portion disposed such that sliding thereof is allowed on the wire routing materials in a gap.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: July 6, 2021
    Assignees: DAIWA KASEI INDUSTRY CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Toshio Iwahara, Katsuya Hirakawa, Itsuo Wakabayashi, Kazunori Takata
  • Patent number: 11043315
    Abstract: The present disclosure relates to a signalling cable that includes: a cable core, a metallic screen surrounding and in direct contact with the cable core, and at least one flame retardant low smoke zero halogen polymeric sheath surrounding and in radially position with respect to the metallic screen. The cable core includes a plurality of insulated electric conductors and a core wrap. The insulated electric conductors each includes an electric conductor insulated by a fire barrier and a flame retardant low smoke zero halogen polymeric insulating layer.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: June 22, 2021
    Assignee: Prysmian S.p.A.
    Inventors: Can Altingöz, Baris Sönmez, Nedim Yildiz, Zekeriya Sirin