Abstract: A circuit assembly is provided which makes efficient us of space provided on a main board having a CPU and a supporting board which is designed to have a network interface chip (NIC). The circuit assembly further has a cooling plate situated between the two boards, which is optimized to provide efficient cooling operations. The circuit assembly is part of a blade, which includes a housing to contain and support all necessary components. The space within the blade housing is efficiently used, so that processing, communication and cooling operations are all optimized.

Abstract: An activatable thermal fuse includes a first electrical terminal, a second electrical terminal, and an electrically conductive bridge element having a first electric contact with the first electrical terminal and a second electric contact with the second electrical terminal. At least a part of the bridge element is displaceable from a first position in which the first contact is established to a second position in which the first contact is opened, and a thermally sensitive member releases the part when exposed to a predetermined temperature value. An activating element blocks displacement of the part from the first position, in a first position of the activating element, and enables the displacement of the part in a second position of the activating element. A method of manufacturing a printed circuit board, a method of monitoring, and an electronic circuit including the thermal fuse are also provided.

Abstract: A disconnect assembly includes a solid frame comprising a slit and a first liquid coolant circuit leading to a frame outlet defined in an inner wall of the slit. The assembly further includes an insert element, insertable in the slit so as to reach a sealing position. The latter defines a shut state, in which the insert element seals the frame outlet. The assembly includes a cold plate, comprising a second liquid coolant circuit with a duct open on a side of the cold plate. The cold plate can be inserted in the slit, so as to push the insert element, for the latter to leave the sealing position and the cold plate to reach a fluid communication position. This position defines an open state, in which the duct is vis-à-vis the frame outlet, to enable fluid communication between the first liquid coolant circuit and the second liquid coolant circuit.

Abstract: An electronic module comprising a first electronic unit 51 which has a first insulating substrate 61 and a first electronic element 41 provided on the first insulating substrate 61 via a first conductor layer 21, a second electronic unit 52 which has a second insulating substrate 62 and a second electronic element 42 provided on the second insulating substrate 62 via a second conductor layer 22, a connecting body 29 provided between the first electronic unit 51 and the second electronic unit 52 and a coil 70 wound around the connecting body 29.

Abstract: The present disclosure relates to extremely high frequency (“EHF”) systems and methods for the use thereof, and more particularly to board-to-board connections using contactless connectors.

Abstract: Heat-removal assemblies with springs on opposing sides of a support structure and methods for using the same are provided. Heat may be removed from a heat-generating assembly of an electronic device by a heat-removal assembly that may include a heat-dissipating subassembly (e.g., a heat spreader and/or a heat pipe) and a fastener subassembly. The fastener subassembly may be configured to press the heat-dissipating subassembly against the heat-generating assembly for enabling the heat-dissipating subassembly to be thermally coupled to the heat-generating assembly for removing heat therefrom. In order for the fastener subassembly to provide an even pressure distribution across the heat-dissipating subassembly for such heat removal and/or to limit deformation of one or more portions of the electronic device during such heat removal, the fastener subassembly may include two springs positioned on opposite sides of a circuit board that may be supporting the heat-generating assembly.

Abstract: Systems and apparatus are provided for thermal cooling of integrated circuits, such as dual in-line memory modules (DIMMs). The apparatus includes a plurality of rows pieces that include individual leaf springs. Each of the leaf springs can exert compression to support thermal contact and a stable coupling with a received DIMM. The plurality of row pieces can be assembled to form a single structure, having a space to receive an individual DIMM for insertion. Further, each of the leaf springs are structured to allow a portion of its surface, having a conductive material disposed thereon, to support transfer of heat away from the DIMM at a point of thermal contact. The apparatus can be coupled to a printed circuit assembly (PCA) having additional cooling mechanisms installed thereon, in a manner that allows the additional cooling mechanisms to be integrated with the apparatus and provide increased thermal cooling for the DIMMs.

Abstract: Embodiments herein relate to multi-phase cooling of electronic equipment such as processors and voltage regulators in a rack computing system. In various embodiments, a cooling device may include a heat exchanger, an inlet manifold, an outlet manifold, one or more fluid conductors coupled with the heat exchange, the inlet manifold, and the outlet manifold to carry a two-phase fluid from the outlet manifold to the inlet manifold through the heat exchanger, and one or more fans to generate a flow of air against the heat exchanger. In some embodiments, the heat exchanger may be arranged in an inverted-V or an inverted-W configuration with respect to the fans. In embodiments, the cooling device may be disposed in a rack module. Other embodiments may be described and/or claimed.

Abstract: A temperature-dependent switch has a housing with a cover part having a lower side and an upper side and with an electrically conductive lower part having a circumferential shoulder and a circumferential wall with an upper section that overlaps the cover part. The switch has a first external contact surface on the upper side of the cover part and a second external contact surface externally on the housing, wherein the upper section of the circumferential wall presses the cover part onto the circumferential shoulder. A temperature-dependent switching mechanism is arranged in the housing and, depending on its temperature, establishes or opens an electrically conductive connection between the first and second external contact surfaces. A circumferential cutting burr is arranged on the shoulder in the lower part.

Abstract: A phased array antenna in which a plurality of blocks each having a plurality of transmitter modules are arrayed, includes: a front plate that includes a plurality of flow paths of a refrigerant therein; and an element feeding layer that includes a plurality of antenna elements respectively connected to the transmitter modules and that is placed in close contact with one surface of the front plate. Each of the blocks includes a heat spreader that is placed in close contact with the other surface of the front plate. The transmitter modules are mounted on the heat spreader. Heat generated in the transmitter modules is transferred to the refrigerant via the heat spreader and the front plate.

Abstract: A removable immersion cooling infrastructure module can have a form factor equivalent to that of one or more of the computing devices being cooled by immersion cooling, thereby enabling the immersion cooling infrastructure module to be installed and removed in the same simplified and efficient manner. Moreover, the quantity of immersion cooling infrastructure modules can be varied depending on need, since the immersion cooling infrastructure modules and computing devices can be interchangeable within the openings designed to house the computing devices. An immersion cooling infrastructure module can comprise a filter, a pump that can circulate the immersion cooling liquid through the filter, a power supply and a controller, with the module receiving power, and, optionally, communications and other like connectivity, from the same source as the computing devices.

Abstract: A compact fusible disconnect switch device having a reduced switch housing size and increased power density is configured to be face mounted to a panel. A fuse cover assembly allows installation and removal of a fuse without having to open the panel. Line-side and load-side terminals are provided on a common side of the housing. In-line mechanical ganging and simultaneous application is provided for combinations of the compact fusible disconnect switch devices.

Abstract: An example cooling system is described herein. The cooling system can include a first cold plate including a first heat pipe to couple to a side of a dual in-line memory module (DIMM) where the first heat pipe transfers heat from the DIMM to the first cold plate; and a second cold plate including a second heat pipe to couple to the side of the DIMM, where the second heat pipe transfers heat from the DIMM to the second cold plate.

Abstract: An electronic device of the present invention comprises: an exterior housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a display of which at least a part is exposed through the first surface; and a polymer plate which forms at least a part of the second surface of the housing. The polymer plate comprises: at least one opaque layer; at least one polymer layer that is translucent or transparent and is disposed on the at least one opaque layer; and a coating layer that is disposed on the at least one polymer layer and has a hardness greater than or equal to a selected hardness. Each of the at least one opaque layer, the at least one polymer layer, and the coating layer may comprise a first surface, and a second surface extending from the first surface so that at least a part thereof is bent. Other embodiments are also possible.

Abstract: A device includes a thermally deformable assembly accommodated in a cavity of the interconnection part of an integrated circuit. The assembly can bend when there is a variation in temperature, so that its free end zone is displaced vertically. The assembly can be formed in the back end of line of the integrated circuit.

Abstract: A thermal limiter system for an electric motor includes a thermal limiter fuse having a hollow contact element anchored by solder to at least one of first and second terminals of the fuse. A coaxial spring element causes the hollow contact element to slidably release and separate from one of the first and second terminals due to overheating of the solder that is not caused by a flow of electrical current. The system also includes stator mounting blocks and a stator cooling jacket for a motor to be thermally protected.

Abstract: A rollable display device includes a display panel, a roller, a heat-dissipating member, a source circuit board, and a control circuit board. The display panel has the flexible characteristic. The roller winds or unwinds the display panel. The heat-dissipating member is coupled with the display panel to be received inside the roller. The source circuit board is electrically connected to the display panel, and the source circuit board is disposed on the heat-dissipating member to be received inside the roller. The control circuit board is electrically connected to the source circuit board to provide a control signal to the source circuit board side, and the control circuit board is disposed on the heat-dissipating member to be received inside the roller.

Abstract: An electrical feed-through, such as a PCB connector, involves at least one positioning protrusion protruding from a main body, and may further include multiple positioning protrusions protruding in respective directions from the main body. A data storage device employing such a feed-through comprises an enclosure base with which the feed-through is coupled, where the base comprises an annular recessed surface surrounding an aperture that is encompassed by the feed-through and is at a first level, and at least one recessed positioning surface at a higher level than the first level and extending in a direction away from the annular recessed surface. The positioning protrusion of the electrical feed-through physically mates with the recessed positioning surface of the base, such that the position of the feed-through is vertically constrained by the recessed positioning surface.

Abstract: A cooling module including a module panel comprising a bottom panel with top and bottom surfaces and a set of sidewalls coupled to the entire perimeter of the bottom panel. The bottom panel has openings to receive liquid cooling elements. The liquid cooling elements are inserted into the openings; each has an inlet and an outlet and is positioned so that there is a gap between the edges of the cooling element and the edges of the opening. The inlets and outlets are positioned on the side of the cooling element above the top surface of the bottom panel. A flexible deviation buffer is positioned in each gap and is coupled to the liquid cooling element and to the opening. The deviation buffer allows motion of the cooling element relative to the bottom panel while sealing the gap to prevent liquid from flowing through. The cooling module can improve liquid cooling reliability through quick leakage identification, leakage impact minimization, and segregation of liquid and electronics.

Abstract: A removeable drive-plane board may include (1) keyhole openings that are configured to interlock with keyhole fasteners of a retaining member of a storage-system chassis, (2) storage-drive connectors, (3) a storage-system module connector, and (4) electrical interconnects that electrically couple the storage-drive connectors to the storage-system module connector. In some examples, the keyhole fasteners of the retaining member may be oriented downward relative to the storage-system chassis. Various other removeable drive-plane apparatus, systems, and methods are also disclosed.