Patents Examined by Ida M. Soward
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Patent number: 11756943Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a photonic receiver; and a die coupled to the photonic receiver by interconnects, wherein the die includes a device layer between a first interconnect layer of the die and a second interconnect layer of the die. In still some embodiments, a microelectronic assembly may include a photonic transmitter; and a die coupled to the photonic transmitter by interconnects, wherein the die includes a device layer between a first interconnect layer of the die and a second interconnect layer of the die.Type: GrantFiled: December 29, 2017Date of Patent: September 12, 2023Assignee: Intel CorporationInventors: Shawna M. Liff, Adel A. Elsherbini, Johanna M. Swan
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Patent number: 11756849Abstract: A package includes a die, first conductive structures, second conductive structures, an encapsulant, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The first conductive structures and the second conductive structures surround the die. A shape of the first conductive structures is different a shape of the second conductive structures. The second conductive structures include elliptical columns having straight sidewalls. A distance between the first conductive structure that is closest to the die and the die is greater than a distance between the second conductive structure that is closest to the die and the die. The encapsulant encapsulates the die, the first conductive structures, and the second conductive structures. The redistribution structure is over the die and the encapsulant. The redistribution structure is electrically connected to the die, the first conductive structures, and the second conductive structures.Type: GrantFiled: June 8, 2022Date of Patent: September 12, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Sheng-Huan Chiu, Chun-Jen Chen, Chen-Shien Chen, Kuo-Chio Liu, Kuo-Hui Chang, Chung-Yi Lin, Hsi-Kuei Cheng, Yi-Jen Lai
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Patent number: 11758762Abstract: An electroluminescent display includes a display panel including a plurality of pixels, each pixel having an emission area and non-emission area; and a protective film attached on one surface of the display panel using a photo tunable adhesive, wherein the photo tunable adhesive includes: a light transmitting area corresponding to the emission area; and a light blocking area corresponding to the non-emission area.Type: GrantFiled: December 17, 2020Date of Patent: September 12, 2023Assignee: LG DISPLAY CO., LTD.Inventors: HyunJong Noh, KyungSuk Min, Jinhyung Jung, TaeWoon Ko, YoungWook Kim
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Patent number: 11758794Abstract: An organic light emitting display device includes a substrate having a display area displaying an image and a non-display area surrounding the display area; a camera disposition area provided within the display area; a panel identification area provided in the non-display area; and an upper protective layer covering the camera disposition area and the panel identification area.Type: GrantFiled: December 17, 2020Date of Patent: September 12, 2023Assignee: LG DISPLAY CO., LTD.Inventors: JooYoung Jang, HyunSeok Hong, DoHyung Kim
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Patent number: 11737312Abstract: A display device includes a display panel; a polarizing film disposed on the display panel; a touch film disposed on the polarizing film; a light control film disposed on the touch film; a barrier film disposed over the polarizing film; and a cover window disposed on the barrier film.Type: GrantFiled: May 16, 2022Date of Patent: August 22, 2023Assignee: LG DISPLAY CO., LTD.Inventor: Jae-Ho Jung
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Display device including wirings electrically connecting oxide conductive layer and sensor electrode
Patent number: 11730042Abstract: The display device includes a substrate, a display region arranged on the substrate and including a plurality of pixels, a first wiring provided on the substrate, an insulating layer overlapping a portion of the first wiring, an oxide conductive layer provided on the first wiring and electrically connected to the first wiring, a sealing layer overlapping the display region and at least an end of the oxide conductive layer and sealing the plurality of pixels, a sensor electrode provided on the sealing layer and overlapping the display region, and a second wiring passing over the at least end of the oxide conductive layer provided with the sealing layer and electrically connecting the sensor electrode and the oxide conductive layer.Type: GrantFiled: December 8, 2021Date of Patent: August 15, 2023Assignee: Japan Display Inc.Inventors: Mitsuhide Miyamoto, Yuko Matsumoto -
Patent number: 11730050Abstract: A display apparatus includes a display panel including a display area, a porous metal substrate disposed below the display panel and including a porous metal material, and a cover substrate disposed above the display panel. The porous metal substrate includes a flat substrate portion and first and second bent substrate portions convexly curved in opposite directions, and thicknesses of the first and second bent substrate portions are different from each other.Type: GrantFiled: June 23, 2021Date of Patent: August 15, 2023Assignee: LG Display Co., Ltd.Inventor: Myeongah Shin
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Patent number: 11723253Abstract: A light-emitting device or a display device that is less likely to be broken is provided. Provided is a light-emitting device including an element layer and a substrate over the element layer. At least a part of the substrate is bent to the element layer side. The substrate has a light-transmitting property and a refractive index that is higher than that of the air. The element layer includes a light-emitting element that emits light toward the substrate side. Alternatively, provided is a light-emitting device including an element layer and a substrate covering a top surface and at least one side surface of the element layer. The substrate has a light-transmitting property and a refractive index that is higher than that of the air. The element layer includes a light-emitting element that emits light toward the substrate side.Type: GrantFiled: April 8, 2021Date of Patent: August 8, 2023Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Shunpei Yamazaki, Yoshiharu Hirakata, Tomoya Aoyama, Akihiro Chida
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Patent number: 11721634Abstract: A conductive structure includes a core portion, a plurality of electronic devices and a filling material. The core portion defines a cavity. The electronic devices are disposed in the cavity of the core portion. The filling material is disposed between the electronic devices and a sidewall of the cavity of the core portion.Type: GrantFiled: January 25, 2021Date of Patent: August 8, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Wen Hung Huang
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Patent number: 11710694Abstract: Integrated circuit (IC) structures include transistor devices with interconnect structures, e.g., a source contact, drain contact, and/or gate contact. The interconnect structures have rounded top surfaces. Contouring the top surfaces of transistor contacts may decrease the likelihood of electrical shorting and may permit a larger volume of insulating dielectric between adjacent contacts.Type: GrantFiled: May 24, 2019Date of Patent: July 25, 2023Assignee: Intel CorporationInventors: Ebubekir Dogan, Ramanan Ehamparam, Jiho Kang
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Patent number: 11711943Abstract: Provided is a display panel including a main display area, a component area having a transmissive area, a peripheral area outside the main display area, a substrate, a bottom metal layer on the substrate, and defining an opening corresponding to the transmissive area, a valley portion adjacent to a boundary between the bottom metal layer and the transmissive area, and a thin-film encapsulation layer on the valley portion, and including an inorganic layer and an organic layer.Type: GrantFiled: June 11, 2021Date of Patent: July 25, 2023Assignee: Samsung Display Co., Ltd.Inventors: Kyunghyun Choi, Seongjun Lee
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Patent number: 11706942Abstract: A display device includes: a substrate including a display area and a non-display area; a circuit portion including a first circuit portion and a second circuit portion on the non-display area; a valley portion separating the first circuit portion and the second circuit portion from each other; and a thin film encapsulation layer sealing the display area, the thin film encapsulation layer extending from the display area to the valley portion, and the first circuit portion is between the valley portion and the display area, the second circuit portion is at an outside of the valley portion, an internal layer on the first circuit portion includes a plurality of island portions that are apart from one another in a first direction and a second direction crossing the first direction, and an external layer on the second circuit portion includes at least one groove extending in the first direction.Type: GrantFiled: September 3, 2020Date of Patent: July 18, 2023Assignee: Samsung Display Co., Ltd.Inventors: Kiho Bang, Wonsuk Choi
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Patent number: 11706963Abstract: A large-area display apparatus may include: a cover plate; a plurality of unit display panels arrayed on one surface of the cover plate, each of the unit display panels including a substrate; a display area defined at middle portions of the substrate; a non-display area around the display area; a pad portion disposed in the non-display area; a first terminal disposed outside the pad portion in the non-display area; and a second terminal apart from the first terminal disposed outside the pad portion in the non-display area; and a connecting member disposed between two unit display panels, the connecting member connecting the first terminals of the unit display panels and the second terminals of the unit display panels, respectively.Type: GrantFiled: December 24, 2020Date of Patent: July 18, 2023Assignee: LG DISPLAY CO., LTD.Inventors: MyungHo Ban, Dongik Kim, Subin Kim, BumSik Kim, KyungMin Kim
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Patent number: 11696466Abstract: A 3D display apparatus in which a display panel has a curvature is provided. A lower barrier layer, an upper barrier layer and lenticular lenses may be sequentially stacked on the display panel. The lower barrier layer and the upper barrier layer may include openings corresponding pixel areas of the display panel, respectively. Each opening of the lower barrier layer and each opening of the upper barrier layer may be disposed on an imaginary line passing through the corresponding pixel area of the display panel and a setting region. Thus, in the 3D display apparatus, the quality of the realized 3D image may be improved.Type: GrantFiled: June 30, 2021Date of Patent: July 4, 2023Assignee: LG Display Co., Ltd.Inventors: Young Min Kim, Ju Seong Park, Hoon Kang, Keong Jin Lee, Myung Soo Park, Dong Yeon Kim, Se Wan Oh
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Patent number: 11690246Abstract: In a display panel including a main display area, a component area including a transmission area, and a peripheral area outside the main display area, the display panel includes: a substrate; an inorganic insulating layer over the substrate and including a first hole corresponding to the transmission area; a planarization layer over the inorganic insulating layer; a pixel definition layer over the planarization layer and having a thickness of 1.3 ?m to 2 ?m; and a thin film encapsulation layer over the pixel definition layer, wherein an angle between a side surface of the pixel definition layer and an upper surface of the planarization layer is 30 degrees to 40 degrees.Type: GrantFiled: April 30, 2021Date of Patent: June 27, 2023Assignee: Samsung Display Co., Ltd.Inventors: Jihwang Lee, Jaehyun Kim, Youngseo Choi, Seungwoo Seo, Soyeon Jeong, Sungchul Kim
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Patent number: 11690248Abstract: A light emitting display device includes a lower substrate, a thin film transistor on the lower substrate, a passivation layer disposed on the thin film transistor and including hydrogen, an overcoating layer disposed on the passivation layer and planarizing the passivation layer, a light emitting element disposed on the overcoating layer and including an anode, a light emitting layer on the anode, and a cathode on the light emitting layer, a bank disposed on the overcoating layer and defining a light emitting area, an adhesive layer on the light emitting element and the bank, and a hydrogen absorbing layer disposed on the adhesive layer and including a hydrogen absorbing filler, wherein a side end of the bank is disposed more inwardly than side ends of the adhesive layer and the hydrogen absorbing layer, wherein the side ends of the adhesive layer and the hydrogen absorbing layer are disposed more inwardly than a side end of the overcoating layer.Type: GrantFiled: December 30, 2020Date of Patent: June 27, 2023Assignee: LG DISPLAY CO., LTD.Inventors: Yeon Kim, Goeun Kim, HyeonTae Seo, Eunjin Kim, Jungyeon Kim, JinHo Kim, Tae-Hoon Kim, KyoungHoon Kim, KwangSeon Lee, Hongdae Shin
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Patent number: 11690247Abstract: A display panel, in which a main display area, and a component area including a plurality of pixel groups and a transmission area are defined, includes a substrate, an inorganic insulating layer disposed on the substrate, where a first hole is defined through the inorganic insulating layer to correspond to the transmission area, a plurality of main display elements disposed on the inorganic insulating layer in the main display area, and a plurality of auxiliary display elements disposed on the inorganic insulating layer and corresponding to the pixel groups, respectively. The substrate includes a first base layer, a first barrier layer, a second base layer, a compensation layer, and a second barrier layer, which are stacked one on another, and a refractive index of the compensation layer has a value between a refractive index of the second base layer and a refractive index of the second barrier layer.Type: GrantFiled: May 20, 2021Date of Patent: June 27, 2023Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Kyunghyun Choi, Seongjun Lee, Kohei Ebisuno, Heeseong Jeong
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Patent number: 11682613Abstract: The present disclosure is directed to systems and methods for improving the impedance matching of semiconductor package substrates by incorporating one or more magnetic build-up layers proximate relatively large diameter, relatively high capacitance, conductive pads formed on the lower surface of the semiconductor package substrate. The one or more magnetic layers may be formed using a magnetic build-up material deposited on the lower surface of the semiconductor package substrate. Vias conductively coupling the conductive pads to bump pads on the upper surface of the semiconductor package substrate pass through and are at least partially surrounded by the magnetic build-up material.Type: GrantFiled: June 28, 2021Date of Patent: June 20, 2023Assignee: Intel CorporationInventors: Zhiguo Qian, Kaladhar Radhakrishnan, Kemal Aygun
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Patent number: 11682735Abstract: A semiconductor device includes a drain, a source, a gate electrode, and a nanowire between the source and drain. The nanowire has a first section with a first thickness and a second section with a second thickness greater than the first thickness. The second section is between the first section and at least one of the source or drain. The first nanowire includes a channel when a voltage is applied to the gate electrode.Type: GrantFiled: April 15, 2021Date of Patent: June 20, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Seung Hun Lee, Dong Woo Kim, Dong Chan Suh, Sun Jung Kim
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Patent number: 11683950Abstract: A display panel and an electronic device are provided. The display panel includes: an opening area; a display area surrounding the opening area; at least one isolation ring, wherein at least a part of the at least one isolation ring is located between the display area and the opening area, and the at least one isolation ring surrounds the opening area; and a drainage structure extending from a sidewall of an isolation ring in the at least one isolation ring along a straight line passing through a center of the isolation ring.Type: GrantFiled: May 27, 2021Date of Patent: June 20, 2023Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Bei Wang, Jia Zhao, Xiaobo Du, Haidong Wu, Huameng Liu