Abstract: A circuit board and a manufacturing method therefor. The circuit board includes a substrate and a plurality of traces arranged at intervals on the substrate. Each trace includes a seed layer located on one surface of the substrate, a first copper layer located on the surface of the seed layer away from the substrate, and a second copper layer plated on one surface of the substrate. The second copper layer covers the seed layer and the first copper layer. The ratio of the thickness of each trace to the space between any two adjacent traces is greater than 1. The thickness of the second copper layer in the thickness direction of the substrate is greater than the thickness of the second copper layer in a direction perpendicular to the thickness direction of the substrate.

Abstract: An electronic component includes a multilayer body including inner electrodes and dielectric layers alternately stacked, and an outer electrode electrically connected to the inner electrodes. The multilayer body includes first and second main surfaces opposite to each other in a stacking direction, first and second side surfaces opposite to each other in a width direction, and first and second end surfaces opposite to each other in a length direction. The outer electrode includes first outer electrodes disposed on the first and second end surfaces, and at least one second outer electrode disposed on at least one of the first and second side surfaces. The at least one second outer electrode is directly connected to the inner electrodes at positions spaced away from the at least one of the first or second side surface toward the inside of the multilayer body.

Abstract: In an embodiment a connecting element includes a base configured to be fixed to a housing, an electrical conductor and a retainer for guiding and fixing the electrical conductor, the retainer being connected to the base, wherein the electrical conductor is in direct contact with the retainer, wherein the retainer is shaped such that a first contact face of the electrical conductor is configured to contact a first functional part of an electrical component and a second contact face of the electrical conductor is configured to contact a second functional part of the electrical component, the first functional part and the second functional part being located spatially distant from each other in an interior space of the housing, and wherein the connecting element is configured to connect the first functional part and the second functional part.

Abstract: A transparent, electrically-conductive film and associated method of making the transparent, electrically-conductive film. The transparent, electrically-conductive film includes a substrate, a percolating network of nanostructures establishing electrical conductivity across a region of the substrate, and an overcoat matrix coated onto the substrate. The nanostructures have an average diameter value. The percolating network of nanostructures is located within the overcoat matrix. The overcoat matrix and the percolating network of nanostructures therein have an overall thickness that is less than four times the average diameter value of the nanostructures.

Abstract: A pressure equalising device for a housing, including an inside, an outside, and a lattice-like cage having a gas passage opening. The gas passage opening connects the inside and the outside in a differential pressure-dependent and flow-conducting manner. The gas passage opening is covered by a gas-permeable membrane which includes at least one nonwoven layer. The nonwoven layer includes fibers which are substantially completely sheathed by a sheath of an elastomer.

Abstract: A method for upgrading a portion of a process control system from a legacy programmable logic controller (PLC) to a non-PLC process controller is disclosed. A mounting rack sized to fit into a space occupied by legacy hardware is assembled and populated with replacement hardware that includes an I/O card, an I/O terminal block, and a custom interface module. The custom interface module is coupled to the I/O card via the I/O terminal block and to a plurality of process control field devices via a legacy wiring mechanism coupled to legacy wiring of the process control system, without requiring modification or re-termination of the legacy wiring. The legacy wiring mechanism is disconnected from the legacy hardware, the rack containing the legacy hardware is removed and replaced with the mounting rack, and the legacy wiring mechanism is coupled to the custom interface module.

Abstract: The present invention provides an assembly substrate used in a method for manufacturing a display device which mounts semiconductor light emitting devices on a predetermined position of an assembly substrate by using an electric field and a magnetic field.

Abstract: A multilayer ceramic capacitor that includes a ceramic body including a stack of a plurality of dielectric layers and a plurality of first and second internal electrodes; and first and second external electrodes provided at each of both end faces of the ceramic body. Each of the plurality of dielectric layers contain Ba, Ti, P and Si. The plurality of dielectric layers include an outer dielectric layer located on an outermost side in the stacking direction; an inner dielectric layer located between the first and second internal electrodes; and a side margin portion in a region where the first and second internal electrodes do not exist. In at least one of the outer dielectric layer, the inner dielectric layer and the side margin portion, the P and the Si segregate in at least one of grain-boundary triple points of three ceramic particles.

Abstract: A bump pad enclosure providing an improved reliability of a bump connection is provided. The bump pad enclosure comprises an electrode pad, a UBM and a first shield. The first shield covers at least a first perimeter area of the electrode pad. The first shield is provided and configured to shield the first perimeter area from a detrimental influence of the environment.

Abstract: The invention relates to an insulating connector 1 comprising a ceramic basic body for accommodating at least two electrical conductors, wherein one electrical conductor, respectively, is contacted with another electrical conductor, and the insulating connector comprises a ceramic sleeve that can assume a released position and a fixed position, wherein the electrical conductors are fixed by the sleeve to the ceramic basic body in the fixed position.

Abstract: An offshore submarine cable for an offshore wind farm. The offshore submarine cable has a power capacity between 3 MW and 2.5 GW, at least one weighting element having a density of at least 5 g/cm3 at 20° C., and at least one armor package.

Abstract: A printed circuit board (PCB) (4) including an upper surface having one or more electrical terminals (9) thereon, said terminal adapted for connection to corresponding terminal of one or more electrical components, and further including one or more platforms (10) fabricated thereon, said platforms being located adjacent to corresponding component terminals, said platforms being adapted to support an electrical component thereupon, such that a portion of the component overhangs said platform above said corresponding PCB terminal.

Abstract: A display device with self-luminous display elements, which are arranged in a panel. The panel is provided, on its rear side opposite the light-emitting surface used for display, with a heat distribution element, on the side of which facing away from the rear side at least one temperature sensor is arranged. The heat distribution element has at least one opening, behind which a light sensor is arranged, wherein the light sensor and the temperature sensor are arranged on a common carrier.

Abstract: A covering film (100) includes a first covering layer (10), a first adhesive layer (20), and a thermal conductive layer (30) sandwiched between the first covering layer (10) and the first adhesive layer (20). A thermal conductivity of the thermal conductive layer (30) is K1, K1 is in a range of 3 W/m.K to 65 W/m.K. A thermal conductivity of the first covering layer (10) is K2, K2 is in a range of 0.02 W/m.K to 3.0 W/m.K. A thermal conductivity of the first adhesive layer (20) is K3, K3 is in a range of 0.02 W/m.K to 1.0 W/m.K. A circuit board and its manufacturing method are also provided.

Abstract: A stretchable wiring board that includes: a stretchable substrate; a first stretchable wiring extending in a length direction on a main surface side of the stretchable substrate; and a second stretchable wiring extending in the length direction on the main surface side of the stretchable substrate, the second stretchable wiring having a first portion with a first region overlapping on top of the first stretchable wiring on an end portion side of the first stretchable wiring, and a width of the first portion of the second stretchable wiring in a width direction orthogonal to the length direction is smaller than a width of the first stretchable wiring.

Abstract: A computer-implemented method of reducing an impact of stray magnetic fields on components of a quantum computing chip is disclosed. The computer implemented method includes applying a first current signal to a first component of a quantum computing chip, whereby the first component generates a stray magnetic field impacting an operation of a second component of the quantum computing chip. The computer implemented method further includes applying a compensation current signal to a shielding circuit of the quantum computing chip, the compensation current signal generated according to a predetermined function of the first signal, to magnetically shield the second component from the stray magnetic field generated by the first component.

Abstract: A multilayer electronic component includes a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer interposed therebetween, and external electrodes disposed on the body, wherein the external electrode include a first electrode layer disposed on two end surfaces and a second electrode layer including a center portion disposed on the first electrode layer and a band portion extending from the center portion onto a portion of a first surface and a portion of a second surface, the first electrode layer includes a conductive metal, the second electrode layer includes silver (Ag) and glass and further includes one or more of palladium (Pd), platinum (Pt), and gold (Au), and ta<tb in which ta is a maximum thickness of the center portion and tb is a maximum thickness of the band portion.

Abstract: The present disclosure relates to a method for manufacturing a de-powder device for piping and a method for installing the same, and more particularly, to a method for manufacturing a de-powder device for piping, which is for suppressing attachment and deposition of exhaust matters to an inner circumferential surface of a pipe exposed to the flow of exhaust matters such as unreacted raw material gas, reaction products, and the like exhausted from substrate processing devices for semiconductors and displays, and a method for installing the same.

Abstract: A circuit board, including: a substrate; a first line layer, a first protective layer, a first conductive ink layer and a first conductive layer successively formed on the substrate; and a second line layer, a second protective layer, a second conductive ink layer and a second conductive layer successively formed on a second face opposite a first face. The first protective layer includes at least one first opening for exposing a first grounding line of the first line layer; and the orthographic projection of the first conductive ink layer on the substrate covers the orthographic projection of the first opening on the substrate. The second protective layer includes at least one second opening for exposing a second grounding line of the second line layer; and the orthographic projection of the second conductive ink layer on the substrate covers the orthographic projection of the second opening on the substrate.

Abstract: A shielded printed wiring board includes a substrate film including a base film and printed circuits including a ground circuit formed on the base film; an electromagnetic wave shielding film including a shielding layer and an insulating layer; and a reinforcing member including a conductive adhesive layer and a metal reinforcing plate, wherein the ground circuit of the substrate film is sufficiently electrically connected to the metal reinforcing plate of the reinforcing member.