Patents Examined by Ha Tran Nguyen
  • Patent number: 7362090
    Abstract: A method of sorting automated tray transfer trays includes detecting if a die remains in the tray. The method includes the ability to interrupt the automated tray transfer process to prevent mixing processed and unprocessed dice. An apparatus includes a sensor for detecting if a die remains in the tray. A sensor includes a protrusion on an automated tray transfer handler.
    Type: Grant
    Filed: March 30, 2005
    Date of Patent: April 22, 2008
    Assignee: Intel Corporation
    Inventors: Hon Meng Wong, Lek Seng Lam
  • Patent number: 7362088
    Abstract: A contactless sheet resistance measurement apparatus and method for measuring the sheet resistance of upper layer of ultra shallow p-n junction is disclosed. The apparatus comprises alternating light source optically coupled with first transparent and conducting electrode brought close to the wafer, the second electrode placed outside of illumination area. Using the measurement of the surface photovoltage signals inside illuminated area and outside this area and its phase shifts, linear SPV model describing its lateral distribution the sheet resistance and p-n junction conductance is determined.
    Type: Grant
    Filed: October 15, 2003
    Date of Patent: April 22, 2008
    Assignee: Ahbee 1, L.P.
    Inventors: Vladimir Faifer, Phuc Van
  • Patent number: 7362112
    Abstract: A signal acquisition probe has a double cushioned spring loaded probing tip assembly disposed in a housing. A first compressive element produces a first pre-loaded compressive force and an increasing compressive force on the probing tip assembly and a second compressive element produces a second pre-loaded compressive force and an increasing compressive force on the probing tip assembly subsequent to the first increasing compressive force. First and second double cushioned spring loaded probing tip assemblies may be disposed in a housing to produce a differential signal acquisition probe.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: April 22, 2008
    Assignee: Tektronix, Inc.
    Inventors: Kei-Wean C. Yang, Mark W. Nightingale
  • Patent number: 7358755
    Abstract: Testing devices at various locations on a die may be used to determine one or more properties of the locations. For example, a testing device including an oscillator such as a ring oscillator at a location may be used to determine a silicon quality, temperature, and/or voltage at the location.
    Type: Grant
    Filed: May 3, 2005
    Date of Patent: April 15, 2008
    Assignee: Marvell Semiconductor Israel Ltd.
    Inventor: Eitan Rosen
  • Patent number: 7358756
    Abstract: A method and apparatus for testing a liquid crystal display device are provided to detect a defect location precisely and rapidly without requiring a jig. The method includes providing an inspection apparatus as a removable portion of the liquid crystal display device; inspecting the display part of the liquid crystal display device using the inspection apparatus; removing the inspection apparatus from the liquid crystal display device after the inspection is completed; and attaching driving circuits to the liquid crystal display device having the inspection apparatus removed therefrom.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: April 15, 2008
    Assignee: LG. Philips LCD Co., Ltd.
    Inventors: Jong Dam Kim, Hyun Kyu Lee, Yong Jin Cho, See Hwa Jeong
  • Patent number: 7358714
    Abstract: A testing method of a semiconductor integrated circuit device includes a testing step of conducting a functional test by supplying test pattern data to a semiconductor integrated circuit device mounted upon a testing apparatus, and a post processing step conducted after the testing step for continuously driving the semiconductor integrated circuit device by supplying dummy test pattern to the semiconductor integrated circuit device, wherein the test pattern data is supplied with a first system clock speed while the dummy test pattern data is supplied with a second, slower system clock speed, the post processing step switching a system clock speed of the testing apparatus from the first system clock speed to the second system clock speed at the same time as finishing of the testing step.
    Type: Grant
    Filed: January 19, 2006
    Date of Patent: April 15, 2008
    Assignee: Fujitsu Limited
    Inventors: Takao Watanabe, Shigenobu Ishihara
  • Patent number: 7358753
    Abstract: A probing apparatus, probing circuit board and probing system for high-voltage matrix probing are provided. Switching circuits of the probing apparatus capable of probing a plurality of probing points for high-voltage matrix probing are manufactured with using a mixed high-voltage IC process. The probing circuit board comprises a plurality of probing apparatuses integrated on a bare circuit board. The probing system comprises a plurality of probing circuit boards integrated in a machine.
    Type: Grant
    Filed: September 27, 2006
    Date of Patent: April 15, 2008
    Assignee: IP Leader Technology Corp.
    Inventor: Li-Jen Tang
  • Patent number: 7358717
    Abstract: An input by-pass circuit for a current probe has first and second switches coupled between current probe inputs and current sensing circuit inputs. A switch control is coupled to the switching circuit for selectively coupling and decoupling the current probe inputs to the current sensing circuit such that the current signal continuously flows in the device under test.
    Type: Grant
    Filed: May 8, 2006
    Date of Patent: April 15, 2008
    Assignee: Tektronix, Inc.
    Inventors: Jonathan S. Dandy, Kerry A. Stevens, Michael J. Mende, Thomas J. Sharp
  • Patent number: 7358750
    Abstract: An inspection apparatus comprises a fixed unit including a control device and a measurement device, and a moving unit including contact terminals, which are brought into contact with contacts formed on a printed board having electrode patterns subjected to electrical inspection (e.g., electrical conduction inspection). The contact terminals are connected to a connection switching device via a plurality of first wires, wherein the connection switching device is arranged in the moving unit for selectively switching over the first wires. A plurality of third wires are arranged for establishing connections between the fixed unit and the selectively-switched first wires, wherein the number of the third wires is smaller than that of the first wires.
    Type: Grant
    Filed: January 15, 2004
    Date of Patent: April 15, 2008
    Assignee: Yamaha Fine Technologies Co., Ltd.
    Inventors: Yasunori Mizoguchi, Toru Ishii, Kengo Tsuchida
  • Patent number: 7355425
    Abstract: A clamp mechanism includes an insertion ring and a lock ring. The insertion ring includes a cylindrical portion and a flange portion. At the cylindrical portion, first cam followers to be inserted into a groove of the lock ring are arranged at predetermined intervals along a circumferential direction thereof, and at the flange portion, second cam followers to be in contact with the inner peripheral surface of the lock ring are arranged at predetermined intervals along a circumferential direction thereof. At the lock ring, cutoff portions, through which the first cam followers pass, are arranged corresponding to the first cam followers.
    Type: Grant
    Filed: September 15, 2006
    Date of Patent: April 8, 2008
    Assignee: Tokyo Electron Limited
    Inventor: Hiroshi Yamada
  • Patent number: 7355434
    Abstract: A light inspection device for performing lighting inspection of a display panel contains a circuit board having a driving circuit for a lighting display panel; a conductive chassis that functions as the ground potential of the driving circuit; and a conductive support member fixed to the chassis for fixing the circuit board. The chassis and the support member are joined via soft metal.
    Type: Grant
    Filed: September 28, 2004
    Date of Patent: April 8, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tsuneo Ikura, Takao Wakitani, Toshiya Otani
  • Patent number: 7355382
    Abstract: A current sensor that can reduce a measurement error due to isotropic elongation or strain owing to temperature and the like. A first half bridge circuit is placed in a first region divided by a center line of a mounting substrate, and a second half bridge circuit is placed in a second region, and the half bridge circuits are equally formed and placed point symmetrically about the central point of the mounting substrate. Even if elongation or strain occurs isotropically in the mounting substrate of magnetoresistive elements owing to temperature, the half bridge circuits undergo the influence of the elongation or strain equally as the bridge circuit. Thus, it can cancel the effect and reduce the measurement error due to the isotropic elongation or strain owing to temperature.
    Type: Grant
    Filed: December 28, 2006
    Date of Patent: April 8, 2008
    Assignees: Mitsubishi Electric Corporation, Kohshin Electric Corporation
    Inventors: Akira Okada, Junji Miyamoto
  • Patent number: 7355419
    Abstract: Methods and arrangements to enhance photon emissions responsive to a signal within an integrated circuit (IC) for observability of signal states utilizing, e.g., picosecond imaging circuit analysis (PICA), are disclosed. Embodiments attach a beacon to the signal of interest and apply a voltage across the beacon to enhance photon emissions responsive to the signal of interest. The voltage is greater than the operable circuit voltage, Vdd, to enhance photon emissions with respect to intensity and energy. Thus, the photon emissions are more distinguishable from noise. In many embodiments, the beacon includes a transistor and, in several embodiments, the beacon includes an enablement device to enable and disable photon emissions from the beacon. Further, a PICA detector may capture photon emissions from the beacon and process the photons to generate time traces.
    Type: Grant
    Filed: August 5, 2004
    Date of Patent: April 8, 2008
    Assignee: International Business Machines Corporation
    Inventors: Chandler Todd McDowell, Stanislav Polonsky, Peilin Song, Franco Stellari, Alan J. Weger
  • Patent number: 7355432
    Abstract: There is provided a buffer circuit that can deal with input and output signals having a large voltage swing. Such a buffer circuit is designed for outputting an output signal corresponding to an input signal.
    Type: Grant
    Filed: June 6, 2006
    Date of Patent: April 8, 2008
    Assignee: Advantest Corporation
    Inventor: Naoki Matsumoto
  • Patent number: 7355387
    Abstract: An integrated circuit load board includes a substrate on which a plurality of integrated circuit sockets and an integrated test circuit are mounted. The integrated test circuit includes circuitry for testing the timing margins of memory devices by determining the relative timing between read data and data strobe signals applied to a memory device. The relative timing between the read data and data strobe signals is determined by using a delay line to delay the data strobe signal over a range of delays, and determining a final delay that causes the transitions of the delayed data strobe signal to coincide with the transitions of the read data signals. The time corresponding to the final delay is then determined by using a phase interpolator to generate a range of phase offset signals having known delay times until a phase offset signal has the same delay as the final delay.
    Type: Grant
    Filed: December 8, 2005
    Date of Patent: April 8, 2008
    Assignee: Micron Technology, Inc.
    Inventor: Paul A. LaBerge
  • Patent number: 7355377
    Abstract: A probe-type electrical tester having a lamp, a first pointed electrode connected to the lamp, and a second electrode comprising an alligator clip connected to the lamp. The pointed electrode occupies a sleeve which is telescopingly stored within the tester. The sleeve terminates in a hook shaped guard for receiving jacketed conductors to be held during testing and to prevent injury from the pointed electrode. The sleeve is manually extended. A lever then causes the pointed electrode to advance within the sleeve after the sleeve has reached the fully projected position, to enable piercing of the jacket of the jacketed conductor being tested. A detent holds the lever in the fully projected position, and the sleeve in its projected position. The sleeve prevented from escaping from the tester. When the pointed electrode is retracted, the lever can also be substantially retracted into the tester body.
    Type: Grant
    Filed: October 17, 2006
    Date of Patent: April 8, 2008
    Inventor: Bill Gallentine
  • Patent number: 7355424
    Abstract: A test probe for a finger tester for the testing of non-componented circuit boards has a test needle with a probe tip which may be brought into contact with a circuit board test point, and which may be pivotably attached to a mount by means of at least two flexible sprung retaining arms. It is distinguished by the fact that at least one of the retaining arms is made of an electrically conductive material and is electrically connected to the test needle. In a corresponding finger tester, the test probe is driven by a linear motor.
    Type: Grant
    Filed: August 23, 2006
    Date of Patent: April 8, 2008
    Assignee: atg test systems GmbH & Co. KG
    Inventor: Victor Romanov
  • Patent number: 7355421
    Abstract: A semiconductor apparatus testing arrangement for testing a plurality of semiconductor devices produced on a semiconductor substrate, has a substrate on which a plurality of testing units are arranged, each unit comprising a probe needles corresponding to electrode terminals of the semiconductor device and electric conductor parts connected with the probe needles.
    Type: Grant
    Filed: January 26, 2006
    Date of Patent: April 8, 2008
    Assignee: Fujitsu Limited
    Inventors: Shigeyuki Maruyama, Yoshikazu Arisaka, Kazuhiro Tashiro, Takayuki Katayama, Tetsu Ozawa, Yuushin Kimura
  • Patent number: 7355420
    Abstract: A membrane probing assembly includes a probe card with conductors supported thereon, wherein the conductors include at least a signal conductor located between a pair of spaced apart guard conductors. A membrane assembly includes a membrane with contacts thereon, and supporting at least a signal conductor located between a pair of spaced apart guard conductors. The guard conductors of the probe card are electrically interconnected proximate the interconnection between the probe card and the membrane assembly. The guard conductors of the membrane assembly are electrically interconnected proximate the interconnection between the probe card and the membrane assembly.
    Type: Grant
    Filed: August 19, 2002
    Date of Patent: April 8, 2008
    Assignee: Cascade Microtech, Inc.
    Inventors: Kenneth Smith, Reed Gleason
  • Patent number: 7355418
    Abstract: An improved prober for an electronic devices test system is provided. The prober is “configurable,” meaning that it can be adapted for different device layouts and substrate sizes. The prober generally includes a frame, at least one prober bar having a first end and a second end, a frame connection mechanism that allows for ready relocation of the prober bar to the frame at selected points along the frame, and a plurality of electrical contact pins along the prober bar for placing selected electronic devices in electrical communication with a system controller during testing. In one embodiment, the prober is be used to test devices such as thin film transistors on a glass substrate. Typically, the glass substrate is square, and the frame is also square. In this way, “x” and “y” axes are defined by the frame. The electrical pins may be movable along the axial length of the prober bars, or may be selectively pushed down to contact selected contact pads on the substrate.
    Type: Grant
    Filed: July 30, 2004
    Date of Patent: April 8, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Matthias Brunner, Shinichi Kurita, Ralf Schmid, Fayez E. Abboud, Benjamin Johnston, Paul Bocian, Emanuel Beer