Abstract: An arrangement (20) for coupling light into a plate-like light guide (25) having two surfaces (23, 24) on opposite sides of the light guide comprises an in-coupling diffraction grating (21) for diffracting an external light beam (26) incident on said in-coupling diffraction grating into the light guide in a direction enabling the in-coupled light beam to propagate within the light guide via total internal reflections at the light guide surfaces (23, 24). According to the present invention, the arrangement further comprises a deflection member (22) arranged to deflect the beam (27) initially diffracted by the in-coupling diffraction grating (21), before it hits the in-coupling diffraction grating again, out of the path determined by the in-coupling diffraction grating in order to reduce out-coupling of the already in-coupled light through the in-coupling diffraction grating.

Abstract: An apparatus and method of assembly are described that provide an improved printed circuit board (PCB) assembly for an electro-optical interface, where more accurate positioning and alignment of electro-optical components can be achieved in an active part of the PCB assembly that is used for the electro-optical interface to meet tighter tolerances in an easier and more cost efficient manner. In particular, a photonic integrated circuit (PIC) is received in a cavity defined in a PCB that includes conductive elements for transmitting electrical signals. An optoelectronic transducer is connected to the PIC to convert between the optical signals and the corresponding electrical signals, and an optical coupler is secured to the optoelectronic transducer and supported by the PIC and/or PCB, where the optical coupler is configured to transmit the optical signals between the optoelectronic transducer and an optical fiber.

Abstract: A method of fabricating an optical coupling device, comprising forming a waveguide mask layer on a substrate platform, wherein the waveguide mask layer comprises an array of openings comprising a first end and a second end opposite to the first end, immersing the substrate platform into a salt melt comprising ions to form an array of waveguides in the substrate platform through an ion diffusion process, and controlling a rate of immersion such that a diffusion depth of the ions varies as a function of a distance in a direction from the first end to the second end, wherein the array of waveguides extends in the direction from the first end to the second end.

Abstract: In photonic integrated circuits implemented in silicon-on-insulator substrates, non-conductive channels formed, in accordance with various embodiments, in the silicon device layer and/or the silicon handle of the substrate in regions underneath radio-frequency transmission lines of photonic devices can provide breaks in parasitic conductive layers of the substrate, thereby reducing radio-frequency substrate losses.

Abstract: A light communication device further includes a rigid substrate, a package, and a flexible substrate. The rigid substrate includes a first terminal arranged on a surface thereof and a second terminal having a first hole opened at the surface. The package includes a third terminal and a fourth terminal being provided on a side wall thereof and being electrically coupled to a signal electrode and a ground electrode of the signal processor, respectively. The flexible substrate includes a fifth terminal and a sixth terminal being electrically coupled to the third terminal and the fourth terminal, respectively. The fifth terminal is electrically coupled to the first terminal on the surface, and the sixth terminal, with being placed into the first hole, is electrically coupled to the second terminal.

Abstract: Fiber management assembly comprises an optical fiber splitter, a splice holding section having a fiber splice device mounted therein, and a slack storage system. The optical fiber splitter, splice holding section and slack storage system are disposed on one of a tray and an interior surface of an enclosure body. In addition, patch panel tray having a patch panel comprising a plurality of adapters mounted thereon is provided, wherein a bare end of a splitter input fiber is routed via the slack storage system to a first end of the splice device, and wherein pre-connectorized splitter output fibers are routed to different adapters of the plurality of adapters.

Abstract: An optical fiber comprising: (i) a core region comprising an outer radius r1, and 3.0?r1?7.0 microns and a relative refractive index ?1max and 0.32%??1max?0.5%; (b) a depressed index cladding region surrounding the core region comprising an outer radius r3 and a relative refractive index ?3 less than ?0.2%, and trench volume V3 wherein 45% ?-micron2?|V3|?200% ?-micron2; (c) a first outer cladding region surrounding the depressed index cladding region and comprising a relative refractive index ?4 and an outer radius r4; and (d) a second outer cladding layer comprising 5 wt %-20 wt % titania, a relative refractive index ?5, and a thickness TM, wherein 3 micron?TM?30 microns, and outer radius r5?65 microns; the optical fiber has a mode field diameter MFD1550 and 8 microns?MFD1550?10.5 microns, a cutoff wavelength ?1550 nm when bent 1 turn around a 2.5 mm radius mandrel, and a bending loss at 1550 nm when using a mandrel comprising a radius of 2.5 mm of ?1.0 dB/turn.

Abstract: A system for connecting a fiber optic cable to a laminate has a clip which attaches to a cover on the circuit board. The clip supports ferrules which are connected to a photonic device on the board. The clip has a backplane which supports retainers which hold the ferrules. The clip also has mating attachments for connecting to the cover. The cover additionally serves as a heat dissipator, which can include heat from the photonic device. An adapter is connected to the cover and receives the ferrules supported by the clip. The adapter connects to a standard connector, such as an LC connector. The adapter can be positioned at the edge of the laminate, or can be attached at an angle extending from an interior region of a circuit board to which the laminate is mounted.

Abstract: Various embodiments of an integrated polarization rotator-splitter/combiner apparatus are described. An integrated polarization rotator-splitter apparatus may include an input waveguide section, a polarization rotator section, a polarization splitter section and an outgoing waveguide section, which can also be reversely connected as a polarization rotator-combiner.

Abstract: Multi-fiber ferrules may be produced with tapered bodies and guide pin holes that have fluted internal surfaces with projections for engaging the guide pins, and channels for capturing any foreign material that may accumulate on or around the guide pins, thereby providing improved consistency in fiber connections during mating of the ferrules.

Abstract: An optical interface includes a rack mountable enclosure that includes multiple slots for retaining multiple insertable fiber optic (FO) modules. The FO modules include a first set of interconnection ports that connect to remote radio units (RRUs), a second set of interconnection ports that connect to a baseband unit (BBU), and a third set of monitoring ports that connect to monitoring/text equipment. The FO modules contain fiber splitters that split off uplink/receive and downlink/transmit signals carried on optical fibers to the third set of monitoring ports. The FO modules may insert in different orientations and directions into different rack mountable enclosure configurations for higher density and more configurable connectivity. A splitter holder is located within the FO module and provides improved optical fiber routing for more integrated module port interconnectivity.

Abstract: A rack cabling system including a rack having mounted thereon a first hardware component and a patch panel housing mounted on the rack adjacent the first hardware component. The patch panel housing populates no more than a three rack unit (RU space), the patch panel housing including a first end having cable pathway openings and a second end having connector elements mounted therein. The patch panel may have a first cable pathway opening located adjacent the first side of the housing and defining a primary position and a first connector element mounted on the second end and the first connector element having a first position corresponding to the primary position of the first cable pathway opening. Cable harnesses axe routed with less than three bends of the cables between the first hardware component and the patch panel housing, so the first cable harness is terminated at the first connector element in the first position.

Abstract: An optical subassembly includes a thru optical via (104) formed through a semiconductor substrate (102), an optoelectronic component (108) secured to the substrate (102) such that an active region (106) of the optoelectronic component is aligned with the thru optical via (104), and circuitry (110) formed into the substrate (102), the circuitry to connect to and operate in accordance with the optoelectronic component (108).

Abstract: A cabled midplane interconnect system includes a cabled midplane interconnect having a first connection and a second connection. A first circuit board has a third connection configured to be coupled to the first connection. A second circuit board has a fourth connection configured to be coupled to the second connection. The connection orientations are assigned such that a midplane cable, having a plurality of conductors, couples the first connection to the second connection so that none of the plurality of conductors crosses another of the plurality of conductors.

Abstract: A luminaire includes a housing, an optical waveguide disposed in the housing comprising a plurality of light coupling cavities, and a plurality of LEDs disposed in the housing adjacent the plurality of coupling cavities. A mounting apparatus is adapted to mount the luminaire on a roadway stanchion.

Abstract: An apparatus includes a waveguide extending along a light-propagation direction between a light source and a media-facing surface. The waveguide comprises an assistant layer configured to receive light from a light source, truncated with an intermediate bottom cladding layer. A core layer comprises a coupling end configured to receive light from the assistant layer. The coupling end comprises a taper that widens toward the media-facing surface. A near field transducer is disposed proximate the media-facing surface and is configured to receive the light from the core layer.

Abstract: Techniques for increasing efficiency of thermo-optic phase shifters using multi-pass heaters and thermal bridges are provided. In one aspect, a thermo-optic phase shifter device includes: a plurality of optical waveguides formed in an SOI layer over a buried insulator; at least one heating element adjacent to the optical waveguides; and thermal bridges connecting at least one of the optical waveguides directly to the heating element. A method for forming a thermo-optic phase shifter device is also provided.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to photonics chips and methods of manufacture. A structure includes: a photonics chip having a grated optical coupler; an interposer attached to the photonics chip, the interposer having a grated optical coupler; an optical epoxy material provided between the grated optical coupler of the photonics chip and the grated optical coupler of the interposer; and epoxy underfill material provided at interstitial regions between the photonics chip and the interposer which lie outside of an area of the grated optical couplers of the photonics chip and the interposer.

Abstract: Described are examples of optical blind-mate connector adaptors, optical blind-mate connectors to blind-mate to the adaptors, and optical blind-mate systems. In various implementations, an optical blind-mate connector adapter may include a sleeve housing and a shutter mounted at an opening of the sleeve housing. The shutter may include a shutter flap to cover the opening in a closed position and a shutter tab to receive a force to move the shutter flap from the closed position to an open position extending away from the sleeve housing.

Abstract: A micro-duct cable includes a center member and a plurality of buffer tubes surrounding the center member. A plurality of fibers are disposed in each of the plurality of buffer tubes. Each of the plurality of buffer tubes contains greater than or equal to 24 fibers. The micro-duct cable further includes a cable jacket surrounding the plurality of buffer tubes and the center member. A maximum outer diameter of the cable is less than 13 millimeters and a modulus of elasticity of the cable is greater than or equal to 800 kpsi.