Patents Examined by J. J. Zimmerman
  • Patent number: 4504181
    Abstract: This relates to the formation of a line of weakening in the form of a score in a metal sheet for defining a line along which the metal sheet may be ruptured. It has been found that when the metal sheet in the area which is to be scored is compressed, the metal sheet may be more easily scored to a controlled residual with a minimum of undue fracture. Accordingly, beads are coined on the underside of the metal sheet on opposite sides of the intended position of the score in a first operation to compress the metal. The then compressed metal is engaged by a conventional scoring die on the opposite surface thereof and scoring of the metal is effected in the normal manner.
    Type: Grant
    Filed: September 14, 1982
    Date of Patent: March 12, 1985
    Assignee: Continental Can Company, Inc.
    Inventor: Nick S. Khoury
  • Patent number: 4490438
    Abstract: A steel sheet with two or more coatings and a method of producing the same are disclosed. The steel sheet has on at least one side a discontinuous surface layer of an Fe or Fe--Zn base alloy, preferably an Fe--Zn base alloy electrodeposit containing Sn in an amount of 0.01 to 50 mg/m.sup.2, usually in an amount of 1.0 to 50 mg/m.sup.2, preferably in an amount of 3.0 to 30 mg/m.sup.2, and also 5 to 50% by weight of Zn in case Fe--Zn alloy is used, and a layer of Zn--Ni or Zn--Fe alloy electrodeposit, which lies directly under said discontinuous surface layer.
    Type: Grant
    Filed: February 2, 1983
    Date of Patent: December 25, 1984
    Assignee: Sumitomo Metal Industries, Ltd.
    Inventors: Tetsuaki Tsuda, Tatsuo Kurimoto, Atsuyoshi Shibuya
  • Patent number: 4489137
    Abstract: The resistance to cracking corrosion of steel elongate elements, such as wires or armorings of flexible pipes or cables destined to be exposed to the corrosion of aqueous corrosive media, is increased by subjecting said elements to a series of alternate flexions in opposite directions, by passing them between rollers in staggered arrangement, so as to generate in said elements compression zones extending from each of the main external surfaces thereof to the inside over at least one third of the distance of said surface to the longitudinal axis of the element.
    Type: Grant
    Filed: July 19, 1983
    Date of Patent: December 18, 1984
    Assignee: Institut Francais du Petrole
    Inventors: Bernard Le Boucher, Andre Sugier
  • Patent number: 4466174
    Abstract: MESFET devices are fabricated on a semiconductor substrate using a LOCOS (localized oxidation of silicon) process twice during the fabrication. The first LOCOS process provides device separation with a self-aligned thick-field oxide (SATO). The second LOCOS provides separation of gate and source/drain regions for each device, and self-aligns the gate contact with the channel implant. Devices fabricated by this method exhibit reduced series resistance, and improved metal step coverage.
    Type: Grant
    Filed: December 28, 1981
    Date of Patent: August 21, 1984
    Assignee: Texas Instruments Incorporated
    Inventors: Henry M. Darley, Theodore W. Houston
  • Patent number: 4446110
    Abstract: Apparatus for treating the surface of articles such as foils, plates or molded articles by electric brush discharge comprises a first electrode for guiding articles to be treated and at least one facing brush electrode having a quartz coating, which can be connected to opposite potential and is arranged to be cooled by a cooling air flow flowing over the outside thereof. Guide means are provided for guiding the cooling air flow at least partly through the corona along the active discharging side of the brush electrode.
    Type: Grant
    Filed: February 25, 1981
    Date of Patent: May 1, 1984
    Inventor: Andreas Ahlbrandt
  • Patent number: 4443255
    Abstract: Method for hard-facing substrates is disclosed using a hard facing material consisting essentially of at least one vanadium carbide. In a particular embodiment of the invention tungsten is present in the hard facing material in solid solution with vanadium carbide.
    Type: Grant
    Filed: November 9, 1981
    Date of Patent: April 17, 1984
    Assignee: Union Carbide Corporation
    Inventors: Harry J. Brown, William D. Forgeng, Charles W. Brown
  • Patent number: 4442180
    Abstract: The invention relates to a sintered body for use in a cutting tool comprising a cutting edge forming part having particularly high hardness and wear resistance bonded to a supporting member having high plastic deformability, stiffness, transverse rupture strength, thermal conductivity, thermal expansion coefficient, resistance to corrosion, oxidization and the like, and to a method for producing the same. A diamond powder or high pressure form boron nitride powder is placed in contact with preliminarily sintered cermet constituted by carbide crystals chiefly comprising molibdenum in the form of (Mo, W)C bonded by iron group metals, the combined body being sintered at a temperature and pressure under which the diamond powder or high pressure form boron nitride powder is thermodynamically stable so that the sintered body of the diamond or high pressure form boron nitride is bonded to the cermet thereby enabling to obtain a sintered body having the said high properties for use in a cutting tool.
    Type: Grant
    Filed: May 8, 1981
    Date of Patent: April 10, 1984
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Akio Hara, Shuji Yazu
  • Patent number: 4439468
    Abstract: A metallic powder having a core of silver and an outer layer of platinum wherein the silver is from about 90 to about 99.5% by weight of the total composition. A process for producing such a powder comprising forming a first aqueous slurry of silver powder, an appropriate amount of lignosulfonate ammonia and water, forming a second slurry of platinum as a platinum-ammonium complex dispersed in a water soluble alkanol, mixing the first and second slurry, adjusting the pH of the mixture to a range of from about 8 to about 10, adding an appropriate amount of hydrazine to the mixture maintaining the resultant slurry at about C. to C. for an appropriate time to coat the platinum onto the silver, then separating the platinum-coated silver powder from the remainder of the slurry.
    Type: Grant
    Filed: August 25, 1982
    Date of Patent: March 27, 1984
    Assignee: GTE Products Corporation
    Inventors: Anthony Liang, Hsiao L. Cheng
  • Patent number: 4439499
    Abstract: The present invention relates to a stratified, corrosion-resistant complex comprising a metal substrate and an outer layer made of a noble material. According to the invention the substrate is composed of an alloy having, by weight at least 45% nickel, at least 7% chromium, and at least 7% molybdenum, all the other components of the substrate representing at most 15% of the alloy.The invention is particularly useful for making the backs of watch cases.
    Type: Grant
    Filed: February 23, 1983
    Date of Patent: March 27, 1984
    Assignee: S. T. Dupont
    Inventor: Michel E. Royer
  • Patent number: 4437888
    Abstract: Alloys comprising titanium and aluminum, or titanium, aluminum and at least one of the metals M, wherein M is vanadium, zirconium, chromium, niobium, tantalum and/or iron, are facilely prepared by reducing an alkali metal fluotitanate, or coreducing admixture of an alkali metal fluotitanate and at least one halide of a metal M, with aluminum, in the presence of an alkali metal oxide reactive flux, either Na.sub.2 O and/or K.sub.2 O; next solubilizing with water the fluorine compounds of reduction/coreduction which are in admixture of reduction/coreduction with dispersion of the aforesaid metals in metallic state; separating said dispersion of metals in metallic state from said admixture of reduction/coreduction; and then alloying by melting and cooling said separated dispersion of metals in metallic state.
    Type: Grant
    Filed: May 5, 1982
    Date of Patent: March 20, 1984
    Assignee: Rhone-Poulenc Specialites Chimiques
    Inventor: Gilbert Jecker
  • Patent number: 4438181
    Abstract: A preformed metallic tape for thermocompression bonding to electronic component chips and a method and apparatus for the use thereof. The tape has etched thereinto a chip bonding site which includes a central, pull-tab region surrounded by a frame region. Intermediate the pull-tab and the frame regions, electrically conductive leads are formed and connected to the pull-tab. Several of the leads are further connected to the frame. The leads are formed with neck regions located respectively between their ends and the pull-tab and frame. One surface of the tape is a bonding surface and the opposite surface is a pressure pad surface. Protruding above the pressure pad surface are a plurality of mushroom-shaped pressure pads located respectively at the ends of leads. The tape is bonded to a chip by first aligning mating electrical contact pads thereof and terminal ends of the leads. The pads are then urged into the tape so that the pressure pads located on the opposite side thereof contact a heated anvil.
    Type: Grant
    Filed: January 13, 1981
    Date of Patent: March 20, 1984
    Assignee: Jon M. Schroeder
    Inventor: Jon M. Schroeder
  • Patent number: 4436696
    Abstract: A process for high temperature sintering of ferrous powder metallurgy compacts having a substantially uniform carbon distribution which comprises:(a) heating the ferrous powder metallurgy compact in the heating zone of a sintering furnace to a temperature of about 2, to 2, F. (1, to 1, C.),(b) introducing to the heating zone an atmosphere comprising about 2 to less than 10 volume percent hydrogen, about 0.5 to 2.0 volume percent carbon monoxide, about 0.5 to 1.0 volume percent methane and the balance nitrogen, and(c) removing the sintered product from the furnace.
    Type: Grant
    Filed: May 20, 1981
    Date of Patent: March 13, 1984
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Daniel M. Buck, Alan T. Sibley, John J. Kaiser
  • Patent number: 4434930
    Abstract: Reinforced structural elements are produced by taking two or more sheets of the same or different malleable metal and applying a pattern of thermally decomposable stop-off material on an interfacial surface, solid phase green bonding the sheets one to another by squeezing them through squeezing rollers and sintering the sheets to improve the metallurgical bond therebetween.The composite can be formed into complex configurations having compound reentrant surfaces and then raised above a predetermined temperature to decompose the stop-off material to generate gas and inflate the sheets contiguous to the pattern.The stop-off material can be chosen to decompose essentially completely at a temperature above the predetermined temperature which facilitates forming prior to inflation or the material can include a portion which decomposes at the sintering temperature of the metallic sheets employed giving a two stage inflation.
    Type: Grant
    Filed: October 15, 1981
    Date of Patent: March 6, 1984
    Assignee: Texas Instruments Incorporated
    Inventors: George Trenkler, Richard G. Delagi
  • Patent number: 4432794
    Abstract: A hard alloy including at least one hard phase and a binary or multicomponent binder metal alloy, in which the hard substance comprises a finely dispersed, homogeneous distribution in the binder metal. The hard phase comprises a carbide of a Group IVb, Vb or VIb transition metal, and the binder metal alloy comprises a solid alloy of a Group IVb, Vb or VIb transition metal, with Re, Ru, Rh, Pd, Os, Ir, or Pt.
    Type: Grant
    Filed: July 17, 1981
    Date of Patent: February 21, 1984
    Assignee: Kernforschungszentrum Karlsruhe GmbH
    Inventor: Helmut Holleck
  • Patent number: 4432132
    Abstract: This invention involves the defining of a submicron feature (21 or 93) in a structure, typically an insulated gate field effect transistor structure (30, 40, or 110). This feature is defined by a sidewall oxide protective masking layer (21 or 71) formed by reactive oxygen ion etching of the structure being built at a time when an exposed surface thereof in the vicinity of the sidewall contains atoms of a material--for example, silicon or aluminum--which combine with the oxygen ions to form the sidewall oxide layer.
    Type: Grant
    Filed: December 7, 1981
    Date of Patent: February 21, 1984
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventors: Eliezer Kinsbron, William T. Lynch
  • Patent number: 4431448
    Abstract: A tungsten-free hard alloy consists of titanium diboride, titanium carbide and a binder. As the binder the tungsten-free hard alloy contains at least one of metals of subgroup IB of the periodic system inactive relative to boron or an alloy based on one of such metals. The components of the tungsten-free hard alloy are present in the following proportions, percent by mass:titanium diboride--40 to 60binder--3 to 30titanium carbide--the balance.The tungsten-free hard alloy of the above-specified composition has a porosity of below 1%.A process for producing a tungsten-free hard alloy comprises preparation of the starting charge by intermixing powders of titanium, boron and carbon, compression of the charge local ignition thereof to initiate the exothermal reaction of titanium with boron and carbon which further proceeds spontaneously under burning conditions being propagated through the charge at the account of the heat transfer from a heated layer of the charge to a cold one.
    Type: Grant
    Filed: October 9, 1981
    Date of Patent: February 14, 1984
    Inventors: Alexandr G. Merzhanov, Inna P. Borovinskaya, Lidia V. Kustova, Fedor I. Dubovitsky
  • Patent number: 4429452
    Abstract: The invention relates to a method of manufacturing field-effect transistors having a self-aligned grid in the submicron range without using a mask of submicron size. The invention is remarkable in that it consists of undercutting the drain electrode at an edge covered with a lacquer over a distance typically smaller than one micron, depositing the source electrode, etching the semiconductor material between the drain electrode and source electrode at the undercut area, and depositing the grid electrode in the cavity thus formed. The invention also relates to field-effect transistors thus obtained.
    Type: Grant
    Filed: December 4, 1981
    Date of Patent: February 7, 1984
    Assignee: U.S. Philips Corporation
    Inventor: Didier Meignant
  • Patent number: 4427626
    Abstract: The method of the invention relates to powder metallurgy and is intended to be used for making cutting tools, dies as well as vital structural members.The method comprises charging a powder into a capsule, sealing the capsule, heating and then extruding the capsule containing the powder. The sealed capsule is heated up to a temperature of to C., whereupon the capsule is depressurized and heated up to a temperature of to C.
    Type: Grant
    Filed: October 9, 1981
    Date of Patent: January 24, 1984
    Inventors: Alexei K. Petrov, Vladimir B. Akimenko, Vladimir N. Zhuchin, Alexei G. Tsipunov, Elena N. Smirnova, Jury N. Skornyakov, Alexandr F. Klimenko
  • Patent number: 4419414
    Abstract: The subject invention involves the design and construction of a tubular cylinder for use with other components and in which the wall of the cylinder is of a composite character made into a unitary structure and provided with a multitude of substantially radial holes in its periphery and a predetermined amount of a cylindrical surface of the wall is preferably cut away to fully open the holes whereby to provide passages through which a material to be processed and under pressure in the cylinder can be forced or extruded outwardly through the passages and thereby condition the material for its intended use.
    Type: Grant
    Filed: July 24, 1981
    Date of Patent: December 6, 1983
    Assignee: Urschel Laboratories, Incorporated
    Inventors: Robert R. Fischer, Joe R. Urschel
  • Patent number: 4419415
    Abstract: A magnetic recording head may be assembled from laminar plates of ferromagnetic material which are welded together by spot welds to form a core stack. The core stack is welded by spot welds (E, F, G) to a base plate (16). The ferromagnetic material is typically an alloy of Si, Al and Fe and tends to produce stress cracks around the areas of the welds. In order to overcome this problem, the edges of the plates, at least around the areas of the welds, and provided with a layer of ductile metal such as Ni, Fe or Mo. The layer is between 5 and 500 .mu.m thick. The depth of the welds is arranged to lie substantially within the ductile metal layer.
    Type: Grant
    Filed: January 18, 1982
    Date of Patent: December 6, 1983
    Assignee: U.S. Philips Corporation
    Inventors: Adrianus C. H. J. Liefkens, Gerardus J. A. M. Notenboom