Patents Examined by J. San Martin
  • Patent number: 11764706
    Abstract: The present application provides a power generator, a suspension, a vehicle, an apparatus and a method for producing a power generator. Among them, the power generator comprises a cylinder body, a moving member, and a piezoelectric conversion unit. The moving member and the cylinder body jointly defines a variable cavity. The piezoelectric conversion unit is located in the variable cavity, and the piezoelectric conversion unit is configured to deform when the moving member is in relative motion with respect to the cylinder body move and changes the size of the variable cavity, for generating electric energy. Due to the fact that the piezoelectric conversion unit is arranged in the variable cavity, the moving member is in relative motion with respect to the cylinder body to make the piezoelectric conversion unit generate electric energy, thus effectively utilizing the energy generated by the target members in the vibration process.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: September 19, 2023
    Assignee: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
    Inventors: Zhichao Wang, Liwen Jiang, Rong Cao, Wumei Fang
  • Patent number: 11751480
    Abstract: An electronic device includes a support substrate, a piezoelectric layer that is provided on the support substrate, a functional element including an electrode provided on a surface of the piezoelectric layer, a metallic frame body that is provided on the support substrate so as to surround the piezoelectric layer and the functional element in a plan view, a metallic lid that is provided on the frame body so as to form a space between the lid and the support substrate, and seals the functional element into the space, and a columnar body that is provided between the support substrate and the lid in the space.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: September 5, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Ryouta Iwabuchi, Motoi Yamauchi, Takashi Miyagawa, Tsutomu Kikuchi, Yuki Maruya
  • Patent number: 11740142
    Abstract: A piezoelectric sensor comprises a support structure, a channel extending through the support structure, a sensing material stack coupled to the support structure and extending over the channel, and a filler material disposed within the channel and over the sensing material stack. The sensing material stack comprises an structural layer, a first electrode layer disposed on the structural layer, a piezoelectric material disposed in a piezoelectric layer on the first electrode, and a second electrode disposed on the piezoelectric layer opposite the first electrode layer.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: August 29, 2023
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Wei-Yan Shih
  • Patent number: 11730060
    Abstract: A piezoelectric actuator that includes a multilayer body, a low-potential outer electrode, and a high-potential outer electrode. The multilayer body includes multiple alternately stacked piezoelectric ceramic layers and planar electrodes. The planar electrodes include low-potential planar electrodes electrically connected to the low-potential outer electrode and high-potential planar electrodes electrically connected to the high-potential outer electrode. The planar electrode positioned most outwardly on the side of a first main surface of the multilayer body is a low-potential planar electrode. The inner surface of this low-potential planar electrode contacts the ? side of polarization in an active region, and the outer surface of this low-potential planar electrode is exposed on an outside of the multilayer body. On the side of a second main surface of the multilayer body, a high-potential planar electrode is not exposed on the outside of the multilayer body.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: August 15, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshiyuki Yamakawa, Seishiro Goto, Shinichiro Kawada, Shigetoshi Hayashi, Akio Fujita, Yusuke Nakamura
  • Patent number: 11723277
    Abstract: An energy harvesting device for powering electronic devices such as wireless sensors and IoT devices is described. The device relies on nature's fundamental forces to convert kinetic energy to electrical energy, acting as power source; while accounting for the Casimir force. Nanotechnology and MEMS are used to fabricate the device embedding a mechanical oscillator, electronic circuitry, energy harvester, and transducer integrated in the same packaging. The device supports mechanism to excite and ignite the oscillatory behavior via RF signal from a remote signal source that synthesizes the RF signal on a fix or mobile platform. Additionally, solar and RF signals may be added constructively to boost the output power of the device. The device scales from micron size to blades and racks formed from arrays of the connected devices to increase the output power of the aggregate system to any desired level for powering home appliances or computer networks.
    Type: Grant
    Filed: March 20, 2022
    Date of Patent: August 8, 2023
    Inventor: Ramin Sadr
  • Patent number: 11716069
    Abstract: A device includes a die and an interdigital transducer on the die. The interdigital transducer includes a first bus bar, a second bus bar, and a number of electrode fingers. The first bus bar is parallel to the second bus bar. The electrode fingers are divided into a first set of electrode fingers and a second set of electrode fingers. The first set of electrode fingers extend obliquely from the first bus bar towards the second bus bar. The second set of electrode fingers extend obliquely from the second bus bar towards the first bus bar, and are parallel to and interleaved with the first set of electrode fingers. By providing the electrode fingers oblique to the bus bars, spurious transverse modes may be suppressed while maintaining the quality factor, electromechanical coupling coefficient, and capacitance of the device.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: August 1, 2023
    Assignee: Qorvo US, Inc.
    Inventors: Shogo Inoue, Marc Solal
  • Patent number: 11712222
    Abstract: An imaging device includes a two dimensional array of piezoelectric elements. Each piezoelectric element includes: a piezoelectric layer; a bottom electrode disposed on a bottom side of the piezoelectric layer and configured to receive a transmit signal during a transmit mode and develop an electrical charge during a receive mode; and a first top electrode disposed on a top side of the piezoelectric layer; and a first conductor, wherein the first top electrodes of a portion of the piezoelectric elements in a first column of the two dimensional array are electrically coupled to the first conductor.
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: August 1, 2023
    Assignee: EXO IMAGING, INC.
    Inventors: Yusuf Haque, Sandeep Akkaraju, Janusz Bryzek, Brian Bircumshaw
  • Patent number: 11716908
    Abstract: Cost effective connectors of high bending stiffness for making high-performance piezoelectric actuators and derivative devices are disclosed. In one embodiment, the connector has circumferentially alternating recesses of circular cross-section which can be cost-effectively machined out with conventional machining techniques. The circular recesses can be adopted to house circular or non-circular cross-sectioned piezoelectric active elements to make cost effective 2-level (2×) piezoelectric displacement actuators. In another embodiment, the non-circular cross-sectioned recesses in the connector include suitable wall openings to enable said recesses to be machined out cost effectively via conventional machining techniques, or via reduced use of non-conventional machining techniques. Additional stiffening mechanisms can be added to minimize the bending displacement of the base of recesses when desired.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: August 1, 2023
    Assignee: MICROFINE MATERIALS TECHNOLOGIES PTE LTD
    Inventors: Leong Chew Lim, Yu Huang, Yuexue Xia, Dian-Hua Lin
  • Patent number: 11711981
    Abstract: A piezoelectric actuator is disclosed that may include a insulating layer, individual electrodes, a common electrode, and a piezoelectric layer. The common electrode may include divisional electrodes that are connected with one another. The individual electrodes may be disposed between the insulating layer and the piezoelectric layer while the piezoelectric layer may be disposed between the individual electrodes and the common electrode. Further, the divisional electrodes may be configured to face the individual electrodes.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: July 25, 2023
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Hiroto Sugahara, Kazuo Kobayashi
  • Patent number: 11711066
    Abstract: The invention relates to a method for manufacturing an electroacoustic resonator comprising the steps of: Providing a first substrate having a first side and an opposite second side; depositing a diamond layer having a first side and an opposite second side on said first substrate, wherein the second side of the diamond layer is in contact with said first side of the first substrate; removing the first substrate; forming a piezoelectric layer on the second side of the diamond layer; applying a second substrate to the first side of the diamond layer.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: July 25, 2023
    Assignee: Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
    Inventor: Vadim Lebedev
  • Patent number: 11706991
    Abstract: An electronic device includes a support substrate, a piezoelectric layer that is provided on the support substrate, a functional element including an electrode provided on a surface of the piezoelectric layer, a metallic frame body that is provided on the support substrate so as to surround the piezoelectric layer and the functional element in a plan view, a metallic lid that is provided on the frame body so as to form a space between the lid and the support substrate, and seals the functional element into the space, and a columnar body that is provided between the support substrate and the lid in the space.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: July 18, 2023
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Ryouta Iwabuchi, Motoi Yamauchi, Takashi Miyagawa, Tsutomu Kikuchi, Yuki Maruya
  • Patent number: 11701689
    Abstract: There are provided an ultrasonic transducer and methods for designing and manufacturing the same. The ultrasonic transducer includes a piezoelectric composite layer configured to be in acoustic communication with a sample and having at least partially decoupled acoustic impedance and electrical impedance properties. The piezoelectric composite layer includes an array of spaced-apart piezoelectric regions, each being made from a piezoelectric material, a filler material positioned between adjacent spaced-apart piezoelectric regions, the filler material comprising a polymer matrix and a non-piezoelectric material in contact with the polymer matrix.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: July 18, 2023
    Assignee: RESONANT ACOUSTICS INTERNATIONAL INC.
    Inventors: Nicholas Chris Chaggares, Eric M. Rieder, Khachic Karshafian
  • Patent number: 11701688
    Abstract: Various methods and systems are provided for a multi-frequency transducer array. In one example, the transducer array is fabricated by forming an interdigitated structure from a first comb structure with a first sub-element and a second comb structure with a second sub-element. The interdigitated structure is coupled to a base package, a matching layer, and a backing layer to form a plurality of multi-frequency transducers.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: July 18, 2023
    Assignee: GE Precision Healthcare LLC
    Inventors: Edouard Dacruz, Flavien Daloz, Jason Barrett
  • Patent number: 11699985
    Abstract: A ceramic substrate is formed of polycrystalline ceramic and has a supporting main surface. At the supporting main surface of the ceramic substrate, the mean of grain sizes of the polycrystalline ceramic is 15 ?m or more and less than 40 ?m and the standard deviation of the grain sizes is less than 1.5 times the mean.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: July 11, 2023
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Keiichirou Geshi, Masato Hasegawa, Shigeru Nakayama
  • Patent number: 11695389
    Abstract: An acoustic wave device includes an element substrate having piezoelectricity, a functional electrode on a first main surface of the element substrate, an extended wiring line electrically connected to the functional electrode and extending from the first main surface to a side surface of the element substrate, an external terminal electrically connected to the extended wiring line and on a second main surface of the element substrate, a first resin portion to seal the acoustic wave device, and a second resin portion at least between the extended wiring line on the side surface and the first resin portion. The second resin portion has a lower Young's modulus than the first resin portion.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: July 4, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Katsuya Matsumoto, Yasuyuki Ida
  • Patent number: 11690297
    Abstract: A vibration device includes a substrate having a first surface and a second surface at an opposite side to the first surface, a vibration element disposed on the first surface, a first through electrode which penetrates the substrate, and is configured to electrically couple the power supply interconnection disposed on the second surface and the first circuit block disposed on the first surface, and a second through electrode which penetrates the substrate, and is configured to electrically couple the power supply interconnection and the second circuit block including an analog circuit disposed on the first circuit, wherein R1>R4 and R2>R4, in which R1 is an electric resistance of the first through electrode, R2 is an electric resistance of the second through electrode, and R4 is an electric resistance of a zone of the power supply interconnection coupling the first through electrode and the second through electrode.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: June 27, 2023
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Koichi Mizugaki
  • Patent number: 11662204
    Abstract: A vibrator device includes a vibrating body having a first surface, a package having a second surface opposed to the first surface of the vibrating body, a circuit board provided to the package so as to be opposed to the first surface of the vibrating body, a plurality of coupling electrodes provided to the first surface of the vibrating body, a first coupling line provided to the second surface of the package, a second coupling line provided to the circuit board, and a bonding material electrically coupling the coupling electrode and the first coupling line to each other, wherein the vibrating body has a protrusion protruding toward the package farther than the coupling electrode at the first surface side, and the protrusion has contact with the second surface of the package.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: May 30, 2023
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Seiichiro Ogura, Keiichi Yamaguchi, Ryuta Nishizawa
  • Patent number: 11664758
    Abstract: This invention comprises a panel or system of panels. Each panel comprises a top layer, which is comprised of tempered glass that is highly transparent to allow for maximum light wave transmission. These solar light waves are captured by the photovoltaic cell which comprises the second layer of the panel where this solar energy is converted into usable electrical energy. Vibrations experienced by the photopiezoelectric panel due to foot and lightweight vehicle traffic are absorbed by the PZT sheet layer, which is the third layer of the panel where they are converted into usable electrical energy. The fourth and final layer of the panel consists of the connector plate which serves as the hub and interconnection for gathering the generated electrical energies and transmitting them into the modular grid network to be consumed by various load devices, such as streetlights and other power-dependent city infrastructure.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: May 30, 2023
    Assignee: University of Louisiana at Lafayette
    Inventors: Mohammad R. Madani, Michael S. Davis
  • Patent number: 11654290
    Abstract: This module comprises: a circuit for interfacing with the piezoelectric beam of an oscillating pendular unit, outputting a rectified signal comprising a sequence of pulses at a frequency equal to a multiple of the oscillation frequency of the pendular unit; a buffer capacitor charged by the successive pulses outputted by the interface circuit; and a converter regulator adapted to convert a capacitor discharge current into a stabilized power supply voltage, and controlled by a feedback control stage of the Maximum Power-Point Tracking (MPPT) type. A comparator detects the conduction of a blocking diode interposed between the interface circuit and the capacitor, in order to produce a signal representative of the current value of the duty cycle of the detected conduction and non-conduction periods.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: May 23, 2023
    Assignee: CAIRDAC
    Inventors: Alaa Makdissi, An Nguyen-Dinh
  • Patent number: 11648585
    Abstract: In a vibration unit, a first electrode of a sensor circuit of a control unit is electrically connected to a first external electrode of a first piezoelectric element, a second electrode of the sensor circuit is electrically connected to a second external electrode of the first piezoelectric element, a first electrode of a drive circuit is electrically connected to a first external electrode of a second piezoelectric element, and a second electrode of the drive circuit is electrically connected to a second external electrode of the second piezoelectric element. Only a relatively small voltage induced by an electromotive force occurring due to the flexure of the first piezoelectric element is applied to the sensor circuit. In addition, only a relatively large drive voltage to be applied to the second piezoelectric element is applied to the drive circuit.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: May 16, 2023
    Assignee: TDK CORPORATION
    Inventors: Takuto Horii, Atsushi Ezawa